Press Releases 1 to 6 of 1032
28.11.2019 09:15 Updatable security for long-life Industry 4.0 and ICT systems
Munich, Germany – 28 November 2019 – Connected machines and ICT systems require security mechanisms that are particularly robust and remain so for the long life common with industrial hardware. Withstanding attacks over the long term means keeping the protections at the state-of-the-art through ...
27.11.2019 10:15 New 50 and 60 mm modules for Drives and UPS applications, Prime Block designed for highest performance
Munich, Germany – 27 November 2019 – Infineon Technologies Bipolar GmbH & Co. KG has expanded its product portfolio of thyristor/diode modules. The new Prime Block 50 mm modules feature solder bond technology and the 60 mm modules pressure contact technology. They are designed for highest ...
26.11.2019 09:15 Infineon enhances user experience for contactless payments – new 40nm SLC3x security platform delivers excellent performance and flexibility
Munich, Germany - 26 November 2019 - Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) sets another milestone in smart card innovation. Its new 40nm generation of security chip solutions – the SLC3x – is based on a design concept that provides outstanding performance and scalability for a vast arra...
18.11.2019 15:15 Infineon and Klika Tech Form Partnership to Accelerate Development of IoT and Cloud Solutions for Smart Buildings
Munich/Miami, Germany/USA – 18 November 2019 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Klika Tech have formed a partnership to develop innovative solutions for smart buildings based on Infineon’s semiconductor portfolio and Klika Tech integrations of IoT Cloud and Amazon Web Services ...
14.11.2019 14:45 Ready-to use and versatile: Infineon’s Secora™ID accelerates eID project execution
Munich, Germany – 14 November 2019 – Electronic identification documents (eID) are high in demand worldwide. To address the evolving needs of the market in a fast and flexible manner, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has developed the SECORA™ ID security solution. The latest ...
12.11.2019 12:45 Bernd Hops to take over as Head of Corporate Communications at Infineon
Munich, Germany - 12 November 2019 - From January 2020, Bernd Hops (46), currently Head of External Communications, will take over as Head of Communications and Public Authorities & Associations at Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY). He will succeed Klaus Walther, ...
  «« « 1 2 3 4 5 » »»
 
 
 
» Infineon Technologies
» Press Releases
» News by E-mail
Subscribe to our press
newsletter service for free
» News by RSS-Feed
Subscribe to the RSS-Feed
without any registration
» Contact Agency
MEXPERTS AG
Tel.: +49 (0)8143 59744-00
www.mexperts.de