| Press Releases 1 to 6 of 1768 |
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| 06.11.2025 11:55 |
Cutting-edge research from Germany: Supercomputer for autonomous driving |
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Munich – 6 November 2025 – As cars become increasingly connected, intelligent and autonomous, they require powerful compute architectures with multi-gigabit interfaces. In a joint effort, 28 research partners from industry and science have now presented a new supercomputer made in Germany, the demonstrator of a central computing platform for the automotive industry that meets highest safety and reliability standards. Led by Infineon Technologies AG, the partners developed this platform over the past three years in a research project called Mannheim-CeCaS (Central Car Server). The project was supported by the German Federal Ministry of Research, Technology and Space (BMFTR), with a project volume of 88.2 million euros, making it one of the BMFTR's largest national automotive research projects. The demonstrator was presented at the project closing event in Munich, successfully demonstrating its functionality while integrated in a modern electric car. |
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| 05.11.2025 13:30 |
Infineon and SolarEdge collaborate to advance high-efficiency power infrastructure for AI data centers |
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Munich, Germany and Milpitas, Calif. – 5 November 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a world leader in semiconductor solutions for power systems, and SolarEdge Technologies, Inc. (NASDAQ: SEDG), a global leader in smart energy, today announced a collaboration to advance SolarEdge’s Solid-State Transformer (SST) platform for next-generation AI and hyperscale data centers. The collaboration focuses on the joint design, optimization and validation of a modular 2-5 megawatt (MW) SST building block. It combines advanced silicon carbide (SiC) switching technology from Infineon with SolarEdge’s proven power-conversion and control topology set to deliver >99% efficiency, supporting the global shift towards high-efficiency, DC-based data center infrastructure. |
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| 31.10.2025 10:30 |
Infineon’s new MOTIX™ system-on-chip family for motor control enables compact and cost-efficient designs |
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Munich, Germany – 31 October 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is expanding its MOTIX™ 32-bit motor control SoC (System-on-chip) family with new solutions for both brushed (BDC) and brushless (BLDC) motor applications: TLE994x and TLE995x. The new products are tailored for small- to medium-sized automotive motors, ranging from functions such as battery cooling in electric vehicles to comfort features such as seat adjustment. The number of such motors continues to grow in modern, especially electric, vehicles and they are used in an increasing number of safety-critical applications. Therefore, car manufacturers require reliable, compact and cost-effective solutions that integrate multiple functions. Based on Infineon's extensive experience in motor control, the new SoCs combine advanced integration with functional safety and cybersecurity-relevant features. |
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| 30.10.2025 10:15 |
New UWB application lab strengthens Infineon’s leadership in trusted connectivity system solutions |
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Munich, Germany and Graz, Austria – October 30, 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has established a dedicated Ultra-Wideband (UWB) Application Lab in Graz, Austria. Developed in collaboration with Silicon Austria Labs (SAL), the lab focuses on advancing UWB technology, exploring innovative use cases, and delivering real-world applications for automotive, industrial, IoT, and consumer markets. Ultra-Wideband (UWB) is a cutting-edge wireless communication technology enabling precise and secured localization but also allows data exchange and sensing. |
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| 29.10.2025 11:00 |
Silicon carbide power modules in new EasyPACK™ C package enhance efficiency and lifetime of industrial applications |
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Munich, Germany – 29 October – Industrial applications such as fast DC electric vehicle (EV) charging, megawatt charging, energy storage systems and uninterruptible power supplies operate under harsh conditions and fluctuating load profiles. These systems demand high efficiency, robust power cycling capability and long lifetime. |
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| 27.10.2025 10:15 |
Infineon adds SPICE-based model generation to IPOSIM platform for more accurate system-level simulation |
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Munich, Germany – 27 October 2025 – The Infineon Power Simulation Platform (IPOSIM) from Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is widely used to calculate losses and thermal behavior of power modules, discrete devices, and disc devices. The platform now integrates a SPICE-based model generation tool that incorporates external circuitry and gate driver selection into system-level simulations. The tool delivers more accurate results for static, dynamic, and thermal performance, taking into consideration non-linear semiconductor physics of the devices. This enables advanced device comparison under a wide range of operating conditions and faster design decisions. Developers can also customize their application environment to reflect real-world operating conditions directly within the workflow. As a result, they can optimize the application performance, shorten time-to-market, and reduce costly design iterations. IPOSIM integrates SPICE to support a wide range of applications where switching power and thermal performance are critical, including electric vehicle (EV) charging, solar, motor drives, energy storage systems (ESS), and industrial power supplies. |
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