Press Releases 25 to 30 of 1214
15.07.2021 14:45 Infineon and IDEX Biometrics announce a platform for biometric smart cards with superior performance and scalable, cost-effective manufacturability
Munich, Germany and Oslo, Norway – 15 July 2021 – Convenient Security: A research report by ABI Research* projects the market for biometric payment cards to be reaching 353 million pieces per year by 2025 globally as an optimistic scenario. Allowing card manufacturers to address this new growing market segment, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), the global leader in smart card payment solutions, and IDEX Biometrics ASA (OSE: IDEX / NASDAQ: IDBA), the leading provider of advanced fingerprint identification and authentication solutions, today announced a reference design for the next generation biometric smart card architecture.
01.07.2021 09:00 Andre Tauber to become Head of Media Relations at Infineon
Munich – 1 July 2021 – Andre Tauber (44) is taking over as Head of Corporate Media Relations at Infineon Technologies AG from 7 July 2021. He reports to Susanne Kochs, who heads the Corporate Communications department.
30.06.2021 13:45 TRENCHSTOP™ 5 WR6 family in TO-247-3-HCC housing improves isolation voltage rating and thus the system reliability
Munich, Germany – 30 June 2021 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the new 650 V TRENCHSTOP™ 5 WR6 family in a discrete housing. The family comes in a TO-247-3-HCC package and offers a broad portfolio comprising 20 A, 30 A, 40 A, 50 A, 60 A and 70 A current ratings. The devices can easily be used for replacing previous technologies like Infineon’s TRENCHSTOP 5 WR5 and HighSpeed 3 H3 as well as competitor technologies. The family is optimized for power factor correction (PFC) for residential and commercial air conditioning systems as well as welding applications.
28.06.2021 10:00 High tech meets design: screenless wristband enables communication and contactless payment with innovative biometrics
Munich, Germany – 28 June 2021 – The IoT (Internet of Things) building blocks from Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) are becoming ever more powerful, energy-efficient, and smaller. Today, practically any everyday object can be enriched with smart functions to make life easier. Using system solutions from Infineon, Deed®, a deep tech start-up from Turin, Italy, has been able to create a screenless yet feature-rich wearable: The sleek and elegant get® bracelet interprets human gestures and uses biometric data, to pick up a call or to make payments.
24.06.2021 08:15 XENSIV™ 60 GHz radar sensors and AURIX™ microcontrollers enable ultra-short range automotive applications
Munich, Germany – 24 June 2021 – In-cabin monitoring systems (ICMS) are reshaping the concept of passenger safety in cars. Various applications such as left-behind child detection, driver well-being or occupancy sensing increase road safety and the protection in vehicles. Radar in particular is a promising technology to address these applications due to its ability to detect micro-motions and vital signs. With XENSIV™ BGT60ATR24C AEC-Q100 radar sensors, AURIX™ microcontrollers and OPTIREG™ PMICs, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) offers a wide variety of products for an ultra-wideband, ultra-low power and cost-performance scalable architecture for ICMS sub-systems. The devices support the use of new signal processing techniques enabling robustness and a good compromise between computational costs, the degree of information as well as the power consumption of the system.
23.06.2021 14:50 Infineon and pmdtechnologies partner with ArcSoft for under-display Time-of-Flight turnkey solution
Munich, Germany – 23 June 2021 – The latest phone designs focus on solutions that allow a full-screen display and avoid the notch, punch-hole cameras, or bezels without compromising on quality or performance. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) together with its Time-of-Flight (ToF) partner pmdtechnologies and the leading vision-based imaging specialist ArcSoft is developing a turnkey solution that allows a ToF camera to work under the display of commercial smartphones. It will provide reliable high-quality infrared images and 3D data for security-related applications like face authentication and mobile payment. The market for ToF solutions in smartphones is estimated to reach above 600 million sensor units in 2025 with a CAGR of around 32 percent from 2021 onward*. The new under-display solution will be available in the third quarter of 2021 and will be introduced during the MWC 2021 conference from June 28 to July 1.  
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