| Press Releases 1 to 6 of 1889 |
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| 22.10.2026 14:15 |
UnternehmerTUM Accelerator, Microsoft, Infineon Technologies, and NVIDIA Launch Physical AI Growth Lab for Europe's Most Promising Startups |
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Munich, Germany – 22 October 2026 – UnternehmerTUM Accelerator, Microsoft, Infineon, and NVIDIA, today launched the Physical AI Growth Lab, an equity-free accelerator for Europe's most promising physical AI, robotics, and industrial AI startups. Running from January to April 2027, the program combines expertise, infrastructure, capital access, and enterprise networks to help founders scale. |
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| 21.10.2026 13:45 |
Infineon collaborates with NVIDIA on gallium nitride-based power conversion systems for 800 VDC AI data centers |
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Munich, Germany – 21 October 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is advancing its collaboration with NVIDIA on 800 Volt direct current (VDC) power architectures for AI data centers. Timed with NVIDIA's GTC Berlin developer conference, the announcement centers on the high-voltage intermediate bus converter (IBC), one of the most critical and demanding conversion stages in the power delivery chain of AI data centers. Infineon's gallium nitride (GaN) technology is emerging as well-suited technology of choice for this stage. This builds on the companies' joint work first announced in May 2025 and detailed further in October 2025, which centered on enabling serviceable, hot-swappable 800 VDC server racks. |
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| 20.10.2026 11:15 |
Infineon’s ModusToolbox™ AI Assistant accelerates hardware-aware coding for PSOC™ microcontrollers |
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Munich, Germany – October 20, 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is expanding its ModusToolbox™ software ecosystem with the ModusToolbox AI Assistant for Microsoft Visual Studio Code (VS Code). The extension supplies AI coding agents with hardware-specific context for PSOC™ Edge and PSOC Control microcontrollers. Without such context, generic AI coding assistants can produce code that appears correct but fails on real hardware. They may target the wrong device, call deprecated APIs or skip an initialization step that only surfaces during board bring-up. The ModusToolbox AI Assistant aligns every suggestion with the developer’s actual target device, board and peripheral configuration. As a result, general-purpose AI assistants generate valid embedded code. The extension analyzes the project context entirely locally and keeps customer project data on the developer’s system. Common applications include connected IoT devices with graphics and connectivity functions. |
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| 19.10.2026 14:15 |
Infineon announces winners of the startup challenge on humanoid robotics |
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Munich, Germany – 19 October 2026 – Infineon has announced the winners of the Infineon Startup Challenge 2026, focused on key technologies for the next generation of humanoid robots. Following four months of intensive collaboration, development and mentoring, 15 selected startups out of more than 100 applicants presented their solutions at the Infineon Startup Challenge Demo Day, held during the Electronic Based Systems Conference (EBSCON) in Graz, Austria. |
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| 19.10.2026 10:15 |
Infineon expands PSOC™ Control C3 family with PSC3M/P6 featuring advanced security for multi-motor control and power conversion systems |
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Munich, Germany – 19 October 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) announced today that it is expanding its PSOC™ Control family with the launch of the PSOC Control C3 Main Line PSC3M/P6 microcontrollers (MCUs). The new, versatile, and cost-optimized MCUs combine real-time motor and power control performance, with advanced security features. The features efficiently drive up to four brushless DC motors in sensored or sensorless configuration with a single MCU, power topologies and security needs for a variety of applications including industrial drives, drones, smart home, home appliances, renewables, robotics, telecommunication servers, datacenters, and digital healthcare applications. |
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| 15.10.2026 14:00 |
Infineon signs 200-millimeter silicon carbide wafer supply agreement with Wolfspeed to further strengthen supply chain resilience |
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– Multi-year agreement with Wolfspeed supports Infineon’s conversion from 150-millimeter to 200-millimeter silicon carbide (SiC) manufacturing
– Expanded substrate sourcing strengthens supply chain resilience and enhances flexibility to support future growth
– Agreement supports growing demand for SiC power semiconductors for electric vehicles, renewable energy systems and AI datacenter power infrastructure
Munich, Germany and Durham, N.C – 15 October 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Wolfspeed, Inc. (NYSE: WOLF) have signed a new multi-year supply agreement for 200-millimeter silicon carbide (SiC) wafers, transitioning Infineon's existing Wolfspeed supply relationship from 150-millimeter to 200-millimeter substrate technology. SiC semiconductors have become a key enabling technology for the electrification and energy efficiency applications that drive global decarbonization, from electric vehicles and renewable energy systems to AI datacenter power infrastructure. The agreement directly supports Infineon's conversion to 200-millimeter SiC manufacturing, strengthening Infineon's position as the global leader in power semiconductors and reinforcing the supply chain resilience that underpins its SiC growth strategy. |
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