| Press Releases 1 to 6 of 1872 |
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| 29.09.2026 10:15 |
Infineon and Eaton leverage silicon carbide technology to advance solid-state transformers for 800 VDC AI data center power architectures |
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– Infineon and Eaton are partnering to drive solid-state transformer (SST) technology
– The collaboration addresses demand for more efficient power conversion solutions in AI data centers
– Infineon’s silicon carbide power devices help enhance efficiency, power density and system reliability of Eaton’s SST platform
Munich, Germany – 29 September, 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) will deliver silicon carbide (SiC) power devices to Eaton, an intelligent power management company, for use in its medium-voltage solid-state transformer (MVSST) 2.0 platform designed for deployment across APAC and EMEA markets. The collaboration helps increase the efficiency and reliability of the power conversion required to connect AI data centers to the electricity grid. It targets 800 Volts direct current (VDC) data center power distribution architectures. |
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| 28.09.2026 14:00 |
Infineon XENSIV™ TLx49012 digital angle sensors enable unique system self-calibration for automotive and industrial motor control applications |
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Munich, Germany – 28 September 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the XENSIVTM TLx49012, a family of four digital angle sensors based on Hall technology, designed for demanding motor control applications in automotive and industrial markets. As brushless DC motor adoption accelerates across automotive platforms and the robotics market enters a phase of rapid structural growth, the requirements for angle sensors that combine high accuracy, low latency, and minimal design-in effort are becoming a critical system-level constraint. |
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| 24.09.2026 10:12 |
OPTIFICIENT™ software solution by Industrial Analytics helps reduce energy consumption and operating costs of heating, ventilation and air conditioning systems |
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Munich, Germany – 24 September 2026 – Industrial Analytics IA GmbH, an Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) company, will showcase its software solution OPTIFICIENT™ at EXPO REAL 2026. Rising temperatures and increasing cooling demand are putting growing pressure on facility management teams to optimize heating, ventilation and air conditioning systems across entire buildings and facility portfolios – not only through new equipment, but through smarter operation of existing infrastructure. Developed and validated under semiconductor-grade operational requirements, OPTIFICIENT helps building operators and facility management providers reduce heating, ventilation and air conditioning (HVAC)-related energy costs, lower emissions and improve operational efficiency across large facility portfolios. |
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| 22.09.2026 10:15 |
Infineon’s PSOC™ Control C3 Performance Line sets new standard for real-time control and PQC security |
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Munich, Germany – 22 September 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the launch of its PSOC™ Control C3 Performance Line microcontroller family to enable real-time control for power and motor applications. The new family of microcontrollers (MCUs) offers best-in-class performance through high control loop frequency, accuracy and system efficiency. Based on Arm® Cortex®-M33 multi-core architecture, PSOC Control C3 Performance Line MCUs meet the needs of applications that require precise, high-speed control for power conversion such as AI server PSUs, solar, SMPS, EV charging or high-end motor control. |
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| 17.09.2026 10:15 |
Infineon EiceDRIVER™ 2EDL6014AC-G2D dual channel gate driver delivers high density and thermal performance for AI datacenter power designs |
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Munich, Germany – 17 September 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the EiceDRIVER™ 2EDL6014AC-G2D, a 120 V junction-isolated dual channel floating output gate driver engineered for high-density silicon power designs in AI datacenter applications. Housed in a compact WQFN-12 2.2 mm x 2.2 mm package, the device addresses the growing demand for power conversion solutions that deliver higher server rack density without sacrificing reliability or thermal performance. The 2EDL6014AC-G2D supports dual high-side, dual low-side, and half-bridge configurations, making it a versatile platform driver across the switched-capacitor and multilevel topologies increasingly adopted in next-generation AI server power architectures. |
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| 09.09.2026 13:45 |
Infineon extends collaboration with SolarEdge to enable solid-state protection for 800 VDC AI data centers |
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– Companies extend collaboration into solid-state circuit breaker (SSCB) technology in line with leading industry framework for 800 Volts direct current (VDC) architecture
– SSCB technology is designed to interrupt DC faults orders of magnitude faster than electromechanical breakers, addressing one of the key challenges in deploying high-voltage DC power architectures
– The collaboration advances a DC-native power architecture from medium-voltage grid connection through distribution to the rack, to support higher density, greater reliability and reduced environmental impact for AI data centers
Munich, Germany and Milpitas, California – 9 September, 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and SolarEdge Technologies, Inc. (NASDAQ: SEDG), a global leader in smart energy, today announced an extension of their collaboration to advance solid-state circuit breaker (SSCB) technology for high-voltage DC distribution in AI and hyperscale data centers. The collaboration addresses a key challenge in the adoption of 800 VDC architecture: Safe operation of increasingly power-dense infrastructure requires a very fast fault-isolation to achieve selectivity while maintaining high efficiency. |
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