| Press Releases 13 to 18 of 1836 |
 |
| 02.06.2026 10:15 |
Infineon introduces industry-first 24 kW SiC-based battery backup unit reference design for high-voltage AI data center architecture |
|
Munich, Germany – 02 June 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces a 24 kW battery backup unit (BBU) DC-DC reference design for high-voltage (HV) DC bus architectures in artificial intelligence (AI) data centers. The design is the first of its kind to operate directly from a battery stack to an 800 V DC bus, using 650 V and 1200 V silicon carbide (SiC) technology. It achieves a power density of 450 W/in³ and efficiency exceeding 99 percent within the same physical form factor as current low-voltage (LV) BBU implementations, addressing a key infrastructure bottleneck as data centers transition to higher-voltage DC distribution. |
|
|
| 29.05.2026 10:45 |
Infineon sets new benchmark for electric vehicle inverters and introduces first silicon carbide power module operating at 205°C |
|
Munich, Germany – 29 May 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has achieved a new milestone in power modules for electric vehicle inverters: The company is introducing a new 1300 V silicon carbide (SiC) module within the HybridPACK™ Drive family that is capable of continuous operation at temperatures up to 205 °C. Existing designs typically allow up to 175 °C. This increase enables automotive OEMs and Tier 1 suppliers to deliver higher peak and continuous output power from existing inverter designs or, in new designs, reduce system complexity and overall cost. |
|
|
| 29.05.2026 03:15 |
Infineon Joins NVIDIA’s MGX™ AI Factory Ecosystem to Transform Power Delivery Architecture for Next-Generation AI Server Racks |
|
Munich, Germany – May 29, 2026 – Infineon Technologies (FSE: IFX / OTCQX: IFNNY), a leading provider of power systems and IoT, has joined NVIDIA’s MGX AI Factory ecosystem to help transform power delivery for next-generation AI data centers. Infineon’s power management solutions will support NVIDIA’s MGX™ architecture and 800 VDC power architecture, an open, modular reference architecture designed for AI factories in the agentic AI era. 800 VDC MGX™-compatible power racks help existing AI infrastructure scale AI compute performance and power density, creating an upgrade path for future AI infrastructure.
|
|
|
| 28.05.2026 10:15 |
Infineon’s SECORA™ Connect X and SECORA™ Wallet brings secured contactless payment to smart wearables |
|
Munich, Germany – 28 May 2026 – Contactless payment – a feature every modern smart watch and smart ring should offer – is fast, convenient, and secured. With up to 4 billion NFC-enabled devices expected by 2030, including up to 700 million wearables, the demand for contactless payment is growing rapidly. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces SECORA™ Connect X, a ready-to-integrate solution that enables customers to transform smart wearables into fully functional payment devices. Combined with Infineon's new SECORA Wallet and SECORA Token Requestor integrated to Mastercard® (MDES) and Visa® (VTS), it enables the digitization of cards and the creation of a custom-branded wallet app. This new SECORA one-stop-shop for wearable payment accelerates time-to-market through seamless integration and certification, while offering flexible design, card tokenization, and secured payment functionality for any active wearable. |
|
|
| 26.05.2026 10:15 |
Infineon presents semiconductor solutions for power infrastructure, AI data centers, robotics and electromobility at PCIM Europe 2026 |
|
Munich, Germany – 26 May 2026 – At PCIM Europe 2026 in Nuremberg, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) will showcase its comprehensive semiconductor portfolio for future proof power infrastructure, AI data centers, robotics and electromobility. Located in hall 7, booth 470, the company will present a broad range of power system solutions spanning silicon (Si), silicon carbide (SiC) and gallium nitride (GaN) semiconductors, complemented by software, tools and cybersecurity expertise. |
|
|
| 20.05.2026 12:45 |
Infineon CoolGaN™ BDS 40 V G3 family delivers up to 82 percent footprint reduction for portable power designs |
|
Munich, Germany – 20 May 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) expands its CoolGaN™ BDS 40 V G3 bidirectional switch (BDS) family with two new devices, the IGK048B041S and IGK120B041S. The new additions reduce PCB footprint by up to 82 percent and cut component count in half. For engineers designing within the strict spatial constraints of modern smartphones, notebooks, and wearables, this is a significant and quantifiable step forward. Targeting compact consumer devices, the new devices give power system designers greater flexibility to optimize efficiency and streamline designs without sacrificing performance. |
|
|
| |
««
«
1
2
3
4
5
»
»»
|
|
|
|
|
|
