| Press Releases 1 to 6 of 249 |
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| Other languages: Deutsch | English | Français | Italiano | Español |
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| 14.10.2025 09:30 |
ROHM Publishes White Paper on Power Solutions for Next-Generation 800 VDC Architecture |
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ROHM has released a new white paper detailing advanced power solutions for AI data centers based on the novel 800 VDC architecture, reinforcing its role as a key semiconductor industry player in driving system innovation. |
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| 09.10.2025 09:00 |
ROHM appointed Dr. Christian Felgemacher as Director Application Engineering |
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Willich, October 9, 2025 – ROHM Semiconductor GmbH is pleased to announce the appointment of Dr. Christian Felgemacher as Director Application Engineering. Since October first, he has been responsible for both the operational coordination of technical customer support and the strategic direction of ROHM's application engineering activities in Europe. |
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| 30.09.2025 14:00 |
ROHM has Developed New Smart Switches Optimized for Zonal Controllers |
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Willich-Münchheide, Germany, September 30, 2025 – ROHM has developed six new high-side Smart Switches (Intelligent Power Devices, short: IPDs) BV1HBxxxEFJ series (BV1HB008EFJ-C, BV1HB012EFJ-C, BV1HB020EFJ-C, BV1HB040EFJ-C, BV1HB090EFJ-C, BV1HB180EFJ-C) with highly accurate current sensing capability and ON resistances from 9 milliohm to 180 milliohm. They are ideal for protecting loads and subsystems from abnormalities such as overcurrent, overvoltage, and overtemperature, ensuring reliable operation and safeguarding sensitive components in automotive lighting, body control such as, door locks and power windows. Extensive diagnostic capabilities, e.g., open load and reverse battery detection, further enhances safety and reliability. |
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| 25.09.2025 09:00 |
ROHM and Infineon collaborate on silicon carbide power electronics packages to enhance flexibility for customers |
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Kyoto, Japan and Munich, Germany, September 25, 2025 - ROHM and Infineon Technologies AG have signed a Memorandum of Understanding to collaborate on packages for silicon carbide (SiC) power semiconductors used in applications such as on-board chargers, photovoltaics, energy storage systems, and AI data centers. Specifically, the partners aim to enable each other as second sources of selected packages for SiC power devices, a move which will increase design and procurement flexibility for their customers. In the future, customers will be able to source devices with compatible housings from both ROHM and Infineon. The collaboration will ensure seamless compatibility and interchangeability to match specific customer needs. |
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| 16.09.2025 14:00 |
ROHM Launches 2-in-1 SiC Molded Module “DOT-247” |
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Willich-Münchheide, Germany, September 16, 2025 – ROHM has developed the "DOT-247," a 2-in-1 SiC molded module (SCZ40xxDTx, SCZ40xxKTx), ideal for industrial applications such as PV inverters, UPS systems, and semiconductor relays. The module retains the versatility of the widely adopted "TO-247" package while achieving high design flexibility and power density. |
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| 09.09.2025 14:00 |
ROHM has Developed Ultra-Compact CMOS Op Amp: Delivering Industry-Leading* Ultra-Low Circuit Current |
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Willich-Münchheide, Germany, September 09, 2025 – ROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current. This IC is optimized to be applied as a measurement sensing amplifier in size-constrained applications such as handheld measurement instruments, wearable devices, and indoor motion detectors. |
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