| Press Releases 7 to 12 of 1785 |
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| 03.12.2025 09:45 |
U.S. International Trade Commission rules in favor of Infineon in one patent infringement case against Innoscience |
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Munich, Germany – 03 December 2025 – The U.S. International Trade Commission (ITC) found the violation of one patent owned by Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) concerning gallium nitride (GaN) technology by Innoscience. |
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| 02.12.2025 11:00 |
Infineon extends Management Board contract of Elke Reichart ahead of schedule to 31 October 2030 |
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Munich – 2 December 2025 – The Infineon Technologies AG Supervisory Board has extended the contract of Elke Reichart (60), Management Board member and Chief Digitalization and Sustainability Officer (CDSO), ahead of schedule to 31 October 2030. Elke Reichart's original contract would have expired at the end of October 2026. As CDSO, Elke Reichart will remain responsible for group-wide digitalization projects, IT infrastructure and Infineon's sustainability strategy. |
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| 01.12.2025 14:15 |
SECORA™ ID V2 platform enables industry’s first FIDO Level 3+ certified secured authentication solutions |
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Munich, Germany – 1 December 2025 – As cyberattacks exploiting security vulnerabilities rise across industries, secured authentication is becoming critical for safeguarding digital identities. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) reinforces its position as a leader in advanced security solutions with the world’s first FIDO CTAP2.1 Authenticator Level 3+ certificates on the SECORA™ ID V2 platform. The Infineon FIDO applet is part of Infineon’s applet collection and runs on the SECORA ID V2 platform, the same base as Eviden’s recently Level 3+ certified cryptovision ePasslet Suite. Both solutions provide robust protection against physical and software-based attacks, safeguarding private keys with strong security measures. Designed for high-security environments like government, finance, critical infrastructure, healthcare, and aerospace they offer future-ready protocol compliance and enhanced manageability. |
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| 01.12.2025 10:15 |
Infineon’s SECORA™ Pay M – new platform for fast and efficient payment and secured FIDO authentication |
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Munich, Germany – 1 December 2025 – According to a latest study, the foremost experts in fintech and payment markets, forecasts a 153% surge in digital fraud targeting financial institutions by 2030; rising from $23 billion in 2025 to $58.3 billion in 2030 .To counter the increase in fraud in e-commerce and online banking and to improve the security of transactions, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is growing its SECORA™ Pay family. The new SECORA Pay M platform expands the innovative features of the plug-and-play SECORA Pay solutions to support even more use cases and FIDO (Fast Identity Online) authentication. |
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| 28.11.2025 10:15 |
Infineon XDP™ hybrid-flyback controller and CoolGaN™ technology empower Anker’s industry-leading 160 W prime charger |
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Munich, Germany, 28 November 2025 — Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has expanded its collaboration with Anker, a leading manufacturer of fast-charging power devices, to develop a new generation of high-speed chargers that can deliver up to 160 Watts of power in a compact, pocket-size format. The result of the cooperation is redefining industry standards for high power density and efficiency, represented by the launch of Anker’s 160 W Prime Charger. The industry-leading device features Infineon’s latest XDP™ digital controller and gallium nitride (GaN) -based CoolGaN™ transistor technology, enabling a credit-card-size design, which makes the charger ideal for travelers and professionals alike. |
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| 26.11.2025 10:15 |
Infineon at TRUSTECH 2025: Future-proof payment and ID solutions for a digital, connected world |
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Munich, Germany – 26 November 2025 – At TRUSTECH, the leading trade show for innovative payment and identification technologies, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) will showcase its latest solutions that are shaping the future of secured digital interactions. From December 2 to December 4, at booth F025 in Pavilion 5.2, Infineon will present a range of future-ready products designed to power a connected, digital world. |
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