| 02.07.2025 15:55 |
Infineon advances on 300-millimeter GaN manufacturing roadmap as leading Integrated Device Manufacturer (IDM) |
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Munich, Germany – 2 July 2025 – As the demand for gallium nitride (GaN) semiconductors continues to grow, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is poised to capitalize on this trend and solidify its position as a leading Integrated Device Manufacturer (IDM) in the GaN market. Today, the company announced that its scalable GaN manufacturing on 300-millimeter wafers is on track. With first samples available for customers as of the fourth quarter of 2025, Infineon is well-positioned to expand its customer base and reinforce its position as a leading GaN powerhouse. |
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| 02.07.2025 12:15 |
Infineon receives Business Partner Award from DENSO |
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Munich, Germany – 2 July 2025 – DENSO, a leading mobility supplier, recognized Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) with a 2025 North America Business Partner Award in the Value Leader category at its annual North America Business Partner Convention (NABPC). During the event, DENSO brought together approximately 150 supplier representatives from across North America to recognize 15 exceptional business partners. |
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| 18.06.2025 12:15 |
Infineon introduces radiation-tolerant memory portfolio for low Earth orbit missions |
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Munich, Germany – 18 June 2025 – Nearly 10,000 satellites currently circle our planet in low Earth orbit (LEO), delivering internet access, earth observation, communications, weather information, and more data back to Earth. Compared to traditional geostationary Earth orbit (GEO) systems, LEO satellites are launched in larger numbers to achieve sufficient coverage and operate in a less severe radiation environment. As such LEO satellites require different electrical components compared to their traditional GEO counterparts. To support the development of these applications, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is introducing a new portfolio of radiation-tolerant memory products tailored for the rapidly growing NewSpace market. |
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| 17.06.2025 11:15 |
CIS launches USB 3.2 cameras powered by Infineon’s EZ-USB™ controllers for enhanced data transfer and performance |
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Munich, Germany – 17 June 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) provides its EZ-USB™ FX10 and FX5 controllers to CIS Corporation for its new USB 5 Gbit/s and 10 Gbit/s camera. These next-generation devices build on the EZ-USB FX3, a widely adopted USB peripheral controller, by adding support for high-speed USB 10 Gbit/s and LVDS interfaces. This advancement increases total data bandwidth by up to 275 percent compared to the previous generation, enabling significantly faster data transfer and improved system performance. |
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| 16.06.2025 10:15 |
Infineon expands government ID portfolio with SECORA™ ID V2 and eID-OS for enhanced flexibility and faster time-to-market |
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Munich, Germany – 16 June 2025 – Electronic identification (eID) documents are seeing growing demand worldwide as governments push ahead with their digitalization efforts. To meet these rapidly evolving requirements more quickly and flexibly, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has introduced two new solutions: SECORA™ ID V2 and the eID-OS. These solutions offer local security printers and card manufacturers greater flexibility in selecting the right solution for their specific project requirements, while helping to reduce development time and accelerate deployment. |
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| 12.06.2025 10:15 |
Infineon integrates CAPSENSE™ into PSOC™ HV microcontrollers for smart sensors and actuators including advanced touch sensing applications |
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Munich, Germany – 12 June 2025 – Infineon Technologies AG (FSE: IFX / OTCQX) expands its PSOC™ 4 HV microcontroller (MCU) platform by introducing the PSOC 4 HVMS product family. The new family is optimized for space-constrained sensing or actuator applications by integrating high voltage functionality and advanced analog sensing capabilities into a standard microcontroller for connecting to the car-battery and vehicle-network with minimal external components needed. |
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