Press Releases 25 to 30 of 1505
23.10.2023 14:15 TRAVEO™ T2G Cluster graphics MCU family delivering MPU like performance at MCU cost for automotive graphic applications
Munich, Germany – 23 October, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced its new TRAVEO™ T2G Cluster family of automotive microcontrollers (MCU) with a new graphic engine. The engine features a new smart rendering technology and delivers outstanding performance for automotive graphics applications. With a small footprint, the new MCUs simplify OEM integration and reduce BOM costs, making them an ideal solution for advanced smart mobility instrument cluster and heads-up display systems for automobiles, motorcycles, and off highway mobility as well as for industrial and medical applications where quality and safety are important.
23.10.2023 10:25 Infineon opens laboratory for quantum electronics and Power AI
Infineon Technologies AG has opened a new laboratory for the development of quantum electronics in Oberhaching near Munich. The objective is to develop and test microelectronic circuits for quantum computers which will be stable and small, will operate reliably and which can be produced on an industrial scale. Approximately twenty researchers will work at the lab. In addition to quantum computing, activities will also focus on the development of AI algorithms for the early detection of variances in power systems.
20.10.2023 14:45 STIWA presents smart lock solution SMALOX based on Infineon's battery-less NFC lock technology at the Parcel and Post Fair in Amsterdam
Munich, Germany and Attnang-Puchheim, Austria – 20 October, 2023 – STIWA Group, a leader in automation and manufacturing technology, will present its smart lock solution SMALOX at the Parcel and Post Fair in Amsterdam, Netherlands. The smart lock is designed to meet the diverse needs and challenges of the rapidly evolving parcel and postal services market. It offers a versatile and innovative solution for various applications, including home boxes, click and collect boxes, and key boxes. SMALOX makes use of the near field communication (NFC) technology developed by Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY).
19.10.2023 15:15 Infineon joins the EMVCo Board of Advisors to advance mission of increasing trust and consumer convenience in the payment space
Munich, Germany – 19 October, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has joined the EMVCo Board of Advisors to leverage its decades of experience in the space of semiconductor security and connectivity to improve global trust and convenience in card payments. EMVCo, a global technical body, creates and manages EMV specifications and programs that enable seamless and secure card-based payments for businesses and consumers worldwide. The organization is responsible for authentication specifications and security technologies such as EMV® Chip Contact, EMV 3-D Secure (3DS), and more.
19.10.2023 09:00 Elke Reichart takes over responsibility for Digital Transformation on the Infineon Management Board
Munich, Germany – 19 October, 2023 – The Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) Supervisory Board has appointed Elke Reichart to the Management Board effective November 1, 2023. As Chief Digital Transformation Officer (CDTO), she succeeds Constanze Hufenbecher, who has decided not to renew her expiring contract. As CDTO, Elke Reichart will among other things be responsible for group-wide digitalization projects, IT infrastructure and Infineon's sustainability strategy.
18.10.2023 08:00 Hyundai Motor Company, Kia Corporation and Infineon sign multi-year supply agreement for power semiconductors
Munich, Germany – 18 October 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Hyundai Motor Company and Kia Corporation have signed a multi-year supply agreement for silicon carbide (SiC) and silicon (Si) power semiconductors. Infineon will build and reserve manufacturing capacity to supply SiC as well as Si power modules and chips to Hyundai/Kia until 2030. Hyundai/Kia will support the capacity build-up and capacity reservation with financial contributions.
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