| Press Releases 13 to 18 of 1743 |
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| 29.07.2025 10:00 |
Infineon’s CoolSiC™ MOSFETs 1200 V G2 in a Q-DPAK package enable higher power density for industrial applications |
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Munich, Germany – 29 July 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has launched the CoolSiC™ MOSFETs 1200 V G2 in a top-side-cooled (TSC) Q-DPAK package. The new devices deliver optimized thermal performance, system efficiency, and power density. They were specifically designed for demanding industrial applications that require high performance and reliability, such as electric vehicle chargers, solar inverters, uninterruptible power supplies, motor drives, and solid-state circuit breakers. |
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| 10.07.2025 10:15 |
XENSIV™ magnetic 3D sensor enables high-precision position detection in automotive, industrial, and consumer applications |
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Munich, Germany – 10 July 2025 – Leveraging its expertise in magnetic position sensors, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has launched the third generation of the XENSIV™ 3D magnetic Hall-effect sensor family, comprising three product series: TLE493D-W3B6-Bx, TLE493D-P3B6, and TLE493D-P3I8. Developed in accordance with ISO26262, the sensor family provides integrated diagnostic functions to support functional safety applications up to ASIL-B. Due to their high flexibility, the devices are ideal for a wide range of industrial, consumer, and automotive applications, such as long-stroke linear position measurement, angular position measurement, automotive controls, and pedal or valve position sensing. In automotive applications, they enable control in the interior and under the hood, leveraging three-dimensional measurement functions and high-temperature resistance. |
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| 09.07.2025 10:15 |
Infineon expands security controller portfolio for USB tokens with new ID Key S USB for more security and versatility |
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Munich, Germany – 9 July 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is expanding its offering for universal serial bus (USB) tokens, dongles, security keys, and other hardware authenticators with the introduction of the new Infineon ID Key family. The newest member, the ID Key S USB is a highly secured and versatile product designed for a wide range of USB- and USB/NFC-token devices and applications. It combines the security, performance, and reliability of the Infineon SLC38 security controller with a USB bridge controller in one single package. It is a unique system-in-package solution that enables high flexibility and simplifies complex application deployments while reducing the bill of materials and related costs. Certified to highest security levels, it supports a range of use cases, including certificate-based authentication, Fast Identity Online (FIDO) authentication with device-bound passkeys, digital signatures, encryption, access control, software protection, and cryptocurrency hardware wallets. |
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| 07.07.2025 09:30 |
Infineon’s Supervisory Board appoints Alexander Gorski Chief Operations Officer |
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Munich, 7 July 2025 – Dr. Rutger Wijburg, Member of the Management Board and Chief Operations Officer (COO) of Infineon Technologies AG, will resign from his position at the end of the fiscal year on 30 September 2025 at his own request and will retire. The Supervisory Board has appointed Alexander Gorski as his successor, effective as of 1 October 2025. Alexander Gorski is currently Executive Vice President and Head of Frontend Operations at Infineon and will be responsible for Operations, Procurement, Supply Chain and Quality Management in his new position as COO. His mandate as Chief Operations Officer will last for three years as is customary for first appointments. |
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| 02.07.2025 15:55 |
Infineon advances on 300-millimeter GaN manufacturing roadmap as leading Integrated Device Manufacturer (IDM) |
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Munich, Germany – 2 July 2025 – As the demand for gallium nitride (GaN) semiconductors continues to grow, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is poised to capitalize on this trend and solidify its position as a leading Integrated Device Manufacturer (IDM) in the GaN market. Today, the company announced that its scalable GaN manufacturing on 300-millimeter wafers is on track. With first samples available for customers as of the fourth quarter of 2025, Infineon is well-positioned to expand its customer base and reinforce its position as a leading GaN powerhouse. |
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| 02.07.2025 12:15 |
Infineon receives Business Partner Award from DENSO |
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Munich, Germany – 2 July 2025 – DENSO, a leading mobility supplier, recognized Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) with a 2025 North America Business Partner Award in the Value Leader category at its annual North America Business Partner Convention (NABPC). During the event, DENSO brought together approximately 150 supplier representatives from across North America to recognize 15 exceptional business partners. |
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