| Press Releases 1 to 6 of 1800 |
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| 26.02.2026 11:15 |
Infineon advances GaN ease-of-use with integrated half-bridge solutions launching CoolGaN™ Drive HB 600 V G5 |
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Munich, Germany – 26 February 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) expands its CoolGaN™ portfolio with the CoolGaN Drive HB 600 V G5 product family. The four new devices – IGI60L1111B1M, IGI60L1414B1M, IGI60L2727B1M, and IGI60L5050B1M – integrate two 600 V GaN switches in a half-bridge configuration together with integrated high- and low-side gate drivers and a bootstrap diode, delivering a compact, thermally optimized power stage that further reduces design complexity. By bringing key functions into one optimized package, the family lowers external component count, eases PCB layout challenges typically associated with fast-switching GaN and helps designers shorten development cycles while achieving the core advantages of GaN technology: higher switching frequencies, lower switching and conduction losses, and greater power density. |
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| 24.02.2026 10:15 |
Infineon presents microcontroller and sensor solutions for the future of AI, IoT, mobility, and robotics at embedded world 2026 |
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Munich, Germany – 24 February 2026 – Next-generation embedded systems are essential for applications in the rapidly evolving connected world. They range from high-performance sensors for capturing critical data to advanced microcontrollers (MCUs) that process and analyze this data. At embedded world 2026, taking place from 10 to 12 March 2026 in Nuremberg, Germany, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) will demonstrate how its innovative semiconductor solutions enable green and efficient energy, clean and safe mobility, and an intelligent and secured IoT. True to the motto “Driving decarbonization and digitalization. Together.” the Infineon booth in Hall 4A, booth 138 will present highlights for applications ranging from AI and IoT to automotive and robotics that contribute to a more sustainable future. |
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| 19.02.2026 16:10 |
Infineon Annual General Meeting approves stable dividend of €0.35 per share / Management Board and Supervisory Board discharged by large majority |
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Munich, Germany – 19 February 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has successfully held its 26th Annual General Meeting. The event took place in person in Munich and was also broadcast publicly on the company’s website. |
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| 19.02.2026 09:15 |
Infineon to extend contracts of CEO Jochen Hanebeck and CFO Dr. Sven Schneider ahead of schedule |
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Neubiberg, Germany – 19 February 2026 – Infineon Technologies AG plans to extend the contracts of Chief Executive Officer Jochen Hanebeck and Chief Financial Officer Dr. Sven Schneider ahead of schedule. Jochen Hanebeck’s contract is to be extended until the end of March 2032, while Dr. Sven Schneider’s contract is to run until the end of April 2032. Without the planned extension, the contracts would have expired on 1 April 2027 and 1 May 2027, respectively. The Supervisory Board will pass the formal resolution in May. |
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| 16.02.2026 10:15 |
Infineon and BMW Group join forces to shape the future of software-defined vehicles with the Neue Klasse |
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– Infineon plays an important role in the innovative architecture of BMW Group’s Neue Klasse with components for central computing, high-speed connectivity, efficient power management and distribution
– Centralized computing delivers faster processing and lower latency, allowing smoother handling, extended range, and improved updateability
– Zonal design reduces wiring by 600 meters and improves efficiency by approximately 20 percent via smart power distribution
Munich, Germany – 16 February 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) plays an important role in shaping the software-defined vehicle architecture of BMW Group’s Neue Klasse, a platform that redefines individual mobility by combining electrification, digitalization, and sustainability. By delivering an integrated, flexible, and future-ready electrical/electronic (E/E) architecture, the Neue Klasse lays an innovative foundation for safer, smarter, and more sustainable mobility solutions. Infineon solutions enable powerful and dependable computing, high-speed data connectivity and smart and efficient power management. Showcasing a BMW iX3, the first model of the Neue Klasse, at the Annual General Meeting (19 February), Infineon will demonstrate these contributions to its shareholders. |
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| 10.02.2026 11:31 |
Infineon successfully places €2 billion in bonds to refinance upcoming maturities and recent acquisitions |
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Munich, Germany – 10 February 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has successfully placed corporate bonds with a volume of €2 billion under its European Medium Term Notes (EMTN) program. The placement was several times oversubscribed and consists of three tranches with different maturities. The transaction enables Infineon to refinance upcoming maturities in fiscal year 2026. It will also help to refinance the EUR bank loans assumed in the context of the acquisition of Marvell’s Automotive Ethernet business and to finance the planned acquisition of ams OSRAM’s non-optical analog/mixed-signal sensor portfolio. |
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