| Press Releases 1 to 6 of 1886 |
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| 19.10.2026 14:15 |
Infineon announces winners of the startup challenge on humanoid robotics |
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Munich, Germany – 19 October 2026 – Infineon has announced the winners of the Infineon Startup Challenge 2026, focused on key technologies for the next generation of humanoid robots. Following four months of intensive collaboration, development and mentoring, 15 selected startups out of more than 100 applicants presented their solutions at the Infineon Startup Challenge Demo Day, held during the Electronic Based Systems Conference (EBSCON) in Graz, Austria. |
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| 19.10.2026 10:15 |
Infineon expands PSOC™ Control C3 family with PSC3M/P6 featuring advanced security for multi-motor control and power conversion systems |
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Munich, Germany – 19 October 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) announced today that it is expanding its PSOC™ Control family with the launch of the PSOC Control C3 Main Line PSC3M/P6 microcontrollers (MCUs). The new, versatile, and cost-optimized MCUs combine real-time motor and power control performance, with advanced security features. The features efficiently drive up to four brushless DC motors in sensored or sensorless configuration with a single MCU, power topologies and security needs for a variety of applications including industrial drives, drones, smart home, home appliances, renewables, robotics, telecommunication servers, datacenters, and digital healthcare applications. |
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| 15.10.2026 14:00 |
Infineon signs 200-millimeter silicon carbide wafer supply agreement with Wolfspeed to further strengthen supply chain resilience |
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– Multi-year agreement with Wolfspeed supports Infineon’s conversion from 150-millimeter to 200-millimeter silicon carbide (SiC) manufacturing
– Expanded substrate sourcing strengthens supply chain resilience and enhances flexibility to support future growth
– Agreement supports growing demand for SiC power semiconductors for electric vehicles, renewable energy systems and AI datacenter power infrastructure
Munich, Germany and Durham, N.C – 15 October 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Wolfspeed, Inc. (NYSE: WOLF) have signed a new multi-year supply agreement for 200-millimeter silicon carbide (SiC) wafers, transitioning Infineon's existing Wolfspeed supply relationship from 150-millimeter to 200-millimeter substrate technology. SiC semiconductors have become a key enabling technology for the electrification and energy efficiency applications that drive global decarbonization, from electric vehicles and renewable energy systems to AI datacenter power infrastructure. The agreement directly supports Infineon's conversion to 200-millimeter SiC manufacturing, strengthening Infineon's position as the global leader in power semiconductors and reinforcing the supply chain resilience that underpins its SiC growth strategy. |
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| 14.10.2026 10:15 |
Infineon at electronica 2026: Technology for the AI era, from data centers into robots and onto the road |
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Munich, Germany – 14 October 2026 – With artificial intelligence evolving from virtual chatbots into real-world machines and devices, it will shape our lives more than ever. At the electronica trade fair 2026 in Munich, Germany (10 – 13 November), Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) will showcase customer cases, system solutions, and semiconductor innovations for Physical AI across robotics and mobility, intelligent edge devices as well as the infrastructure necessary to power the age of AI. Technology from Infineon helps machines perceive their environment, communicate in a secured way, process data locally through edge AI, and act on it safely and reliably while using energy as efficiently as possible. Visitors will find Infineon at booth 502 in hall C3. |
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| 12.10.2026 16:00 |
Infineon introduces XDP8HD40S-1 high-voltage hot-swap controller, extending its power semiconductor portfolio from grid to core for 800 VDC AI server architectures |
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Munich, Germany – 12 October 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the XDP8HD40S-1, a high-voltage hot-swap controller designed for digital power-path protection and monitoring in next-generation AI server power architectures operating at ±400 Volt and 800 Volt direct current (VDC). As AI clusters scale from 48 V toward higher rack power levels, reliable hot-swap functionality becomes increasingly important for maintaining uninterrupted system operation. The XDP8HD40S-1 enables power modules, converters, GPUs, and server subsystems to be connected and disconnected safely while preserving system integrity, extending Infineon's power semiconductor portfolio, spanning silicon, silicon carbide (SiC), and gallium nitride (GaN), further into the protection and monitoring layer required for scalable AI infrastructure. |
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| 08.10.2026 10:15 |
Infineon introduces 27 kW three-phase PSU solution for next-generation AI server power architectures |
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Munich, Germany – 8 October 2026 – Artificial intelligence workloads are redefining the power requirements of modern data centers. Increasing GPU performance and rising rack densities are driving a shift toward 800 VDC or ±400 VDC power supply architectures. To address these requirements, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is launching a 27kW three-phase power supply unit (PSU) solution for server ODMs and OEMs. The reference design meets the requirements of the OCP Open Rack V3 (ORV3) specification and AI server rack architectures, further expanding Infineon’s comprehensive portfolio for powering AI servers. The solution helps developers shorten time-to-market while improving rack power density, efficiency, and thermal performance. |
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