Press Releases 13 to 18 of 1705
07.04.2025 10:45 Infineon bolsters global lead in automotive semiconductors with number one position in microcontrollers driving this success
Munich, Germany – 7 April 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) bolsters its global and regional market leadership positions in automotive semiconductors, including its very strong position in microcontrollers. According to the latest market research from TechInsights, Infineon achieved a market share of 13.5 percent in the global automotive semiconductor market in 2024. In Europe, the company climbed to the top spot with a 14.1 percent market share, up from second in 2023. Infineon also strengthened its presence in North America to the second largest market participant with a 10.4 percent share, rising from last year’s number three position. The global market share in microcontrollers rose again, to 32.0 percent, increasing the lead over the second-placed competitor by 2.7 percentage points.
31.03.2025 10:15 Power PROFET™ + 24/48V smart power switch family with lowest ohmic resistance optimizes automotive power distribution
Munich, Germany – 31 March 2025 – As vehicle architectures transition to hybrid and electric models, conventional battery systems are increasingly being supplemented or replaced by 48 V power sources. This shift is expected to become the new standard for future electric vehicles, as 12 V and 24 V power net systems reach their limits. 48 V systems enable advanced features, enhance passenger comfort, and improve efficiency by reducing currents and simplifying wire harness complexity. Additionally, the electrification of both primary and secondary power distribution systems requires replacing conventional relays and fuses. To support this development, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is launching the Power PROFET™ + 24/48V switch family, developed for the requirements of modern vehicle power systems.
20.03.2025 10:15 Infineon and RT-Labs integrate six key industrial communication protocols into XMC7000 microcontroller family
Munich, Germany – 20 March 2025 – As the industry embraces digital transformation and the principles of Industry 4.0, communication protocols in industrial automation are becoming more important than ever. To enable seamless data exchange and control in automation systems, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), together with its partner RT-Labs, a provider of industrial communication solutions, has integrated six Fieldbus and Ethernet-based protocols in the firmware of the Infineon XMC7000 industrial microcontroller. The firmware is available through Infineon's ModusToolbox™ development platform, providing access to all major industrial communication protocols in a single software solution. This enables users to quickly and easily implement the required protocols on the XMC7000 microcontroller, fully utilizing its high-performance capabilities in various applications, including servo drives, I/O modules, robotic arms, industrial gateways, PLCs, and more.
17.03.2025 15:15 Infineon partners with Enphase to enhance energy-efficiency and reduce MOSFET-related costs with 600 V CoolMOS™ 8
Munich, Germany – 17 March 2025 – The 600 V CoolMOS™ 8 high-voltage superjunction (SJ) MOSFET product family from Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has allowed Enphase Energy, a global energy technology company and a leading supplier of microinverter-based solar and battery systems, to simplify its system design and reduce assembly costs. By using the 600 V CoolMOS 8 SJ, Enphase is able to significantly reduce MOSFET resistance (RDS(on)) for its solar inverter systems, leading to lower conduction losses, which improves overall device efficiency and boosts power density. In addition, the company achieved MOSFET related cost savings.
17.03.2025 10:15 Infineon introduces new E-version XDP™ hybrid flyback controller ICs for ultra-high power density designs
Munich, Germany – 17 March 2025 – Following the market launch of the industry's first PFC and hybrid flyback (HFB) combo IC, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is introducing the E-version of its hybrid flyback controller family. Designed for high-performance applications, the new XDP™ hybrid flyback digital controller family leverages the advanced asymmetrical half-bridge (AHB) topology, which combines the simplicity of a flyback converter with the efficiency of a resonant converter, enabling high power density designs. This makes the controllers ideal for various AC/DC applications, including aftermarket and OEM chargers, adapters, power tools, e-bike chargers, industrial switching power supplies, TV power supplies, and LED drivers.
14.03.2025 10:15 CoolSiC™ Schottky diode 2000 V now available in TO-247-2 package, enabling higher efficiency and simplifying designs
Munich, Germany – 14 March 2025 – Many industrial applications today are moving towards higher power levels with minimized power losses. One way to achieve this is to increase the DC link voltage. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is addressing this market trend with the CoolSiC™ Schottky diode 2000 V G5 product family, the first discrete silicon carbide diodes with a breakdown voltage of 2000 V, introduced in September 2024. The product portfolio has now been expanded to include a Schottky diode in the TO-247-2 package, which is pin-compatible with most existing TO-247-2 packages. The product family fits perfectly for applications with DC link voltages up to 1500 VDC, making it ideal for solar and EV chargers.
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