Press Releases 7 to 12 of 1472
23.08.2023 10:15 Infineon presents H7 variant of the Gen7 discrete 650 V TRENCHSTOP™ IGBTs for energy-efficient power applications
Munich, Germany – 23 August, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) expands its 7th generation TRENCHSTOP™ IGBT family with the discrete 650 V IGBT7 H7 variant. The devices feature a cutting-edge EC7 co-packed diode with an advanced emitter-controlled design, coupled with high-speed technology to address the escalating need for environmentally conscious and highly efficient power solutions. Using the latest micro-pattern trench technology, the TRENCHSTOP IGBT7 H7 offers excellent control and performance, resulting in significant loss reduction, improved efficiency and higher power density. As a result, the device is ideal for various applications such as string inverters, energy storage systems (ESS), electric vehicle charging applications, and traditional applications such as industrial UPS and welding.
17.08.2023 14:15 Spark Connected and Infineon Technologies unveil 500 W wireless charging module
Dallas, Texas, and Munich, Germany – 17 August 2023 – Spark Connected, a global leader in developing advanced, safe and innovative wireless power technology, and Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), are announcing the market release of a 500 W wireless charging solution named Yeti. The ready-to-integrate wireless charging module is intended for the powering and charging of industrial machinery, autonomous mobile robots, automated guided vehicles, light electric vehicles, e-Mobility and other power-intensive applications.
16.08.2023 10:00 More computing power, less greenhouse gas – Infineon and Chicony Power collaborate on GAN-based PD3.1 notebook adapter solutions
Munich, 16 August 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) enables high performance with smaller size and lower energy loss in power conversion using semiconductors based on gallium nitride (GaN). Chicony Power Technology (Chicony Power; TWSE: 6412), a leading manufacturer of power supplies and a power electronics expert, is expanding the partnership with Infineon to increase the performance of its latest PD3.1 notebook adapter series. In strengthening their collaboration, the two companies will provide end customers with highly efficient power solutions based on GaN, with a smaller form factor and higher power density.
10.08.2023 10:15 Infineon introduces new automotive 60 V and 120 V OptiMOS™ 5 in TOLx packages for 24 V-72 V supplied high power ECUs
Munich, Germany – 10 August, 2023 – The electrification of the transportation system is advancing continuously. In addition to passenger cars, 2- and 3-wheelers as well as light vehicles are increasingly being electrified. Therefore, the automotive market for Electronic Control Units (ECUs) powered by 24 V-72 V is expected to keep growing in the coming years. To address this development, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is complementing its OptiMOS™ 5 portfolio of automotive MOSFETs in the 60 V and 120 V range with new products in the high power packages TOLL, TOLG and TOLT. They are offering a compact form factor with very good thermal performance combined with excellent switching behavior.
08.08.2023 12:08 TSMC, Bosch, Infineon, and NXP Establish Joint Venture to Bring Advanced Semiconductor Manufacturing to Europe
Hsinchu, Stuttgart, Munich, Eindhoven, Aug 8, 2023 – TSMC (TWSE: 2330, NYSE: TSM), Robert Bosch GmbH, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), and NXP Semiconductors N.V. (NASDAQ: NXPI) today announced a plan to jointly invest in European Semiconductor Manufacturing Company (ESMC) GmbH, in Dresden, Germany to provide advanced semiconductor manufacturing services. ESMC marks a significant step towards construction of a 300mm fab to support the future capacity needs of the fast-growing automotive and industrial sectors, with the final investment decision pending confirmation of the level of public funding for this project. The project is planned under the framework of the European Chips Act.
07.08.2023 14:15 Automotive motor control: New MOTIX™ MCU embedded power IC-families with CAN FD interface provide faster communication and higher performance
Munich, Germany – 07 August, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the TLE988x and TLE989x families extending the company’s comprehensive and proven portfolio of MOTIX™ MCU embedded power ICs. By integrating a gate driver, microcontroller, communication interface and power supply on a single chip, Infineon’s system-on-chip solutions achieve a minimal footprint. The new TLE988x and TLE989x families offer higher performance and now feature CAN (FD) as the communication interface. The ICs are AEC Q-100 qualified, making them ideal for automotive brushed DC and brushless DC motor control applications in body, comfort, and thermal management applications.
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