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ROHM Semiconductor (10.07.2025 14:00)
ROHM Releases New Level 3 SPICE Models Featuring Enhanced Simulation Speed

The models can be downloaded from the Models & Tools section on individual 4th Generation SiC MOSFET product pages Willich-Münchheide, Germany, July 10, 2025 – ROHM has announced the release of new Level 3 (L3) SPICE models that deliver significantly improved convergence and faster simulation performance.
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» ROHM Semiconductor (08.07.2025 14:00)
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» IAR (08.07.2025 10:00)
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» Infineon Technologies (07.07.2025 09:30)
Infineon’s Supervisory Board appoints Alexander Gorski Chief Operations Officer
» ams OSRAM (03.07.2025 21:00)
ams OSRAM successfully extends Revolving Credit Facility (RCF) until September 2027
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Infineon advances on 300-millimeter GaN manufacturing roadmap as leading Integrated Device Manufacturer (IDM)
» Infineon Technologies (02.07.2025 12:15)
Infineon receives Business Partner Award from DENSO
 

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