Press Releases of ROHM Semiconductor http://www.presseagentur.com/?lang=en Latest press releases of ROHM Semiconductor (Provided by MEXPERTS AG) en-US ROHM Semiconductor MEXPERTS AG (info@mexperts.de) Copyright 2010 MEXPERTS AG 2026-06-10T17:31+01:00 presseagentur.com - the press portal of MEXPERTS AG http://www.presseagentur.com/?lang=en http://www.presseagentur.com/pics/rdf_logo.gif ROHM launches New Top-Side Cooling Package for SiC MOSFETs, Combining High Heat Dissipation with High Voltage Support http://www.presseagentur.com/rohm/detail.php?pr_id=7720&lang=en Willich-Münchheide, Germany, June 09, 2026 – ROHM has developed the TSC3PAK (14.00 × 18.58 × 3.50mm) package for SiC MOSFETs. By adopting a top-side heat dissipation structure that places the heat dissipation surface on the top of the package, the new product enables automated mounting while achieving heat dissipation performance comparable to that of conventional through-hole packages (TO-247-4L). This contributes to greater efficiency and reliability in power conversion circuits for onboard chargers (OBCs) and electric compressors used in xEVs (electric vehicles). 2026-06-09T09:00+01:00 ROHM’s SiC MOSFET Adopted in BBU for AI Servers as HVDC Architectures Advance http://www.presseagentur.com/rohm/detail.php?pr_id=7718&lang=en Willich-Münchheide, Germany, June 03, 2026 – ROHM has announced that its 750 V SiC MOSFET has been adopted in a BBU (Battery Backup Unit) for AI server power supplies. With the rise of generative AI, AI server power systems are shifting to higher voltages and rapidly transitioning to HVDC (high-voltage direct current) architectures. In this environment, ROHM’s device was selected as a SiC power device that supports next-generation power supply systems. 2026-06-03T14:00+01:00 ROHM PLECS Simulator Now Available for Rapid Power Electronics Circuit Verification http://www.presseagentur.com/rohm/detail.php?pr_id=7703&lang=en Willich-Münchheide, Germany, May 28, 2026 – ROHM has released the ROHM PLECS Simulator on ROHM’s official website. This simulation tool enables designers of power electronics circuits and system designers to rapidly simulate the operation of ROHM’s power devices online. The tool is based on the PLECS simulation software. 2026-05-28T14:00+01:00 ROHM at PCIM Europe 2026: Advancing SiC Power Technology for E-Mobility and Industry http://www.presseagentur.com/rohm/detail.php?pr_id=7699&lang=en Willich/Nuremberg, Germany, May 26, 2026 – ROHM will exhibit at PCIM Expo & Conference 2026, the leading international event for power electronics, intelligent motion, renewable energy and energy management – taking place June 9 to 11, 2026, in Nuremberg, Germany. This year, ROHM invites its visitors to booth 318 in hall 9. 2026-05-26T10:00+01:00 ROHM Launches ESD Protection Diodes for High-Speed Interfaces Exceeding 10 Gbps http://www.presseagentur.com/rohm/detail.php?pr_id=7696&lang=en Willich-Münchheide, Germany, May 21, 2026 – ROHM has developed new Electro-Static Discharge (ESD) protection diodes – the RESDxVx series – that achieve both industry-leading low dynamic resistance (Rdyn) and ultra-low capacitance. This makes them suitable for a wide range of high-speed data communication applications. 2026-05-21T14:00+01:00 ROHM’s Scalable Power Supply Solutions for Automotive SoCs http://www.presseagentur.com/rohm/detail.php?pr_id=7690&lang=en Willich-Münchheide, Germany, May 19, 2026 – ROHM has developed a configurable power supply solution that combines the PMIC BD968xxC Series with the DrMOS BD96340MFFC, targeting automotive SoCs used in applications such as ADAS (Advanced Driver Assistance Systems), DMS (Driver Monitoring Systems), and sensing cameras. 2026-05-19T14:00+01:00 ROHM launches an Ultra-Compact Wireless Power Chipset for Wearables http://www.presseagentur.com/rohm/detail.php?pr_id=7665&lang=en Willich-Münchheide, Germany, April 28, 2026 – ROHM has developed a wireless power supply IC chipset consisting of the receiver - ML7670 - and transmitter - ML7671 - compatible with Near Field Communication (NFC) technology for compact wearables such as smart rings and smart bands as well as peripheral devices like smart pens. 2026-04-28T14:00+01:00 ROHM Develops 5th Generation SiC MOSFETs with Approx. 30% Lower On-Resistance at High Temperatures http://www.presseagentur.com/rohm/detail.php?pr_id=7661&lang=en Willich-Münchheide, Germany, April 21, 2026 – ROHM has developed the latest device of its EcoSiC series: the 5th Generation SiC MOSFETs optimized for highefficiency power applications. This technology is ideally suitable for automotive electric powertrain systems – such as traction inverters for electric vehicles (xEVs) – as well as power supplies for AI servers and industrial equipment such as data centers. 2026-04-21T09:00+01:00 ROHM has added New Lineup of 17 High-Performance Op Amps Enhancing Design Flexibility http://www.presseagentur.com/rohm/detail.php?pr_id=7649&lang=en Willich-Münchheide, Germany, March 31, 2026 – ROHM has added the new CMOS Operational Amplifier (op amp) series “TLRx728” and “BD728x“ to its lineup. These are suitable for a wide range of applications including automotive, industrial, and consumer systems. A broad lineup also makes product selection easier. 2026-03-31T14:00+01:00 ROHM has Introduced Reference Designs for Three-Phase Inverters Featuring New SiC Power Modules http://www.presseagentur.com/rohm/detail.php?pr_id=7639&lang=en Willich-Münchheide, Germany, March 17, 2026 – ROHM has released reference designs "REF68005", "REF68006", and "REF68004" for three-phase inverter circuits featuring EcoSiC brand SiC molded modules "HSDIP20", "DOT-247", and "TRCDRIVE pack" on ROHM’s website. Designers can use the data provided in these reference designs to create the drive circuit boards. When combined with ROHM's SiC modules, these designs help reduce the person-hours required for device evaluation. 2026-03-17T14:00+01:00