<?xml version="1.0" encoding="iso-8859-1"?>
<rdf:RDF
  xmlns:rdf="http://www.w3.org/1999/02/22-rdf-syntax-ns#"
  xmlns="http://purl.org/rss/1.0/"
  xmlns:dc="http://purl.org/dc/elements/1.1/"
>
<channel rdf:about="http://www.presseagentur.com">
    <title>Press Releases of ROHM Semiconductor</title>
    <link>http://www.presseagentur.com/?lang=en</link>
    <description>Latest press releases of ROHM Semiconductor (Provided by MEXPERTS AG)</description>
	<language>en-US</language>
	<publisher>ROHM Semiconductor</publisher>
	<creator>MEXPERTS AG (info@mexperts.de)</creator>
	<rights>Copyright 2010 MEXPERTS AG</rights>
    <date>2026-10-06T12:11+01:00</date>
	<image rdf:resource="http://www.presseagentur.com/pics/rdf_logo.gif">
		<title>presseagentur.com - the press portal of MEXPERTS AG</title>
    	<link>http://www.presseagentur.com/?lang=en</link>
 	   	<url>http://www.presseagentur.com/pics/rdf_logo.gif</url>
	</image>
	<items>
	<rdf:Seq>
	
		<rdf:li rdf:resource="http://www.presseagentur.com/rohm/detail.php?pr_id=7801&#38;lang=en" />
	
		<rdf:li rdf:resource="http://www.presseagentur.com/rohm/detail.php?pr_id=7799&#38;lang=en" />
	
		<rdf:li rdf:resource="http://www.presseagentur.com/rohm/detail.php?pr_id=7796&#38;lang=en" />
	
		<rdf:li rdf:resource="http://www.presseagentur.com/rohm/detail.php?pr_id=7780&#38;lang=en" />
	
		<rdf:li rdf:resource="http://www.presseagentur.com/rohm/detail.php?pr_id=7772&#38;lang=en" />
	
		<rdf:li rdf:resource="http://www.presseagentur.com/rohm/detail.php?pr_id=7764&#38;lang=en" />
	
		<rdf:li rdf:resource="http://www.presseagentur.com/rohm/detail.php?pr_id=7761&#38;lang=en" />
	
		<rdf:li rdf:resource="http://www.presseagentur.com/rohm/detail.php?pr_id=7754&#38;lang=en" />
	
		<rdf:li rdf:resource="http://www.presseagentur.com/rohm/detail.php?pr_id=7729&#38;lang=en" />
	
		<rdf:li rdf:resource="http://www.presseagentur.com/rohm/detail.php?pr_id=7720&#38;lang=en" />
	
	</rdf:Seq>
	</items>
</channel>

<item rdf:about="http://www.presseagentur.com/rohm/detail.php?pr_id=7801&#38;lang=en">
	<title>ROHM&#39;s Silicon Carbide contributes to the “Neue Klasse” Electric Powertrain Architecture of BMW</title>
	<link>http://www.presseagentur.com/rohm/detail.php?pr_id=7801&#38;lang=en</link>
	<description>Willich-Münchheide, September 17, 2026 – ROHM Semiconductor announces that its innovative power semiconductor solutions are being utilized in electric vehicle platforms from a leading global premium automotive manufacturer. In BMW’s “Neue Klasse”, ROHM’s SiC (Silicon Carbide) chips support the efficiency, performance, and reliability of the vehicle&#39;s electric powertrain systems.</description>
	<dc:date>2026-09-17T09:00+01:00</dc:date>
</item>

<item rdf:about="http://www.presseagentur.com/rohm/detail.php?pr_id=7799&#38;lang=en">
	<title>ROHM Launches a MOSFET with Industry-Leading* Wide-SOA for Automotive Safety Functions and Protection Circuits</title>
	<link>http://www.presseagentur.com/rohm/detail.php?pr_id=7799&#38;lang=en</link>
	<description>Willich-Münchheide, Germany, September 15, 2026 – ROHM has developed the RS4P063BPHZG, a 100V MOSFET optimized for automotive safety functions and protection circuits. The new product achieves industry-leading* Wide-SOA (Safe Operating Area) across a broad voltage range in the standard HPLF5060 (5060-size) package widely used in automotive applications. By incorporating a design that effectively suppresses secondary breakdown, it delivers approximately 5 times the SOA tolerance of standard equivalent-sized products under VDS=100V and PW=100&#956;s. This contributes to greater reliability in automotive applications subject to momentary high-power loads, including airbag inflator ignition circuits and seatbelt pretensioner drive circuits.</description>
	<dc:date>2026-09-15T14:00+01:00</dc:date>
</item>

<item rdf:about="http://www.presseagentur.com/rohm/detail.php?pr_id=7796&#38;lang=en">
	<title>ROHM’s New High Anti-Surge Chip Resistors SDR01 Series Achieve 0.33W Rated Power in the 0402 Size</title>
	<link>http://www.presseagentur.com/rohm/detail.php?pr_id=7796&#38;lang=en</link>
	<description>Willich-Münchheide, Germany, September 10, 2026 – ROHM has developed the “SDR01 Series” of high anti-surge chip resistors, delivering a class-leading* rated power of 0.33W in the 0402 (1005 Metric) size. Designed for electronic equipment where mounting densities continue to increase, the series is well suited for automotive, industrial, consumer electronics, and AI server applications. The new products help save board space and reduce component count by enabling replacement of larger-size resistors and consolidation of resistors while maintaining the reliability required of anti-surge chip resistors.</description>
	<dc:date>2026-09-10T14:00+01:00</dc:date>
</item>

<item rdf:about="http://www.presseagentur.com/rohm/detail.php?pr_id=7780&#38;lang=en">
	<title>ROHM Introduces 650V IGBTs Achieving Industry-Leading* Low Loss Characteristics </title>
	<link>http://www.presseagentur.com/rohm/detail.php?pr_id=7780&#38;lang=en</link>
	<description>Willich-Münchheide, Germany, August 25, 2026 – ROHM has developed 4th Generation 650V IGBTs ideal for automotive electric compressors and HV heaters, as well as inverters for industrial equipment. As automotive-grade 650V-class products, new IGBTs achieve class-leading* low conduction loss with VCE(sat)= 1.55V, while providing high short-circuit tolerance and complying with the AEC-Q101 automotive reliability standard.</description>
	<dc:date>2026-08-25T14:00+01:00</dc:date>
</item>

<item rdf:about="http://www.presseagentur.com/rohm/detail.php?pr_id=7772&#38;lang=en">
	<title>ROHM’s New 2nd Generation Terahertz Wave Oscillation Device Delivers 4 Times Higher Output Power</title>
	<link>http://www.presseagentur.com/rohm/detail.php?pr_id=7772&#38;lang=en</link>
	<description>Willich-Münchheide, Germany, August 4, 2026 – ROHM has developed a 2nd Generation terahertz (THz) wave oscillation device using semiconductor elements known as Resonant Tunneling Diodes (RTDs). ROHM is making the device available via the RTD-EVK-G2 Terahertz Wave Device Evaluation Kit, which includes a sample device, cable, and evaluation board. The kit enables companies and research institutions to evaluate THz wave oscillation and detection in a compact development environment.</description>
	<dc:date>2026-08-04T14:00+01:00</dc:date>
</item>

<item rdf:about="http://www.presseagentur.com/rohm/detail.php?pr_id=7764&#38;lang=en">
	<title>ROHM Launches “Engineer Social Hub”: Engineers supporting Engineers</title>
	<link>http://www.presseagentur.com/rohm/detail.php?pr_id=7764&#38;lang=en</link>
	<description>Willich-Münchheide, Germany, July 30, 2026 – ROHM Co., Ltd. announces the launch of the English-language version of Engineer Social Hub, an online platform designed to make ROHM’s technical information, know-how, and support more accessible to engineers. Engineer Social Hub brings together ROHM’s technical content related to semiconductor products and solutions in one place. Through product-specific FAQs and discussions, as well as a chatbot, users can search for solutions to technical questions and obtain direct support from ROHM engineers.</description>
	<dc:date>2026-07-30T14:00+01:00</dc:date>
</item>

<item rdf:about="http://www.presseagentur.com/rohm/detail.php?pr_id=7761&#38;lang=en">
	<title>New Buck-Boost DC-DC Eval Board for Ultra-Compact Mounting </title>
	<link>http://www.presseagentur.com/rohm/detail.php?pr_id=7761&#38;lang=en</link>
	<description>Willich-Münchheide, Germany, July 22, 2026 – ROHM has developed a new evaluation board, the BD83070GWL-EVK-002. It is designed to fully demonstrate the features of the BD83070GWL DC-DC converter IC, which combines high efficiency with ultra-low current consumption.</description>
	<dc:date>2026-07-22T14:00+01:00</dc:date>
</item>

<item rdf:about="http://www.presseagentur.com/rohm/detail.php?pr_id=7754&#38;lang=en">
	<title>ROHM Launches 600V Super Junction MOSFETs in Surface-Mount Package with High Thermal Performance</title>
	<link>http://www.presseagentur.com/rohm/detail.php?pr_id=7754&#38;lang=en</link>
	<description>Willich-Münchheide, Germany, July 09, 2026 – ROHM has developed a new lineup of 600V Super Junction MOSFETs, the R60xxXNx and R60xxWNx series. </description>
	<dc:date>2026-07-09T14:00+01:00</dc:date>
</item>

<item rdf:about="http://www.presseagentur.com/rohm/detail.php?pr_id=7729&#38;lang=en">
	<title>ROHM Launches AG16xFNxx Series MOSFETs for Automotive 48V Power Supply Systems</title>
	<link>http://www.presseagentur.com/rohm/detail.php?pr_id=7729&#38;lang=en</link>
	<description>Willich-Münchheide, Germany, June 17, 2026 – ROHM has developed the “AG16xFNxx Series,” a lineup of 80V power MOSFETs designed for 48V power supply systems, which are becoming increasingly common in automotive applications.</description>
	<dc:date>2026-06-17T14:00+01:00</dc:date>
</item>

<item rdf:about="http://www.presseagentur.com/rohm/detail.php?pr_id=7720&#38;lang=en">
	<title>ROHM launches New Top-Side Cooling Package for SiC MOSFETs, Combining High Heat Dissipation with High Voltage Support</title>
	<link>http://www.presseagentur.com/rohm/detail.php?pr_id=7720&#38;lang=en</link>
	<description>Willich-Münchheide, Germany, June 09, 2026 – ROHM has developed the TSC3PAK (14.00 × 18.58 × 3.50mm) package for SiC MOSFETs. By adopting a top-side heat dissipation structure that places the heat dissipation surface on the top of the package, the new product enables automated mounting while achieving heat dissipation performance comparable to that of conventional through-hole packages (TO-247-4L). This contributes to greater efficiency and reliability in power conversion circuits for onboard chargers (OBCs) and electric compressors used in xEVs (electric vehicles).</description>
	<dc:date>2026-06-09T09:00+01:00</dc:date>
</item>


</rdf:RDF>
