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Infineon Technologies (26.02.2024 16:00)
Infineon unveils high density power modules to enable benchmark performance and TCO for AI data centers

Munich, Germany, Long Beach, California – 26 February 2024 – Artificial Intelligence is currently driving an exponential increase in global data generation, and consequently increasing the energy demands of the chips supporting this data growth. Today, Infineon Technologies AG launched its TDM2254xD series dual-phase power modules that enable best-in-class power density, quality and total cost of ownership (TCO) for AI data centers. The TDM2254xD series products blend innovation in robust OptiMOSTM MOSFET technology with novel packaging and proprietary magnetic structure to deliver industry-leading electrical and thermal performance with robust mechanical design. This lets data centers operate at higher efficiency to meet the high power demands of AI GPU (Graphic Processor Unit) platforms while also significantly reducing TCO.
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