| Press Releases 1 to 6 of 1502 |
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| 29.11.2023 09:15 |
Infineon introduces the industry’s first USB 10 Gbps peripheral controller |
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Munich, Germany – 29 November 2023 – The EZ-USB™ family of programmable USB peripheral controllers has continuously advanced features and performance, enabling developers to create USB devices that meet the highest performance requirements in AI, imaging, and emerging applications. Now, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the latest addition to the family: The EZ-USB FX10. The device offers fast connectivity with USB 10Gbps and LVDS interfaces, increasing the total bandwidth up to 3 times compared to its predecessor. |
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| 28.11.2023 15:45 |
Infineon introduces the first 15 V trench power MOSFETs with OptiMOS™ 7 technology in PQFN packages |
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Munich, Germany – 28 November 2023 – The ever-increasing power demand in data centers and computing applications requires advancements in power efficiency and compact power supply design. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) responds to trends on the system level by introducing its new OptiMOS™ 7 family, industry’s first 15 V trench power MOSFET technology. The OptiMOS 7 15 V series primarily targets optimized DC-DC conversion for servers, computing, datacenter, and artificial intelligence applications. |
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| 27.11.2023 16:45 |
DIGISEQ and Infineon support market growth of wearables by launching world-first pre-certified ring inlay |
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Munich, Germany, and London, UK – 27 November, 2023 – DIGISEQ Ltd, the wearable payment tech pioneer, has received Mastercard certification for a world-first pre-certified concentric ring inlay, opening up the market for small independents and large brands to quickly and effectively launch payment rings within their collections. The inclusion of the ring inlay with integrated secured NFC chip can deliver multiple services, opening new use cases in addition to payments, such as loyalty, access, events and hospitality for consumers’ everyday life. |
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| 27.11.2023 12:45 |
“Coil on Module” enables ultra-thin electronic data page for Turkish passports with exceptional document durability and protection against forgery |
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Munich, Germany – 27 November, 2023 – Türkiye has issued nearly five million next-generation electronic passports with contactless Coil on Module (CoM CL) solution from Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY). The passport includes a polycarbonate (PC) data page with an integrated security chip, which is embedded in a contactless module based on the reliable CoM technology. The data page contains sensitive personal data of the holder. Due to the security-critical nature of this information, official travel documents must be designed to highest security standards in order to provide reliable protection against tampering and fraud. Infineon’s contactless CoM solution not only increases the robustness of the ePassport, but also enables enhanced security. |
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| 24.11.2023 14:15 |
ETAS and Infineon receive NIST CAVP certification for ESCRYPT CycurHSM implemented on AURIX microcontrollers |
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Munich and Stuttgart, Germany – 24 November, 2023 – ETAS GmbH, a leading solution provider for Software Defined Vehicles (SDV), and Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) have successfully certified their cryptographic algorithm suite. The certificate was validated under the Cryptographic Algorithm Verification Program (CAVP) of the National Institute of Standards and Technology (NIST) and granted for ESCRYPT CycurHSM. This automotive embedded security software stack is implemented on Infineon’s second-generation AURIX™ TC3xx hardware security module (HSM). |
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| 24.11.2023 10:15 |
Infineon @ TRUSTECH 2023: Mini airport booth displays TEGRION™ and SECORA™ Pay demos for high performance government IDs and payment |
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Munich, Germany, and Paris, France – 24 November, 2023 – At TRUSTECH, the tradeshow for innovative payment and identification solutions, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) will present the latest member of the TEGRION™ family, which accelerates future-proof ID applications. Infineon’s mini airport booth will also feature the world’s first PQC-enabled ePassport demonstrator. In addition, visitors can experience the convenience of seamless payment with SECORA™ Pay X, which will be demonstrated in a pop-up manicure salon for fingernails suitable for contactless payment. |
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