| Press Releases 1 to 6 of 1884 |
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| 15.10.2026 14:00 |
Infineon signs 200-millimeter silicon carbide wafer supply agreement with Wolfspeed to further strengthen supply chain resilience |
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– Multi-year agreement with Wolfspeed supports Infineon’s conversion from 150-millimeter to 200-millimeter silicon carbide (SiC) manufacturing
– Expanded substrate sourcing strengthens supply chain resilience and enhances flexibility to support future growth
– Agreement supports growing demand for SiC power semiconductors for electric vehicles, renewable energy systems and AI datacenter power infrastructure
Munich, Germany and Durham, N.C – 15 October 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Wolfspeed, Inc. (NYSE: WOLF) have signed a new multi-year supply agreement for 200-millimeter silicon carbide (SiC) wafers, transitioning Infineon's existing Wolfspeed supply relationship from 150-millimeter to 200-millimeter substrate technology. SiC semiconductors have become a key enabling technology for the electrification and energy efficiency applications that drive global decarbonization, from electric vehicles and renewable energy systems to AI datacenter power infrastructure. The agreement directly supports Infineon's conversion to 200-millimeter SiC manufacturing, strengthening Infineon's position as the global leader in power semiconductors and reinforcing the supply chain resilience that underpins its SiC growth strategy. |
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| 14.10.2026 10:15 |
Infineon at electronica 2026: Technology for the AI era, from data centers into robots and onto the road |
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Munich, Germany – 14 October 2026 – With artificial intelligence evolving from virtual chatbots into real-world machines and devices, it will shape our lives more than ever. At the electronica trade fair 2026 in Munich, Germany (10 – 13 November), Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) will showcase customer cases, system solutions, and semiconductor innovations for Physical AI across robotics and mobility, intelligent edge devices as well as the infrastructure necessary to power the age of AI. Technology from Infineon helps machines perceive their environment, communicate in a secured way, process data locally through edge AI, and act on it safely and reliably while using energy as efficiently as possible. Visitors will find Infineon at booth 502 in hall C3. |
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| 12.10.2026 16:00 |
Infineon introduces XDP8HD40S-1 high-voltage hot-swap controller, extending its power semiconductor portfolio from grid to core for 800 VDC AI server architectures |
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Munich, Germany – 12 October 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the XDP8HD40S-1, a high-voltage hot-swap controller designed for digital power-path protection and monitoring in next-generation AI server power architectures operating at ±400 Volt and 800 Volt direct current (VDC). As AI clusters scale from 48 V toward higher rack power levels, reliable hot-swap functionality becomes increasingly important for maintaining uninterrupted system operation. The XDP8HD40S-1 enables power modules, converters, GPUs, and server subsystems to be connected and disconnected safely while preserving system integrity, extending Infineon's power semiconductor portfolio, spanning silicon, silicon carbide (SiC), and gallium nitride (GaN), further into the protection and monitoring layer required for scalable AI infrastructure. |
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| 08.10.2026 10:15 |
Infineon introduces 27 kW three-phase PSU solution for next-generation AI server power architectures |
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Munich, Germany – 8 October 2026 – Artificial intelligence workloads are redefining the power requirements of modern data centers. Increasing GPU performance and rising rack densities are driving a shift toward 800 VDC or ±400 VDC power supply architectures. To address these requirements, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is launching a 27kW three-phase power supply unit (PSU) solution for server ODMs and OEMs. The reference design meets the requirements of the OCP Open Rack V3 (ORV3) specification and AI server rack architectures, further expanding Infineon’s comprehensive portfolio for powering AI servers. The solution helps developers shorten time-to-market while improving rack power density, efficiency, and thermal performance. |
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| 07.10.2026 10:15 |
Infineon and ZuriQ deepen partnership to advance scalable quantum chips |
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– Expanding partnership targets the next generation of trapped-ion quantum computing
– Infineon and ZuriQ build on recent technology progress to scale quantum processing units toward commercial systems
– Partners combine Infineon's semiconductor manufacturing expertise with ZuriQ's innovative and highly scalable Penning micro-trap architecture
Munich, Germany / Zurich, Switzerland – 7 October 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and ZuriQ AG, a Swiss quantum computing company spun out of ETH Zurich, today announced the expansion of their collaboration to advance scalable quantum computing hardware. The partnership combines ZuriQ’s pioneering trapped-ion quantum computing architecture with Infineon’s expertise in semiconductor manufacturing, advanced packaging, and integrated photonics. |
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| 06.10.2026 10:15 |
Infineon brings advanced cockpit graphics to cost-efficient microcontroller architectures with TRAVEO™ T2G CYT4EN |
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Munich, Germany – 6 October 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has introduced the TRAVEO™ CYT4EN, a new microcontroller (MCU) for cost-effective high-performance instrument clusters and display applications in the automotive industry, including two-wheelers. The automotive cluster MCU is designed to leverage external LPDDR4 memory, resulting in capabilities that traditionally required more complex SoC (System-on-chip)-based platforms: The device supports advanced 2.5D graphics and 3D scene rendering, drives high-resolution displays up to Full HD, and can power two displays simultaneously. At the same time, it reduces system complexity and the bill of materials compared to SoC-based platforms. |
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