Press Releases 1 to 6 of 1868
17.09.2026 10:15 Infineon EiceDRIVER™ 2EDL6014AC-G2D dual channel gate driver delivers high density and thermal performance for AI datacenter power designs
Munich, Germany – 17 September 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the EiceDRIVER™ 2EDL6014AC-G2D, a 120 V junction-isolated dual channel floating output gate driver engineered for high-density silicon power designs in AI datacenter applications. Housed in a compact WQFN-12 2.2 mm x 2.2 mm package, the device addresses the growing demand for power conversion solutions that deliver higher server rack density without sacrificing reliability or thermal performance. The 2EDL6014AC-G2D supports dual high-side, dual low-side, and half-bridge configurations, making it a versatile platform driver across the switched-capacitor and multilevel topologies increasingly adopted in next-generation AI server power architectures.
09.09.2026 13:45 Infineon extends collaboration with SolarEdge to enable solid-state protection for 800 VDC AI data centers
–    Companies extend collaboration into solid-state circuit breaker (SSCB) technology in line with leading industry framework for 800 Volts direct current (VDC) architecture  
–    SSCB technology is designed to interrupt DC faults orders of magnitude faster than electromechanical breakers, addressing one of the key challenges in deploying high-voltage DC power architectures
–    The collaboration advances a DC-native power architecture from medium-voltage grid connection through distribution to the rack, to support higher density, greater reliability and reduced environmental impact for AI data centers

Munich, Germany and Milpitas, California – 9 September, 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and SolarEdge Technologies, Inc. (NASDAQ: SEDG), a global leader in smart energy, today announced an extension of their collaboration to advance solid-state circuit breaker (SSCB) technology for high-voltage DC distribution in AI and hyperscale data centers. The collaboration addresses a key challenge in the adoption of 800 VDC architecture: Safe operation of increasingly power-dense infrastructure requires a very fast fault-isolation to achieve selectivity while maintaining high efficiency.
08.09.2026 10:15 New Infineon OPTIREG™ TLE9744QK Power Management IC integrates power and safety for hybrid and electric vehicle traction inverters
Munich, Germany – 8 September 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has introduced the OPTIREG™ PMIC TLE9744QK, a fully integrated Power Management IC (PMIC) specifically designed for high-voltage traction inverter applications in electric and hybrid vehicles. It consolidates complete power-supply functions, resolver excitation, and a dedicated safety engine into a single device. This simplifies traction inverter Electronic Control Unit (ECU) design and addresses the complex challenge of supplying multiple isolated power rails for microcontrollers, communication modules, and sensors. By replacing multiple discrete components with this single-chip solution, the TLE9744QK directly reduces system cost and complexity. This integration significantly lowers the bill-of-materials (BOM) count and shrinks the PCB footprint by up to 70 percent for the replaced devices, while enhancing overall system reliability and functional safety.
07.09.2026 10:15 Infineon sets new power benchmark for AI accelerators and vertical power delivery with 2 A/mm² dual-phase smart power stages
Munich, Germany – 7 September 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the TDA235E5 and TDA235E0, a dual-phase smart power stage family designed to meet the rapidly growing power density requirements of next-generation AI accelerators and vertical power delivery modules. Integrating Infineon's OptiMOS™ 6 MOSFETs and a dual-phase driver IC in a compact 6 x 6 x 0.8 mm³ package, the new family delivers benchmark power density exceeding 2 A/mm², setting a new reference point for power stage performance in high-current AI processor applications. As hyperscalers and datacenter operators continue to scale AI infrastructure, the demand for power delivery solutions that combine higher current capability with shrinking physical footprints is becoming a critical bottleneck.
03.09.2026 10:15 Infineon’s SECORA™ Wallet brings secured NFC payments to mPTech’s Hammer smartwatch
Munich, Germany – 3 September 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and mPTech are strengthening their cooperation to bring secured, convenient payment experiences to the next generation of wearables. mPTech, a European original equipment manufacturer (OEM) has integrated Infineon’s SECORA™ secured payment technology into its latest flagship Hammer smartwatch, combining Infineon’s expertise in secured payment solutions with mPTech’s strong position in consumer electronics. The collaboration shows how Infineon’s SECORA One-stop-shop solution including both SECORA Connect X and SECORA Wallet can help wearable OEMs accelerate the integration of secured and CDCVM-enabled payments into consumer wearable devices.
02.09.2026 10:15 Infineon and Skeleton collaborate on solid-state transformers and sidecars for AI power to enhance AI data center resilience
Munich, Germany – 2 September 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Skeleton Technologies, a global leader in high-power energy storage systems inter alia for AI data centers, have signed a Memorandum of Understanding (MoU) to collaborate on high-efficiency, resilient power solutions for modern data centers. The rapid growth of AI, increasing power demand and the need for highly reliable digital infrastructure are driving a new generation of power architecture. Solid-state transformers (SSTs) and high-power sidecars are increasingly important building blocks for AI data center infrastructure. They enable more efficient power conversion from grid to core and higher system resilience. Accordingly, the two companies aim to advance these technologies to improve energy efficiency and system performance throughout the power delivery chain.
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