| Press Releases 13 to 18 of 1715 |
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| 02.05.2025 10:15 |
Infineon introduces new CoolSET™ System in Package (SiP) in a compact design for highly efficient power delivery up to 60 W for wide input voltage range |
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Munich, Germany – 02 May 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is launching its new CoolSET™ System in Package (SiP), a compact, fully integrated system power controller for highly efficient power delivery of up to 60 W at universal input voltage range of 85 – 305 VAC. Housed in a small SMD package, the high-voltage MOSFET with low RDS(ON) eliminates the need for an external heat sink, reducing system size and complexity. The CoolSET SiP supports zero-voltage switching (ZVS) flyback operation, which enables low switching losses and low EMI signature, while also enhancing system reliability and robustness. This makes it an ideal solution for applications such as major home appliances and AI servers. In addition, the controller makes it easier for developers to meet stringent energy standards, supporting future-proof power solutions for modern designs. |
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| 30.04.2025 14:15 |
Infineon CoolMOS™ 8 superjunction MOSFET sets new standards for optimized systems performance in server applications from LITEON |
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Munich, Germany – 30 April 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) provides its 600 V CoolMOS™ 8 high-voltage superjunction (SJ) MOSFET product family to LITEON, a leader in power management solutions, for superior efficiency and reliability in server applications. The 600 V CoolMOS 8 offers an all-in-one solution that improves LITEON’s new generation technology for existing and upcoming server application designs. |
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| 29.04.2025 14:15 |
Infineon launches CoolSiC™ MOSFET 750 V G2 with ultra-low RDS(on) for automotive and industrial power electronics |
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Munich, Germany – 29 April 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) launched its new CoolSiC™ MOSFET 750 V G2 technology, designed to deliver improved system efficiency and increased power density in automotive and industrial power conversion applications. The CoolSiC MOSFETs 750 V G2 technology offers a granular portfolio with typical RDS(on) values up to 60 mΩ at 25°C, making it suitable for a wide range of applications, including on-board chargers (OBCs), DC-DC converters, auxiliaries for electric vehicles (xEVs) as well as industrial applications in EV charging, solar inverter, energy storage systems, telecom and SMPS. |
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| 29.04.2025 10:00 |
Digital umbrella warns of natural hazards: Infineon and startup GMD deploy sensors in the Alps |
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Munich, Germany – 29 April 2025 – In collaboration with Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), startup Geomorphing Detection (GMD®) has developed a system that uses radar sensors to continuously monitor streams and rock movements in the Alps. The innovation has the potential to reduce the impact of extreme weather and climate-related events and protect people and infrastructure. |
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| 24.04.2025 14:15 |
XENSIV™ 4th generation of magnetic switches supports functional safety up to ASIL B in automotive applications |
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Munich, Germany – 24 April 2025 – When developing applications for autonomous driving, compliance with the ISO 26262 standard is crucial – at both the system and sensor levels. To meet these demands, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the XENSIV™ TLE4960x magnetic switch family. Developed in accordance with ISO 26262, the TLE4960x switches integrate diagnostic functions to support functional safety applications with requirements up to ASIL B. They are the only ASIL-B-compliant switches on the market that can address a wide range of automotive applications, including window regulators, sunroof actuators, and seat adjustment. In addition, the devices are AEC-Q100 compliant and qualified to Grade 0, ensuring robust performance in harsh environments. |
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| 23.04.2025 10:15 |
Infineon at PCIM Europe 2025: Driving decarbonization and digitalization with innovative semiconductor solutions |
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Munich, Germany – 23 April 2025 – At PCIM Europe 2025 in Nuremberg, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) will showcase its latest semiconductor, software and tooling solutions that help to solve today’s green and digital transformation challenges. At booth #470 in hall 7, the company will present highlights from its extensive power device portfolio, covering all relevant power technologies spanning silicon (Si), silicon carbide (SiC), and gallium nitride (GaN). Under the motto “Driving decarbonization and digitalization. Together”, Infineon will offer numerous demonstrations and presentations as well as the opportunity to talk to its experts. |
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