Press Releases 25 to 30 of 1192
29.04.2021 10:15 New EasyDUAL™ CoolSiC™ MOSFET power modules with high-performance ceramic enable increased power density and more compact designs
Munich, Germany – 29 April 2021 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has upgraded the EasyDUAL™ CoolSiC™ MOSFET modules with a new aluminum nitride (AIN) ceramic. The devices come in half-bridge configuration with an on-state resistance (RDS(on)) of 11 mΩ in an EasyDUAL 1B package and 6 mΩ in an EasyDUAL 2B package. With high-performance ceramic, the 1200 V devices are suitable for high-power density applications including solar systems, uninterruptible power supplies, auxiliary inverters, energy storage systems and electric vehicle chargers.
28.04.2021 10:15 EasyPACK™ CoolSiC™ MOSFET module supports fast-switching DC-link voltage of 1500 V for solar systems and ESS applications
Munich, Germany – 28 April 2021 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has launched a new EasyPACK™ 2B module in the company’s 1200 V family. The module comes in 3-level Active NPC (ANPC) topology and integrates CoolSiC™ MOSFETs, TRENCHSTOP™ IGBT7 devices, and an NTC temperature sensor along with PressFIT contact technology pins. The power module is suitable for fast-switching applications like energy storage systems (ESS). The module also increases the power rating and efficiency of solar systems and supports the growing demand for 1500 V DC-link solar applications.
22.04.2021 13:15 EiceDRIVER™ X3 Enhanced and X3 Compact: Highly flexible and easy-to-design-in gate driver families now with reinforced isolation
Munich, Germany – 22 April 2021 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has expanded its easy-to-design EiceDRIVER™ X3 Compact (1ED31xx) and the highly flexible EiceDRIVER X3 Enhanced Analog (1ED34xx) and Digital (1ED38xx) gate driver families. Both families now offer variants with superior reinforced isolation for higher application safety and long operating life. The new family members are VDE 0884-11 certified. With 8 mm wide-body packages, both families are suitable for applications with demanding isolation requirements including industrial drives, solar systems, uninterruptible power supplies, EV charging and other industrial applications.
21.04.2021 12:15 Infineon’s new reference boards enable efficient control of rotary fridge compressor drives
Munich, Germany – 21 April 2021 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces two new reference boards designed for rotary refrigerator compressors supporting Infineon’s motto “From product thinking to system understanding.” Both boards are turnkey solutions for low power compressors that can be easily copied by customers to build final mass-production application boards. Since the design of the reference boards is system tested developers can drastically reduce their own system development time.
20.04.2021 10:15 Digital booth and livestreams with focus on energy-efficient designs: Infineon is inviting to the Virtual Power Conference
Munich, Germany – 20 April 2021 – Power semiconductors are the key to an energy-efficient world. New technologies such as silicon carbide (SiC) and gallium nitride (GaN) enable higher power efficiency, smaller form factors and lower weight. Silicon also plays a major role in many designs. Energy efficiency is the focus of the “Virtual Power Conference,” which will be available ‘live’ from May 4 to 6, 2021. As a leading supplier of power semiconductors, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) will use the exclusive digital platform to present technologies and systems that generate energy more efficiently, transmit and distribute with lower losses, and showcase a wide range of energy-efficient applications – from industrial applications and data centers to electric vehicles and smart buildings.
16.04.2021 10:15 Infineon introduces industry’s first AEC-Q103 qualified high-performance XENSIV™ MEMS microphone for automotive applications
Munich, Germany – 16 April 2021 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the launch of the XENSIV™ IM67D130A. This new device combines the Company’s expertise in the automotive industry with its technical leadership in high-end MEMS microphones to address the need for high performance, low-noise MEMS microphones for automotive applications. The XENSIV™ IM67D130A is the first microphone in the market to be qualified for automotive applications, which will help simplify the design-in efforts for the industry and reduce the risk of qualification fails.
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