| Press Releases 7 to 12 of 1192 |
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| 24.06.2021 08:15 |
XENSIV™ 60 GHz radar sensors and AURIX™ microcontrollers enable ultra-short range automotive applications |
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Munich, Germany – 24 June 2021 – In-cabin monitoring systems (ICMS) are reshaping the concept of passenger safety in cars. Various applications such as left-behind child detection, driver well-being or occupancy sensing increase road safety and the protection in vehicles. Radar in particular is a promising technology to address these applications due to its ability to detect micro-motions and vital signs. With XENSIV™ BGT60ATR24C AEC-Q100 radar sensors, AURIX™ microcontrollers and OPTIREG™ PMICs, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) offers a wide variety of products for an ultra-wideband, ultra-low power and cost-performance scalable architecture for ICMS sub-systems. The devices support the use of new signal processing techniques enabling robustness and a good compromise between computational costs, the degree of information as well as the power consumption of the system. |
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| 23.06.2021 14:50 |
Infineon and pmdtechnologies partner with ArcSoft for under-display Time-of-Flight turnkey solution |
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Munich, Germany – 23 June 2021 – The latest phone designs focus on solutions that allow a full-screen display and avoid the notch, punch-hole cameras, or bezels without compromising on quality or performance. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) together with its Time-of-Flight (ToF) partner pmdtechnologies and the leading vision-based imaging specialist ArcSoft is developing a turnkey solution that allows a ToF camera to work under the display of commercial smartphones. It will provide reliable high-quality infrared images and 3D data for security-related applications like face authentication and mobile payment. The market for ToF solutions in smartphones is estimated to reach above 600 million sensor units in 2025 with a CAGR of around 32 percent from 2021 onward*. The new under-display solution will be available in the third quarter of 2021 and will be introduced during the MWC 2021 conference from June 28 to July 1. |
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| 21.06.2021 10:15 |
AIROC™ Wi-Fi & Bluetooth® combo chip brings reliable, high performance connectivity to TomTom's new satnav |
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Munich, Germany, and Amsterdam, Netherlands – 21 June 2021 –TomTom GO Discover, developed by TomTom, the location technology company, is one of the quickest and most powerful satnavs on the market today. The satnav with its 5, 6, and 7-inch display leverages the AIROC™ CYW43455 Wi-Fi and Bluetooth® combo chip from Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY). The AIROC wireless solution combines Wi-Fi 5 (802.11 ac) and Bluetooth® 5.0 on a single chip and adds fast and robust wireless connectivity that is critical to the navigation device. Infineon’s AIROC family includes a broad range of wireless solutions that deliver reliable, high performance connectivity. |
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| 14.06.2021 10:15 |
Enabling the next generation of advanced motor control applications with EiceDRIVER™ 6EDL7141: A fully programmable three-phase driver IC |
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Munich, Germany – 14 June 2021 – Increasingly popular battery-powered consumer and industrial applications, such as cordless power tools and service robots, demand cutting-edge, reliable, cost- and energy-efficient motor control solutions that meet the highest safety standards. To enable the next generation of innovative and high-performance battery-powered products, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) expands its EiceDRIVER™ product portfolio of three-phase gate driver ICs with the 6EDL7141. The fully programmable solution for advanced motor control applications is packaged in a 48-pin VQFN with a 7x7 mm² footprint, delivers higher power density and improves overall system efficiency. Combined with the company’s market-leading power MOSFETs, customers are now able to develop their complete end solutions using Infineon as their one-stop-shop. |
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| 08.06.2021 10:30 |
Infineon launches new OptiMOS™ packages in TOLx family: TOLG for improved TCoB robustness and TOLT for superior thermal performance |
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Munich, Germany – 8 June 2021 – Applications such as e-scooters, e-forklifts and other light electric vehicles (LEVs), as well as power tools and battery management systems, demand high current rating, ruggedness and extended lifetime. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) addresses these requirements by offering more choices to power system designers to meet diverse design needs and achieve maximum performance in the smallest space. With the innovative TO-Leadless (TOLL) package, Infineon now offers two new OptiMOS™ power MOSFET packages in the TOLx family: TOLG (TO-Leaded with Gullwing leads) and TOLT (TO-Leaded Top-side cooling). Together, the TOLx family offers very low RDS(on) and a high-current rating over 300 A to increase system efficiency in high-power density designs. |
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| 01.06.2021 10:30 |
EiceDRIVER™ 1EDB single-channel gate-driver IC family with integrated galvanic isolation in small 150 mil 8-pin DSO package |
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Munich, Germany – 1 June 2021 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) expands its growing portfolio of single-channel gate-driver ICs. The new EiceDRIVER™ 1EDB family of single-channel gate-driver IC provides galvanic input-to-output isolation of 3 kVrms (UL 1577) that ensures rugged ground-loop separation. Their common-mode transient immunity (CMTI) exceeds 300 V/ns, making these devices the perfect choice for hard switching applications enabling numerous topologies. |
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