http://www.presseagentur.com/?lang=en Latest press releases of ROHM Semiconductor (Provided by MEXPERTS AG) en-US ROHM Semiconductor MEXPERTS AG (info@mexperts.de) Copyright 2010 MEXPERTS AG 2026-07-25T23:06+01:00 http://www.presseagentur.com/?lang=en http://www.presseagentur.com/pics/rdf_logo.gif http://www.presseagentur.com/rohm/detail.php?pr_id=7761&lang=en Willich-Münchheide, Germany, July 22, 2026 – ROHM has developed a new evaluation board, the BD83070GWL-EVK-002. It is designed to fully demonstrate the features of the BD83070GWL DC-DC converter IC, which combines high efficiency with ultra-low current consumption. 2026-07-22T14:00+01:00 http://www.presseagentur.com/rohm/detail.php?pr_id=7754&lang=en Willich-Münchheide, Germany, July 09, 2026 – ROHM has developed a new lineup of 600V Super Junction MOSFETs, the R60xxXNx and R60xxWNx series. 2026-07-09T14:00+01:00 http://www.presseagentur.com/rohm/detail.php?pr_id=7729&lang=en Willich-Münchheide, Germany, June 17, 2026 – ROHM has developed the “AG16xFNxx Series,” a lineup of 80V power MOSFETs designed for 48V power supply systems, which are becoming increasingly common in automotive applications. 2026-06-17T14:00+01:00 http://www.presseagentur.com/rohm/detail.php?pr_id=7720&lang=en Willich-Münchheide, Germany, June 09, 2026 – ROHM has developed the TSC3PAK (14.00 × 18.58 × 3.50mm) package for SiC MOSFETs. By adopting a top-side heat dissipation structure that places the heat dissipation surface on the top of the package, the new product enables automated mounting while achieving heat dissipation performance comparable to that of conventional through-hole packages (TO-247-4L). This contributes to greater efficiency and reliability in power conversion circuits for onboard chargers (OBCs) and electric compressors used in xEVs (electric vehicles). 2026-06-09T09:00+01:00 http://www.presseagentur.com/rohm/detail.php?pr_id=7718&lang=en Willich-Münchheide, Germany, June 03, 2026 – ROHM has announced that its 750 V SiC MOSFET has been adopted in a BBU (Battery Backup Unit) for AI server power supplies. With the rise of generative AI, AI server power systems are shifting to higher voltages and rapidly transitioning to HVDC (high-voltage direct current) architectures. In this environment, ROHM’s device was selected as a SiC power device that supports next-generation power supply systems. 2026-06-03T14:00+01:00 http://www.presseagentur.com/rohm/detail.php?pr_id=7703&lang=en Willich-Münchheide, Germany, May 28, 2026 – ROHM has released the ROHM PLECS Simulator on ROHM’s official website. This simulation tool enables designers of power electronics circuits and system designers to rapidly simulate the operation of ROHM’s power devices online. The tool is based on the PLECS simulation software. 2026-05-28T14:00+01:00 http://www.presseagentur.com/rohm/detail.php?pr_id=7699&lang=en Willich/Nuremberg, Germany, May 26, 2026 – ROHM will exhibit at PCIM Expo & Conference 2026, the leading international event for power electronics, intelligent motion, renewable energy and energy management – taking place June 9 to 11, 2026, in Nuremberg, Germany. This year, ROHM invites its visitors to booth 318 in hall 9. 2026-05-26T10:00+01:00 http://www.presseagentur.com/rohm/detail.php?pr_id=7696&lang=en Willich-Münchheide, Germany, May 21, 2026 – ROHM has developed new Electro-Static Discharge (ESD) protection diodes – the RESDxVx series – that achieve both industry-leading low dynamic resistance (Rdyn) and ultra-low capacitance. This makes them suitable for a wide range of high-speed data communication applications. 2026-05-21T14:00+01:00 http://www.presseagentur.com/rohm/detail.php?pr_id=7690&lang=en Willich-Münchheide, Germany, May 19, 2026 – ROHM has developed a configurable power supply solution that combines the PMIC BD968xxC Series with the DrMOS BD96340MFFC, targeting automotive SoCs used in applications such as ADAS (Advanced Driver Assistance Systems), DMS (Driver Monitoring Systems), and sensing cameras. 2026-05-19T14:00+01:00 http://www.presseagentur.com/rohm/detail.php?pr_id=7665&lang=en Willich-Münchheide, Germany, April 28, 2026 – ROHM has developed a wireless power supply IC chipset consisting of the receiver - ML7670 - and transmitter - ML7671 - compatible with Near Field Communication (NFC) technology for compact wearables such as smart rings and smart bands as well as peripheral devices like smart pens. 2026-04-28T14:00+01:00