| Press Releases 1 to 6 of 1845 |
 |
| 01.07.2026 13:45 |
Infineon successfully completes acquisition of non-optical analog/mixed-signal sensor portfolio from ams OSRAM |
|
Munich, Germany – 1 July 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today completed the acquisition of the non-optical analog/mixed-signal sensor portfolio from ams OSRAM Group (SIX: AMS). The transaction, announced in February 2026, has received all necessary regulatory approvals. With the acquisition, Infineon strengthens its position as a leader in sensors for industrial and automotive applications through a complementary portfolio and expands its product range in medical applications. |
|
|
| 01.07.2026 09:06 |
Infineon receives additional prestigious award for outstanding Investor Relations work |
|
Munich, Germany – 1 July 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has received several awards for its Investor Relations (IR) activities. At the German Investor Relations Award presented by DIRK – the German Investor Relations Association – the Infineon IR team achieved first place for best Investor Relations among all DAX 40 companies for the first time, jointly with Siemens Energy AG. Infineon also ranked third in the categories “Best ESG Communication by a Company” and “Best IR Communication by a Head of IR”. The latter award was presented to Alexander Foltin, Head of Finance, Treasury & Investor Relations, who accepted the prize together with Chief Financial Officer Dr. Sven Schneider at the ceremony in Frankfurt on 30 June. |
|
|
| 26.06.2026 09:45 |
Infineon named as the Company to Beat in AI Data Center Power Semiconductors by Gartner® as of May 18, 2026 |
|
Munich, 26 June 2026 – In a recent report AI Vendor Race: Infineon Is the Company to Beat in AI Data Center Power Semiconductors, Gartner® examined the fast-evolving market for AI data center power semiconductors and identified Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) as "the company to beat" in this space. The report cites Infineon's 'comprehensive product portfolio, manufacturing capabilities and early investment in advanced technologies' as the decisive factors behind its company-to-beat status. According to Gartner, Infineon's front-runner position is being tested by growing competition in silicon carbide (SiC) and gallium nitride (GaN) and by rivals focused on the compute board level, dynamics that Infineon is actively addressing through its broad portfolio and system-level expertise. |
|
|
| 25.06.2026 10:15 |
Infineon introduces the AIROC™ UWB TSL100 for precise positioning and smart presence detection on a single chip |
|
Munich, Germany – 25 June 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today introduced the AIROC™ UWB TSL100, the company’s first-generation ultra-wideband (UWB) product family for precise positioning and smart presence detection. As part of Infineon’s AIROC portfolio, the TSL100 features a new architecture aimed at reducing power consumption and enhancing security. The product family marks the start of a scalable UWB platform intended to support future standards such as IEEE 802.15.4ab and is compliant with industry consortium standards such as CCC, Aliro, and FiRa. The TSL100 combines ranging and sensing capabilities in a single device, enabling applications such as secured vehicle access, in-cabin presence detection, access control, contactless payment, ticketing, and indoor navigation, as well as industrial use cases including asset tracking and collision avoidance. With the introduction of the AIROC™ UWB TSL100, Infineon strengthens its position in secured connected systems and expands its AIROC™ wireless portfolio with a new family of UWB devices. These devices combine precise positioning and smart presence detection on a single chip, addressing growing demand across automotive, consumer, and industrial markets. |
|
|
| 24.06.2026 11:15 |
Infineon RASIC™ CTRX8188F enters mass production as automotive industry's first 8Tx8Rx imaging radar MMIC, accelerating the shift to centralized radar architectures |
|
Munich, Germany – 24 June 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has started the production of the RASIC™ CTRX8188F, a next-generation 8Tx8Rx radar transceiver that positions Infineon at the forefront of the rapidly expanding automotive 4D and HD imaging radar market. The device is ready for production engineered to support edge processing in combination with AURIXTM TC45 and is the first MMIC in the market which enables centralized radar architectures. Centralized radar systems adopt an emerging design approach in which raw sensor data is transmitted directly to a central vehicle computer for processing. This new concept reduces overall system cost while improving performance significantly over conventional edge-processing designs. As automakers and Tier-1 suppliers accelerate investment in advanced driver assistance systems (ADAS) and autonomous driving platforms, the CTRX8188F provides customers with a competitive, production-ready solution that addresses both cost and performance requirements. |
|
|
| 23.06.2026 11:15 |
Infineon CoolGaN™ technology enables new levels of efficiency and power density in BRC Solar's Power Optimizer |
|
Munich, Germany – 23 June 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) announces that BRC Solar GmbH has selected Infineon's CoolGaN™ Transistor 100 V devices as the core switching technology for its Power Optimizer. The CoolGaN Transistor 100 V family delivers industry-leading switching performance and power-handling capability in a compact 3 mm x 5 mm package, enabling panel-level maximum power-point tracking (MPPT) with the highest efficiency and power density available in this class of solar application. The selection underlines the growing adoption of Infineon's GaN technology in renewable energy applications, where superior switching performance, compact form factor, and cost competitiveness are critical design requirements. |
|
|
| |
««
«
1
2
3
4
5
»
»»
|
|
|
|
|
|
