Press Releases 1 to 6 of 1162
08.04.2021 11:00 Infineon successfully signed $1.3 billion US private placement to repay outstanding financing related to the acquisition of Cypress
Munich – 8 February 2021 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has successfully signed a $1.3 billion US private placement of notes. The proceeds of the transaction will be used to repay existing US Dollar bank term loans related to the acquisition of Cypress Semiconductor Corporation.
08.04.2021 09:15 Infineon expands 600 V CoolMOS™ S7 family with MOSFETs for static switching applications
Munich, Germany – 8 April 2021 – In applications where MOSFETs are switched at low frequency, high-power product designs must meet several key characteristics: They have to minimize conduction losses, provide optimal thermal behavior, and enable more compact and lighter systems – all while maintaining the highest quality at a low cost. To meet these requirements, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is enhancing the 600 V CoolMOS™ S7 family with two new optimized devices for static switching applications: the industrial-grade CoolMOS S7 10 mΩ and the automotive-grade CoolMOS S7A.
23.03.2021 10:15 Infineon launches second-generation of high-reliability non-volatile SRAM
Munich, Germany – 23 March 2021 – Infineon Technologies LLC, an Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) company, today announced the availability of its second-generation non-volatile Static RAMs (nvSRAM). The new generation of devices are qualified for QML-Q and high-reliability industrial specifications to support demanding non-volatile code storage and data-logging applications in harsh environments, including aerospace and industrial applications.
19.03.2021 18:30 Infineon re-ramps production in Austin, Texas, and provides update on customer impact; pre-shutdown output level expected in June 2021
Munich – 19 March 2021 – Infineon Technologies (FSE: IFX / OTCQX: IFNNY)  continues ramping up its manufacturing facility in Austin, Texas. Infrastructure had been recovered within one week after the forced shutdown on 15 February 2021. Tools are operational, production has been resumed and will ramp up over time to pre-outage levels. The shutdown was required after a severe winter storm and its resulting long-lasting regional power outage.
19.03.2021 10:15 World’s first TPM 2.0 with open-source software stack cuts down security integration efforts in industrial, automotive and IoT applications
Munich, Germany – 19 March 2021 – Trusted Platform Modules (TPM) enable secured remote software updates, disc encryption and user authentication. Hence, they are crucial for connected industrial, automotive and other embedded devices. To further facilitate seamless integration in Linux-based systems, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) now provides its leading OPTIGA™ TPM 2.0 solution with a comprehensive TSS* host software implementing the latest FAPI standard. Infineon has developed the open-source software jointly with Intel Corporation and Fraunhofer Institute for Secure Information Technology SIT.
18.03.2021 10:15 Sustainable operation of trains: Power-efficient on-board electrical system uses technology developed by Siemens Mobility and Infineon
Munich, Germany – 18 March 2021 – As the global population experiences rapid growth, more people around the world are moving from the countryside to the city. In addition to the inner-city challenges posed by the urbanization megatrend, there is also an increase in the average traveling distance. As a result, the challenges for train systems are also increasing. To meet these demands, Siemens Mobility and Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) have jointly developed new auxiliary converters to improve the efficiency of on-board power systems using power semiconductors based on silicon carbide (SiC).
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