Press Releases 1 to 6 of 1553
28.03.2024 07:00 Infineon and HD Korea Shipbuilding & Offshore Engineering jointly develop ship electrification technology
Munich, Germany – 28 March 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and HD Korea Shipbuilding & Offshore Engineering Co. Ltd. (HD KSOE) have signed a non-binding Memorandum of Understanding (MoU) as a first step towards jointly developing emerging applications for the electrification of marine engines and machinery using energy-efficient power semiconductor technology.
27.03.2024 14:15 Infineon introduces 80 V MOSFET OptiMOS™ 7 with lowest on-resistance in the industry for automotive applications
Munich, Germany – 27 March 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has introduced the first product in its new advanced power MOSFET technology OptiMOS™ 7 80 V: The IAUCN08S7N013 features a significantly increased power density and is available in the versatile, robust, and high-current SSO8 5 x 6 mm² SMD package. The OptiMOS™ 7 80 V offering is a perfect match for the upcoming 48 V board net applications. It is designed specifically for the high performance, high quality and robustness needed for demanding automotive applications like automotive DC-DC converters in EVs, 48 V motor control, for instance electric power steering (EPS), 48 V battery switches and electric two- and three-wheelers.
26.03.2024 10:15 New SSO10T TSC top-side cooling package for power MOSFETs enables highest efficiency for modern automotive applications
Munich, Germany – 26 March 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the SSO10T TSC package with OptiMOS™ MOSFET technology. With its direct top-side cooling concept, the package offers excellent thermal performance. This eliminates heat transfer into or through the PCB of the automotive electronic control unit. The package enables a simple and compact double-sided PCB design and minimizes cooling requirements and system costs for future automotive power designs. The SSO10T TSC is therefore well suited for applications such as electric power steering (EPS), EMB, power distribution, brushless DC drives (BLDC), safety switches, reverse battery, and DCDC converters.
25.03.2024 14:15 Infineon presents innovative semiconductor and microcontroller solutions for a greener future at embedded world 2024
Munich, Germany – 25 March 2024 – Decarbonization and digitalization are the two central challenges of our time, but they rely on new and advanced technologies. At embedded world 2024 in Nuremberg, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) will demonstrate how its innovative semiconductor solutions support and drive these advancements. Microcontrollers in particular play an important role as they are at the heart of a wide range of applications, from electric vehicles and renewable energy systems to smart homes and industrial automation. For this reason, Infineon showcases high-quality microcontrollers designed with the latest technologies and innovative features such as enhanced security and high accuracy, offering excellent performance with low power consumption.
21.03.2024 14:15 Infineon extends its XDP™ digital power protection controller family with the XDP700-002, the industry's first wide input voltage hot-swap controller for telecom infrastructure
Munich, Germany – 25 March 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is expanding its XDP™ digital power protection controller product family with the XDP700-002, the industry's first -48 V wide input voltage digital hot-swap controller with a programmable safe operating area (SOA) control designed for telecom infrastructure. It boasts superior current reporting accuracy of less than ±0.7 percent, enhancing the system's fault detection and reporting accuracy. Furthermore, the product features boost-mode control technology for safer turn-on of field-effect transistors (FETs) in systems with non-optimal SOA. This new member of the XDP product family is tailored for a spectrum of telecom applications, including remote radio head power, base station power distribution, active and passive antenna systems, 5G small cell power, and telecom UPS systems.
20.03.2024 14:15 Ekkono’s Edge Machine Learning simplifies deployment of AI for automotive applications on Infineon’s AURIX™ TC3x and TC4x
Munich, Germany and Varberg, Sweden – 20 March, 2024 – Automotive component suppliers and OEMs alike are faced with the challenge that every car is unique. It is unique in how, where and by whom it is driven, its design, the purpose of the ride, as well as the road and traffic conditions where it operates. To ensure that each vehicle functions well and runs optimally, it is necessary to know and manage it and its conditions individually. The AURIX™ microcontroller (MCU) family from Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) provides advanced real-time computing hardware, e.g. for embedded AI in safety-critical automotive applications. To leverage these powerful capabilities, Infineon’s ecosystem partner Ekkono Solutions now offers an easy-to-use, fast and effective software development kit (SDK) for creating AI algorithms for embedded systems based on AURIX TC3x and TC4x.
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