Press Releases 1 to 6 of 965
19.02.2019 12:15 iMOTION™ IMM100 series from Infineon reduces PCB size and R&D efforts significantly
Munich, Germany – 19 February 2019 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces smart IPM motor controllers featuring full hardware and software integration needed for BLDC motor drives of up to 80W without heatsink. The new iMOTION™ IMM100 series combines the motor controller IC ...
07.02.2019 09:15 LG and Infineon to introduce LG G8ThinQ with front-facing Time-of-Flight camera
Munich, Germany, and Seoul, Korea, 7 February 2019 – LG Electronics and Infineon Technologies AG have teamed up to introduce leading edge Time-of-Flight (ToF) technology to smartphone selfie photo lovers world over. Infineon’s REAL3™ image sensor chip will play a key role in the front-facing camera...
05.02.2019 07:35 Infineon closes December quarter with revenue down as forecast and earnings slightly better than expected. Slowing global economic momentum dampens outlook: revenue predicted to remain stable in March quarter
Neubiberg, Germany, 5 February 2019 – Infineon Technologies AG today reports results for the first quarter of the 2019 fiscal year (period ended 31 December 2018). ...
31.01.2019 10:15 Infineon extends its portfolio of CoolSiC™ MOSFET power modules for UPS and energy storage applications
Munich, Germany – 31 January 2019 – Addressing the fast growing demand for Silicon Carbide (SiC) solutions, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) launches new devices in the 1200V CoolSiC™ MOSFET family. The CoolSiC Easy 2B power modules enable engineers to reduce system costs by ...
25.01.2019 11:15 A safe for sensitive data in the car: Volkswagen relies on TPM from Infineon
Munich, Germany – January 25, 2019 – Volkswagen is one of the first car makers to deploy the OPTIGA™ Trusted Platform Module (TPM) 2.0 from Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) as a security solution for the connected car. The chip is designed to protect the vehicle’s communication ...
18.01.2019 11:15 Infineon first chipmaker to be named “Partner of The Year” by Hyundai for cooperation in electro-mobility
Munich, Germany, and Seoul, Korea – 18 January 2019 – Semiconductors are a key enabler for electro-mobility: Hyundai Kia Motors Company named Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) “Partner of the Year 2018” for providing power modules used in hybrid and electric cars. Infineon is the ...
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