| Press Releases 1 to 6 of 1895 |
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| 05.11.2026 11:15 |
Infineon and SOLUM strengthen collaboration on HVDC power solutions for AI data centers |
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Munich, Germany and Seoul, South Korea – 5 November 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and SOLUM have signed a Memorandum of Understanding (MoU) to strengthen their existing collaboration on high-voltage direct current (HVDC) power solutions for AI data centers. Building on their ongoing technical cooperation, the companies plan to expand their work across three key power applications: intermediate bus converters (IBCs), battery backup units (BBUs) and power supply units (PSUs). |
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| 04.11.2026 09:30 |
Infineon redefines real-time compute and control for software-defined vehicles and Physical AI with new AURIX™ RC1 |
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– Fundamentally new automotive microcontroller platform is Infineon’s first to leverage the open-standard instruction set architecture RISC-V
– Platform simplifies development of software-defined vehicles by providing one common, highly scalable microcontroller basis across domains instead of point solutions
– High-end product lineup within the family will extend microcontroller domain with additional microprocessor capabilities to support further integration of functions
– Advanced processing, safety, cybersecurity, and integrated networking capabilities provide future-ready foundation for evolving requirements throughout vehicle lifecycles
– Complementing software ecosystem reduces migration efforts and accelerates software development for customers
Munich, Germany – 4 November 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is taking a strategic step forward to expand its portfolio for software-defined vehicles (SDV) as well as other software-defined (SDX) and Physical AI applications, reinforcing its position as global market leader in microcontrollers (MCU). The company is introducing a fundamentally new MCU platform within its industry-leading AURIX™ series for real-time control in automotive and beyond. AURIX RC1 is Infineon’s first MCU platform that leverages the benefits of RISC-V. Scaling from traditional microcontrollers to hybrid microcontroller/microprocessor devices, it provides a new level of power-efficient real-time intelligence to enable safe and secured future SDV, SDX and Physical AI. Infineon will present the AURIX RC1 family concept at the electronica trade fair in Munich, Germany (10-13 November) and targets to provide samples in the first half of 2027. |
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| 03.11.2026 10:15 |
Infineon launches OptiMOS™ 7 40 V MOSFETs to improve efficiency and power density in AI server and telecom power conversion |
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Munich, Germany – 03 November 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is launching its OptiMOS™ 7 40 V switching-optimized power MOSFET portfolio for AI servers, data centers and telecom infrastructure. Designed for high-frequency DC-DC power conversion, the devices help designers improve efficiency and power density in space-constrained systems. Target applications include low-voltage secondary-side stages of high-voltage intermediate bus converters in emerging 800 V DC architectures and intermediate bus converters in 48 V power architectures, with switching frequencies beyond 1 MHz supported in suitable topologies. |
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| 02.11.2026 14:30 |
Infineon enables car computers for automated driving and digital cockpits powered by Qualcomm Snapdragon Ride |
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Munich, Germany – 2 November 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) announced today that it is working with Qualcomm Technologies, Inc. to accelerate the development and deployment of central car computers in software-defined vehicles (SDVs). The companies have signed a technology agreement to have a microcontroller-based design pattern (the “subsystem”) for Qualcomm Technologies’ Snapdragon Ride™ reference platforms for high-performance computing and in-vehicle artificial intelligence. By working together, they expand the Snapdragon Ride ecosystem, bringing together Qualcomm Technologies’ platform capabilities and high-performance systems-on-chip (SoCs) with Infineon’s expertise in hardware and software for safety management, connectivity and memory management. Combined, these aim to provide a streamlined path for the deployment of car computers that combine driver assistance and automated driving functions with cutting-edge cockpit solutions. |
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| 27.10.2026 07:45 |
Infineon to establish the world’s first high-volume manufacturing facility for gallium nitride power semiconductors on 300-millimeter wafers in Europe |
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Munich, Germany/Vienna, Austria – 27 October 2026 – Infineon Technologies AG is establishing the world’s first high-volume manufacturing facility for next-generation gallium nitride (GaN) power semiconductors on 300-millimeter wafers in Europe. As part of the project, Infineon will invest around €1.1 billion in its existing cleanroom facilities at the Villach site by 2034. Leveraging both the existing and upgraded infrastructure will enable highly efficient and cost-effective expansion of manufacturing capacity. Production is scheduled to start by the end of 2027. Infineon’s investment addresses the rapidly growing demand for high-performance power supply solutions. Gallium nitride enables significant efficiency gains in numerous applications, such as AI data centers, energy infrastructure, e-mobility, robotics and consumer electronics. |
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| 26.10.2026 13:15 |
Infineon and Enphase Energy announce world’s first 900 V GaN BDS devices for solid-state transformers in AI data centers |
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Munich, Germany – 26 October 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) will supply the world’s first 900 V gallium nitride (GaN) monolithic bidirectional switches (BDS) to Enphase Energy, Inc. (NASDAQ: ENPH), a global energy technology company, for deployment in its solid-state transformer (SST) power modules. By extending the operating voltage range of GaN technology to 900 V while maintaining its high-frequency switching characteristics, the devices enable highly efficient, compact power conversion architectures for emerging applications including AI data centers. |
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