Press Releases 37 to 42 of 1540
06.12.2023 12:15 Edge AI company Imagimob introduces Ready Models – the fastest way to take machine learning to production
Munich, Germany – 6 December 2023 – In line with its mission to offer the best and fastest ways to take smart devices to market, Imagimob, an Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) company, is now launching IMAGIMOB Ready Models. The complete machine learning (ML) solutions are guaranteed to be robust, high-performing, and production-ready for edge devices. Ready Models can be quickly deployed onto existing microcontroller (MCU) hardware, such as PSoC™ 6, without the cost, time, or expertise required for custom development.
05.12.2023 14:15 Infineon introduces new CoolMOS™ S7T with integrated temperature sensor
Munich, Germany – 5 December 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) launches its new CoolMOS™ S7T product family with an integrated temperature sensor to improve the accuracy of junction temperature sensing. The integration of these products has a positive impact on the durability, safety, and efficiency of many electronic applications. The CoolMOS S7T is best suited for solid-state relay (SSR) applications for enhanced performance and reliability due to its superior RDS(on) and the highly accurate, embedded sensor.
29.11.2023 09:15 Infineon introduces the industry’s first USB 10 Gbps peripheral controller
Munich, Germany – 29 November 2023 – The EZ-USB™ family of programmable USB peripheral controllers has continuously advanced features and performance, enabling developers to create USB devices that meet the highest performance requirements in AI, imaging, and emerging applications. Now, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the latest addition to the family: The EZ-USB FX10. The device offers fast connectivity with USB 10Gbps and LVDS interfaces, increasing the total bandwidth up to 3 times compared to its predecessor.
28.11.2023 15:45 Infineon introduces the first 15 V trench power MOSFETs with OptiMOS™ 7 technology in PQFN packages
Munich, Germany – 28 November 2023 – The ever-increasing power demand in data centers and computing applications requires advancements in power efficiency and compact power supply design. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) responds to trends on the system level by introducing its new OptiMOS™ 7 family, industry’s first 15 V trench power MOSFET technology. The OptiMOS 7 15 V series primarily targets optimized DC-DC conversion for servers, computing, datacenter, and artificial intelligence applications.
27.11.2023 16:45 DIGISEQ and Infineon support market growth of wearables by launching world-first pre-certified ring inlay
Munich, Germany, and London, UK – 27 November, 2023 – DIGISEQ Ltd, the wearable payment tech pioneer, has received Mastercard certification for a world-first pre-certified concentric ring inlay, opening up the market for small independents and large brands to quickly and effectively launch payment rings within their collections. The inclusion of the ring inlay with integrated secured NFC chip can deliver multiple services, opening new use cases in addition to payments, such as loyalty, access, events and hospitality for consumers’ everyday life.
27.11.2023 12:45 “Coil on Module” enables ultra-thin electronic data page for Turkish passports with exceptional document durability and protection against forgery
Munich, Germany – 27 November, 2023 – Türkiye has issued nearly five million next-generation electronic passports with contactless Coil on Module (CoM CL) solution from Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY). The passport includes a polycarbonate (PC) data page with an integrated security chip, which is embedded in a contactless module based on the reliable CoM technology. The data page contains sensitive personal data of the holder. Due to the security-critical nature of this information, official travel documents must be designed to highest security standards in order to provide reliable protection against tampering and fraud. Infineon’s contactless CoM solution not only increases the robustness of the ePassport, but also enables enhanced security.
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