| Press Releases 7 to 12 of 1771 |
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| 30.10.2025 10:15 |
New UWB application lab strengthens Infineon’s leadership in trusted connectivity system solutions |
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Munich, Germany and Graz, Austria – October 30, 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has established a dedicated Ultra-Wideband (UWB) Application Lab in Graz, Austria. Developed in collaboration with Silicon Austria Labs (SAL), the lab focuses on advancing UWB technology, exploring innovative use cases, and delivering real-world applications for automotive, industrial, IoT, and consumer markets. Ultra-Wideband (UWB) is a cutting-edge wireless communication technology enabling precise and secured localization but also allows data exchange and sensing. |
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| 29.10.2025 11:00 |
Silicon carbide power modules in new EasyPACK™ C package enhance efficiency and lifetime of industrial applications |
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Munich, Germany – 29 October – Industrial applications such as fast DC electric vehicle (EV) charging, megawatt charging, energy storage systems and uninterruptible power supplies operate under harsh conditions and fluctuating load profiles. These systems demand high efficiency, robust power cycling capability and long lifetime. |
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| 27.10.2025 10:15 |
Infineon adds SPICE-based model generation to IPOSIM platform for more accurate system-level simulation |
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Munich, Germany – 27 October 2025 – The Infineon Power Simulation Platform (IPOSIM) from Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is widely used to calculate losses and thermal behavior of power modules, discrete devices, and disc devices. The platform now integrates a SPICE-based model generation tool that incorporates external circuitry and gate driver selection into system-level simulations. The tool delivers more accurate results for static, dynamic, and thermal performance, taking into consideration non-linear semiconductor physics of the devices. This enables advanced device comparison under a wide range of operating conditions and faster design decisions. Developers can also customize their application environment to reflect real-world operating conditions directly within the workflow. As a result, they can optimize the application performance, shorten time-to-market, and reduce costly design iterations. IPOSIM integrates SPICE to support a wide range of applications where switching power and thermal performance are critical, including electric vehicle (EV) charging, solar, motor drives, energy storage systems (ESS), and industrial power supplies. |
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| 22.10.2025 11:00 |
AURIX™ Configuration Studio: new tool framework accelerates software development for AURIX devices |
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Munich, Germany – 22 October 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) launches a new integrated development environment (IDE) called AURIX™ Configuration Studio (ACS). It is designed to streamline development of applications that use AURIX TC3x devices, reducing time-to-market and cost. The ACS is built on the proven DAVE™ (Digital Application Virtual Engineer) technology and combines an Eclipse-based editor, the GNU C compiler, and an open-source debugger. It offers advanced features such as an intuitive graphical user interface as well as automated resource management and code generation. |
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| 21.10.2025 16:15 |
Infineon launches industry’s first radiation hardened buck controller with integrated gate drive |
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Munich, Germany – 21 October 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the industry's first radiation-hardened (rad-hard) buck controller with an integrated gate drive. Designed for Point of Load (PoL) power rails in commercial space systems and other extreme environments, the new device is particularly well-suited for distributed satellite power systems and digital processing payloads, including FPGA and ASIC systems. |
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| 20.10.2025 11:45 |
Infineon presents XENSIV™ TLE4971/TLI4971, the most accurate coreless magnetic current sensor on the market |
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Munich, Germany – 20 October 2025 – Accurate current measurement is key to efficient, safe, and reliable power electronics. To address this, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is expanding its XENSIV™ magnetic current sensor family with the new TLE4971/TLI4971 sensors, housed in a 300-mil package. These new products offer the highest accuracy in magnetic coreless current sensors on the market, with a total error of only 0.7 percent over temperature and lifetime. Combined with the characteristics of the 300-mil package, the high accuracy makes them ideal for current conversion in automotive and industrial applications. |
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