» The latest Press Release
Infineon Technologies (26.02.2024 16:00)
Infineon unveils high density power modules to enable benchmark performance and TCO for AI data centers

Munich, Germany, Long Beach, California – 26 February 2024 – Artificial Intelligence is currently driving an exponential increase in global data generation, and consequently increasing the energy demands of the chips supporting this data growth. Today, Infineon Technologies AG launched its TDM2254xD series dual-phase power modules that enable best-in-class power density, quality and total cost of ownership (TCO) for AI data centers. The TDM2254xD series products blend innovation in robust OptiMOSTM MOSFET technology with novel packaging and proprietary magnetic structure to deliver industry-leading electrical and thermal performance with robust mechanical design. This lets data centers operate at higher efficiency to meet the high power demands of AI GPU (Graphic Processor Unit) platforms while also significantly reducing TCO.
» More Press Releases
» Infineon Technologies (26.02.2024 08:45)
Infineon to start limited Share Buyback Program serving fulfillment of obligations under existing employee participation programs
» Infineon Technologies (23.02.2024 15:50)
Infineon Annual General Meeting approves dividend of €0.35 per share – Changes to the Supervisory Board: Ute Wolf and Prof. Dr. Hermann Eul elected to the Supervisory Board
» Infineon Technologies (23.02.2024 09:45)
Infineon: Virtual Annual General Meeting 2024
» Infineon Technologies (22.02.2024 09:30)
Infineon sells manufacturing sites in Cavite, Philippines and Cheonan, South Korea to ASE, strengthening the strategic partnership of the two companies
» ROHM Semiconductor (21.02.2024 14:00)
New Thermal Printhead Provides Clear Printing at High Speeds Even on a Single-Cell Li-ion Battery
» Infineon Technologies (21.02.2024 10:15)
Infineon introduces the OPTIGA™ Trust M MTR, making it easy to add Matter and security to smart home devices
» Infineon Technologies (20.02.2024 11:40)
Infineon places €500 million bond with a maturity of three years
» IAR (20.02.2024 10:00)
IAR unveils the latest Functional Safety version of IAR Embedded Workbench for Arm equipped with certified static analysis capabilities
» Inova Semiconductors (19.02.2024 11:00)
Inova Semiconductors Supplies New APIX3® SerDes Products with DisplayPort™ Multi-stream Video Interface and Support for up to 4 Daisy-chained Displays.
» Westermo (19.02.2024 10:00)
Westermo to provide lifecycle services for industrial data networks
 
 
 
» Show all Press Releases of:
» Alps Alpine Europe
» Eisele
» HighTec
» IAR
» Infineon Technologies
» Inova Semiconductors
» Pfaff-silberblau
  (Columbus McKinnon)
» Provertha
» Razorcat
» ROHM Semiconductor
» TASKING
» TE Connectivity
» Vector
» Westermo
» News by E-mail
Subscribe to our press
newsletter service for free
» News by RSS-Feed
Subscribe to the RSS-Feed
without any registration