| 07.03.2025 14:15 |
Accelerating and simplifying software development: Infineon launches Drive Core for AURIX™, TRAVEO™ and PSOC™ |
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Munich, Germany – 7 March 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is launching Drive Core, a scalable software bundle portfolio for AURIX™, TRAVEO™ and PSOC™ that facilitates a rapid start into automotive software development. Drive Core bundles pre-integrated software and tools from Infineon and third-party providers ready-to-use under a three-month evaluation license. |
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| 06.03.2025 10:15 |
Infineon brings RISC-V to the automotive industry and is first to announce an automotive RISC-V microcontroller family |
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Munich, Germany – 6 March 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) leads the way for the adoption of RISC-V in the automotive industry: The company will launch a new automotive microcontroller family based on RISC-V within the coming years. This new family will become part of Infineon’s established automotive microcontroller brand AURIX™. It will extend the company’s existing automotive microcontroller portfolio, which is based on TriCore™ (AURIX TC family) and Arm® (TRAVEO™ family, PSOC™ family). The new AURIX family will cover a wide range of automotive applications from entry-level MCUs up to high-performance MCUs beyond what is available in the market today. At Embedded World 2025, Infineon now introduces a virtual prototype enabled by key ecosystem partners. This is a starter kit for Infineon’s partners to begin pre-silicon software development. |
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| 05.03.2025 15:15 |
Infineon extends radiation-tolerant power MOSFET portfolio for space applications with first P-channel device |
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Munich, Germany – 5 March, 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the addition of P-channel power MOSFETs to its family of radiation-tolerant power MOSFETs for Low-Earth-Orbit (LEO) space applications. The new devices are part of Infineon’s expanding portfolio designed for next-generation “NewSpace” applications, providing cost-optimized radiation-tolerant MOSFETs that enable engineers to achieve faster time-to-market designs using smaller and lighter weight components with radiation performance suitable for missions lasting two to five years. |
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| 04.03.2025 10:15 |
Infineon announces PSOC™ 4 Multi-Sense; expands capacitive sensing technology with inductive and liquid sensing solutions |
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Munich, Germany – 4 March 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced that its PSOC™ 4 microcontroller (MCU) family now features Multi-Sense capabilities. Infineon expands its leading capacitive sensing technology CAPSENSE™ with a new, proprietary inductive sensing technology, as well as a non-invasive and non-contact liquid sensing solution. With PSOC 4, developers now have endless possibilities to develop new HMI and sensing solutions. From sleek metallic product designs with touch on metal buttons, to waterproof touch buttons, and innovative ways of sensing liquids, PSOC 4 Multi-Sense unlocks new possibilities of sensing. |
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| 03.03.2025 10:10 |
Infineon achieves ISO/SAE 21434 certification for AURIX™ TC4x and plans certification for TC3x family |
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Munich, Germany – 03 March 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has achieved a significant milestone in automotive cybersecurity. The company received ISO/SAE 21434 certification for its AURIX™ TC4Dx microcontroller. The certification, granted by TÜV SGS, confirms compliance with stringent cybersecurity standards, ensuring secured development processes and risk management throughout a vehicle’s lifecycle. Infineon is also pursuing ISO/SAE 21434 certification for its AURIX TC3x microcontroller family to help customers meet national and global cybersecurity regulations such as UN R155. |
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| 28.02.2025 09:15 |
Infineon sensor technology enables integration of industry-first 5-axis robot arm for next-level cleaning robots |
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Munich, Germany – 28 February 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a global semiconductor leader in power systems and loT, provides sensor technology to Roborock for its state-of-the-art Saros Z70 robotic vacuum. The standout feature of the smart robot is its industry-first 5-axis robot arm that can move obstacles out of its way and clean in areas that were previously blocked. This innovation is made possible by the small form factor of Infineon’s REAL3™ Time-of-Flight (ToF) technology. Unveiled at CES 2025 in Las Vegas, today, Roborock launched the new Saros series in Germany. |
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