| Press Releases 1 to 6 of 1839 |
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| 22.06.2026 10:15 |
Infineon launches cloud-based virtual platform powered by AWS to accelerate automotive microcontroller evaluation |
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Munich, Germany – 22 June 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is collaborating with Amazon Web Services (AWS) to accelerate microcontroller (MCU) evaluation to shorten development cycles for automotive systems. As part of this collaboration, Infineon is launching a cloud-based platform for virtual evaluation of Infineon automotive MCUs, powered by AWS. The new platform removes dependency on physical hardware, helps to reduce evaluation cycles from multiple weeks to minutes and significantly lowers evaluation cost per user, while supporting hundreds of concurrent users globally. The platform already includes Infineon’s next-generation RISC-V architecture. |
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| 19.06.2026 12:30 |
Infineon wins IR Impact Awards for Best Investor Relations and Best Investor Relations Officer in Europe |
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Munich, Germany – 19 June 2026 – The Investor Relations (IR) team of Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) secured first place in several key categories at the 2026 “IR Impact Awards – Europe.” In the “Best Overall Investor Relations (Large Cap)” category, the team led by Alexander Foltin, Head of Finance, Treasury & Investor Relations, achieved the top position. In addition, Alexander Foltin and Daniel Györy, Team Lead Investor Relations, were jointly recognized as “Best Investor Relations Officer (Large Cap).” |
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| 18.06.2026 17:10 |
Infineon wins patent infringement case against Innoscience |
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Munich, Germany – 18 June 2026 – The District Court Munich, Germany (Landgericht München I) today ruled in favor of Infineon Technologies in two further of the patent infringement cases – specifically one based on a patent one based on a utility model – concerning gallium nitride (GaN) technology between Infineon and Innoscience. |
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| 09.06.2026 09:15 |
Infineon and Vingroup's VinRobotics form partnership to shape the future of humanoid robots |
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Munich, Germany – Hanoi, Vietnam – 9 June 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and VinRobotics have signed a Memorandum of Understanding (MoU) to collaborate on the development of humanoid robots. VinRobotics, a Vietnam-based intelligent robotics company established by Vingroup, Vietnam's largest private conglomerate by revenue and a recognized force in the technology sector, brings deep regional expertise and industrial scale to the partnership. As part of this collaboration, a joint competency center will be established at VinRobotics' Hanoi office, serving as a dedicated hub for research, development, and innovation in humanoid robotics. |
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| 08.06.2026 10:15 |
Infineon and Siemens leverage silicon carbide technology to advance electrical protection in data centers and factories |
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– Infineon and Siemens collaborate to drive semiconductor circuit breaker technology for data centers, production facilities and battery storage systems
– Semiconductor circuit breakers are fast-acting, semiconductor-based electronic devices that protect electrical circuits and components from damage caused by short circuits or overloads
– Infineon's silicon carbide power modules enhance the efficiency, power density and reliability of the Siemens circuit breaker
Munich, Germany – 8 June 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Siemens AG are partnering to advance electrical protection and ensure reliable operations in data centers, production facilities and battery storage systems. As part of the collaboration, Infineon will supply silicon carbide (SiC) power modules to Siemens for use in its SENTRON 3QD2 semiconductor circuit breakers. This will enhance the efficiency, power density and reliability of Siemens' protection solution. |
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| 03.06.2026 11:15 |
Infineon advances Physical AI security against quantum-era threats with certified TPM solution for NVIDIA Jetson Thor |
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Munich, 03 June 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announces the integration of its OPTIGA™ Trusted Platform Module (TPM) SLB 9672 with NVIDIA’s Jetson Thor platform. The hardware-based security solution securely stores cryptographic keys and verifies system integrity at the chip level, establishing a certified, quantum-resilient root of trust for Physical AI systems. The integration strengthens the security foundation, enabling robots and autonomous systems to operate securely and reliably across their full lifecycle. As these systems move from controlled environments into factories and public spaces, the impact of a security failure extends beyond data loss to operational disruption and regulatory liability. For the robotics industry, the security architecture decisions made at design-in have lasting commercial and compliance implications. |
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