| Press Releases 1 to 6 of 1776 |
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| 01.12.2025 10:15 |
Infineon’s SECORA™ Pay M – new platform for fast and efficient payment and secured FIDO authentication |
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Munich, Germany – 1 December 2025 – According to a latest study, the foremost experts in fintech and payment markets, forecasts a 153% surge in digital fraud targeting financial institutions by 2030; rising from $23 billion in 2025 to $58.3 billion in 2030 .To counter the increase in fraud in e-commerce and online banking and to improve the security of transactions, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is growing its SECORA™ Pay family. The new SECORA Pay M platform expands the innovative features of the plug-and-play SECORA Pay solutions to support even more use cases and FIDO (Fast Identity Online) authentication. |
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| 28.11.2025 10:15 |
Infineon XDP™ hybrid-flyback controller and CoolGaN™ technology empower Anker’s industry-leading 160 W prime charger |
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Munich, Germany, 28 November 2025 — Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has expanded its collaboration with Anker, a leading manufacturer of fast-charging power devices, to develop a new generation of high-speed chargers that can deliver up to 160 Watts of power in a compact, pocket-size format. The result of the cooperation is redefining industry standards for high power density and efficiency, represented by the launch of Anker’s 160 W Prime Charger. The industry-leading device features Infineon’s latest XDP™ digital controller and gallium nitride (GaN) -based CoolGaN™ transistor technology, enabling a credit-card-size design, which makes the charger ideal for travelers and professionals alike. |
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| 26.11.2025 10:15 |
Infineon at TRUSTECH 2025: Future-proof payment and ID solutions for a digital, connected world |
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Munich, Germany – 26 November 2025 – At TRUSTECH, the leading trade show for innovative payment and identification technologies, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) will showcase its latest solutions that are shaping the future of secured digital interactions. From December 2 to December 4, at booth F025 in Pavilion 5.2, Infineon will present a range of future-ready products designed to power a connected, digital world. |
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| 25.11.2025 15:30 |
AMD successfully tests Infineon’s HYPERRAM™ memory and IP on the AMD Spartan UltraScale+ FPGA SCU35 Evaluation Kit |
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Munich, Germany – 25 November 2025 - Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced AMD has tested its 64 Mb HYPERRAM™ memory and HYPERRAM controller IP for use with the AMD Spartan™ UltraScale+™ FPGA SCU35 Evaluation Kit, enabling the AMD MicroBlaze™ V soft-core RISC-V processor with cost-effective, high-bandwidth memory. |
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| 17.11.2025 10:48 |
Infineon to complete limited Share Buyback Program serving fulfillment of obligations under existing employee participation programs |
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Munich, Germany – 17 November 2025 – On 14 November 2025, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) successfully completed its Share Buyback Program 2025, announced on 15 September 2025 in accordance with Article 5(1) lit. (a of Regulation (EU) No 596/2014 and Article 2(1) of Delegated Regu... |
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| 13.11.2025 10:15 |
Infineon launches PSOC™ 4 HVPA-SPM 1.0 – bringing intelligence to automotive battery management systems to enable zonal architectures |
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Munich, Germany – 13 November 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the PSOC™ 4 HVPA-SPM 1.0, an advanced microcontroller designed for high-voltage Li-ion battery management in electric vehicles (xEVs). The microcontroller combines precision, safety, and programmability, while supporting zonal architectures and the transition to Software-Defined Vehicles (SDVs). To maximize its impact, Infineon is partnering with Munich Electrification, a leading provider of innovative battery management software. Together, they deliver advanced and cost-efficient Battery Management System (BMS) solutions that accelerate development and reduce costs. |
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