http://www.presseagentur.com/?lang=en Latest press releases of Infineon Technologies (Provided by MEXPERTS AG) en-US Infineon Technologies MEXPERTS AG (info@mexperts.de) Copyright 2010 MEXPERTS AG 2026-11-01T22:58+01:00 http://www.presseagentur.com/?lang=en http://www.presseagentur.com/pics/rdf_logo.gif https://www.infineon.com/press-release/2026/infpr202610-021 Munich, Germany/Vienna, Austria – 27 October 2026 – Infineon Technologies AG is establishing the world’s first high-volume manufacturing facility for next-generation gallium nitride (GaN) power semiconductors on 300-millimeter wafers in Europe. As part of the project, Infineon will invest around €1.1 billion in its existing cleanroom facilities at the Villach site by 2034. Leveraging both the existing and upgraded infrastructure will enable highly efficient and cost-effective expansion of manufacturing capacity. Production is scheduled to start by the end of 2027. Infineon’s investment addresses the rapidly growing demand for high-performance power supply solutions. Gallium nitride enables significant efficiency gains in numerous applications, such as AI data centers, energy infrastructure, e-mobility, robotics and consumer electronics. 2026-10-27T07:45+01:00 https://www.infineon.com/technology-news/2026/inftn202610-014 Munich, Germany – 26 October 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) will supply the world’s first 900 V gallium nitride (GaN) monolithic bidirectional switches (BDS) to Enphase Energy, Inc. (NASDAQ: ENPH), a global energy technology company, for deployment in its solid-state transformer (SST) power modules. By extending the operating voltage range of GaN technology to 900 V while maintaining its high-frequency switching characteristics, the devices enable highly efficient, compact power conversion architectures for emerging applications including AI data centers. 2026-10-26T13:15+01:00 https://www.infineon.com/press-release/2026/infpr202610-013 Munich, Germany – 22 October 2026 – UnternehmerTUM Accelerator, Microsoft, Infineon, and NVIDIA, today launched the Physical AI Growth Lab, an equity-free accelerator for Europe's most promising physical AI, robotics, and industrial AI startups. Running from January to April 2027, the program combines expertise, infrastructure, capital access, and enterprise networks to help founders scale. 2026-10-22T14:15+01:00 https://www.infineon.com/press-release/2026/infpr202610-012 Munich, Germany – 21 October 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is advancing its collaboration with NVIDIA on 800 Volt direct current (VDC) power architectures for AI data centers. Timed with NVIDIA's GTC Berlin developer conference, the announcement centers on the high-voltage intermediate bus converter (IBC), one of the most critical and demanding conversion stages in the power delivery chain of AI data centers. Infineon's gallium nitride (GaN) technology is emerging as well-suited technology of choice for this stage. This builds on the companies' joint work first announced in May 2025 and detailed further in October 2025, which centered on enabling serviceable, hot-swappable 800 VDC server racks. 2026-10-21T13:45+01:00 https://www.infineon.com/technology-news/2026/inftn202610-011 Munich, Germany – October 20, 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is expanding its ModusToolbox™ software ecosystem with the ModusToolbox AI Assistant for Microsoft Visual Studio Code (VS Code). The extension supplies AI coding agents with hardware-specific context for PSOC™ Edge and PSOC Control microcontrollers. Without such context, generic AI coding assistants can produce code that appears correct but fails on real hardware. They may target the wrong device, call deprecated APIs or skip an initialization step that only surfaces during board bring-up. The ModusToolbox AI Assistant aligns every suggestion with the developer’s actual target device, board and peripheral configuration. As a result, general-purpose AI assistants generate valid embedded code. The extension analyzes the project context entirely locally and keeps customer project data on the developer’s system. Common applications include connected IoT devices with graphics and connectivity functions. 2026-10-20T11:15+01:00 https://www.infineon.com/press-release/2026/infpr202610-010 Munich, Germany – 19 October 2026 – Infineon has announced the winners of the Infineon Startup Challenge 2026, focused on key technologies for the next generation of humanoid robots. Following four months of intensive collaboration, development and mentoring, 15 selected startups out of more than 100 applicants presented their solutions at the Infineon Startup Challenge Demo Day, held during the Electronic Based Systems Conference (EBSCON) in Graz, Austria. 2026-10-19T14:15+01:00 https://www.infineon.com/technology-news/2026/inftn202610-009 Munich, Germany – 19 October 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) announced today that it is expanding its PSOC™ Control family with the launch of the PSOC Control C3 Main Line PSC3M/P6 microcontrollers (MCUs). The new, versatile, and cost-optimized MCUs combine real-time motor and power control performance, with advanced security features. The features efficiently drive up to four brushless DC motors in sensored or sensorless configuration with a single MCU, power topologies and security needs for a variety of applications including industrial drives, drones, smart home, home appliances, renewables, robotics, telecommunication servers, datacenters, and digital healthcare applications. 2026-10-19T10:15+01:00 https://www.infineon.com/press-release/2026/infpr202610-008 – Multi-year agreement with Wolfspeed supports Infineon’s conversion from 150-millimeter to 200-millimeter silicon carbide (SiC) manufacturing – Expanded substrate sourcing strengthens supply chain resilience and enhances flexibility to support future growth – Agreement supports growing demand for SiC power semiconductors for electric vehicles, renewable energy systems and AI datacenter power infrastructure Munich, Germany and Durham, N.C – 15 October 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Wolfspeed, Inc. (NYSE: WOLF) have signed a new multi-year supply agreement for 200-millimeter silicon carbide (SiC) wafers, transitioning Infineon's existing Wolfspeed supply relationship from 150-millimeter to 200-millimeter substrate technology. SiC semiconductors have become a key enabling technology for the electrification and energy efficiency applications that drive global decarbonization, from electric vehicles and renewable energy systems to AI datacenter power infrastructure. The agreement directly supports Infineon's conversion to 200-millimeter SiC manufacturing, strengthening Infineon's position as the global leader in power semiconductors and reinforcing the supply chain resilience that underpins its SiC growth strategy. 2026-10-15T14:00+01:00 https://www.infineon.com/press-release/2026/infpr202610-007 Munich, Germany – 14 October 2026 – With artificial intelligence evolving from virtual chatbots into real-world machines and devices, it will shape our lives more than ever. At the electronica trade fair 2026 in Munich, Germany (10 – 13 November), Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) will showcase customer cases, system solutions, and semiconductor innovations for Physical AI across robotics and mobility, intelligent edge devices as well as the infrastructure necessary to power the age of AI. Technology from Infineon helps machines perceive their environment, communicate in a secured way, process data locally through edge AI, and act on it safely and reliably while using energy as efficiently as possible. Visitors will find Infineon at booth 502 in hall C3. 2026-10-14T10:15+01:00 https://www.infineon.com/technology-news/2026/inftn202610-006 Munich, Germany – 12 October 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the XDP8HD40S-1, a high-voltage hot-swap controller designed for digital power-path protection and monitoring in next-generation AI server power architectures operating at ±400 Volt and 800 Volt direct current (VDC). As AI clusters scale from 48 V toward higher rack power levels, reliable hot-swap functionality becomes increasingly important for maintaining uninterrupted system operation. The XDP8HD40S-1 enables power modules, converters, GPUs, and server subsystems to be connected and disconnected safely while preserving system integrity, extending Infineon's power semiconductor portfolio, spanning silicon, silicon carbide (SiC), and gallium nitride (GaN), further into the protection and monitoring layer required for scalable AI infrastructure. 2026-10-12T16:00+01:00