| Press Releases 19 to 24 of 1620 |
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| 13.08.2024 11:15 |
Infineon expands its Bluetooth® portfolio with eight new parts, including the AIROC™ CYW89829 Bluetooth LE MCU for automotive applications |
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Munich, Germany – 13 August 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the expansion of its Bluetooth® portfolio by eight new products in the AIROC™ CYW20829 Bluetooth Low Energy 5.4 microcontroller (MCU) family, featuring Systems-on-Chip (SoCs) and modules optimized for industrial, consumer, and automotive use cases. The high integration of the CYW20829 product family allows designers to reduce bill-of-material (BOM) cost and device footprint in a wide variety of applications, including PC accessories, low-energy audio, wearables, solar micro inverters, asset trackers, health and lifestyle, home automation and others. Product designers also benefit from Infineon’s rich development infrastructure and commitment to robust security, with support for secure boot and execution environments and cryptography acceleration to safeguard sensitive data. |
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| 12.08.2024 10:15 |
Infineon presents high-performance CIPOS™ Maxi Intelligent Power Modules for industrial motor drives of up to 4 kW |
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Munich, Germany – 12 August 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) expands its 7th generation TRENCHSTOP™ IGBT7 product family with the CIPOS™ Maxi Intelligent Power Module (IPM) series for low-power motor drives. The new IM12BxxxC1 series is based on the new TRENCHSTOP IGBT7 1200 V and rapid diode EmCon 7 technology. Thanks to the latest micro-pattern trench design, it offers exceptional control and performance. This results in significant loss reduction, increased efficiency, and higher power density. The portfolio includes three new products in variants ranging from 10 A to 20 A for power ratings of up to 4.0 kW: IM12B10CC1, IM12B15CC1 and IM12B20EC1. |
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| 09.08.2024 10:15 |
Highest power density for DCDC converters demonstrated by Vitesco Technologies using Infineon’s CoolGaN™ Transistors |
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Munich, Germany – 9 August 2024 – DCDC converters are essential in any electric or hybrid vehicle to connect the high-voltage battery to the low-voltage auxiliary circuits. This includes 12 V power headlights, interior lights, wiper and window motors, fans, and at 48 V, pumps, steering drives, lighting systems, electrical heaters, and air conditioning compressors. In addition, the DCDC converter is important for developing more affordable and energy-efficient vehicles with an increasing number of low voltage functions. According to TechInsights, the global automotive DC-DC converter market size was valued at USD 4 billion in 2023 and is projected to grow to USD 11 billion by 2030, exhibiting a CAGR of 15 percent during the forecast period. Gallium nitride (GaN) in particular plays a crucial role here, as it can be used to improve the power density in DCDC converters and on-board chargers (OBC). For this reason, Vitesco Technologies, a leading supplier of modern drive technologies and electrification solutions, has selected GaN to improve the power efficiency of its Gen5+ GaN Air DCDC converter. The CoolGaN™ Transistors 650 V from Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) significantly improve the overall system performance while minimizing system cost and increasing ease of use. As a result, Vitesco created a new generation of DCDC converters that set new standards in power density (efficiency of over 96 percent) and sustainability for power grids, power supplies, and OBCs. |
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| 08.08.2024 06:52 |
Infineon opens the world’s largest and most efficient SiC power semiconductor fab in Malaysia |
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Kulim, Malaysia – 8 August 2024 – As global decarbonization efforts drive demand for power semiconductors, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has officially opened the first phase of a new fab in Malaysia that will become the world’s largest and most competitive 200-millimeter silicon carbide (SiC) power semiconductor fab. Malaysian Prime Minister YAB Dato’ Seri Anwar Ibrahim and Chief Minister of the state of Kedah YAB Dato’ Seri Haji Muhammad Sanusi Haji Mohd Nor joined Infineon CEO Jochen Hanebeck, to symbolically launch production. |
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| 05.08.2024 07:32 |
Slight increase in revenue and earnings in Q3 FY 2024. Further improvement expected in Q4 FY 2024. Full-year forecast well within the previously guided range |
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Neubiberg, 5 August 2024 – Today, Infineon Technologies AG is reporting results for the third quarter of its 2024 fiscal year (period ended 30 June 2024). |
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| 01.08.2024 10:15 |
Infineon introduces new CoolGaN™ Drive product family of integrated single switches and half-bridges with integrated drivers |
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Munich, Germany – 1 August 2024 – Many different trends are taking center stage in both consumer electronics and industrial applications, such as portability, electrification, and weight reduction. All of these trends require compact and efficient designs. They also go hand in hand with unconventional PCB designs with severe space constraints that limit the use of external components. To address these challenges, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) expands its GaN portfolio with the CoolGaN™ Drive product family. It consists of the CoolGaN Drive 650 V G5 single switches, integrating one transistor plus gate driver in PQFN 5x6 and PQFN 6x8 packages, as well as the CoolGaN Drive HB 650 V G5 devices, combining two transistors with integrated high- and low-side gate drivers in a LGA 6x8 package. The new product family enables improved efficiency, reduced system size, and overall cost savings. This makes the devices suitable for longer-range e-bikes, portable power tools, and lighter-weight household appliances such as vacuums, fans, and hairdryers. |
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