Press Releases 37 to 42 of 1785
30.09.2025 10:45 Infineon expands CoolSiC™ portfolio with 400 V and 440 V MOSFETs for high-power and compute-intensive applications
Munich, Germany – 30 September 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has expanded its CoolSiC™ MOSFETs 400 V G2 portfolio with the top-side-cooled (TSC) TOLT package as well as the TO-247-3 and TO-247-4 packages. In addition, three new products in the TOLL package have been introduced, with rated voltages of 440 V (continuous) and 455 V (transient). The new CoolSiC MOSFETs deliver improved thermal performance, system efficiency, and power density. They have been specifically designed to meet the requirements of high-power and compute-intensive applications, including AI server power supplies, solar inverters, uninterruptible power supplies, Class D audio amplifiers, motor drives, and solid-state circuit breakers. For these critical systems, the devices provide the required reliability and performance.
26.09.2025 09:45 Infineon introduces OptiMOS™ 7 application-optimized MOSFETs for industrial and consumer applications
Munich, Germany – 26 September 2025 – The rapid growth of power-hungry applications across various industries is placing unprecedented demands on power electronics in terms of power density, efficiency and reliability. Discrete power MOSFETs play a pivotal role in that context. An application-optimized approach opens new possibilities to further improve already highly advanced MOSFET technologies. Leveraging this use-case centric approach, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is launching the OptiMOS™ 7 power MOSFET family for industrial and consumer markets, extending the already existing OptiMOS 7 automotive portfolio. Designed to provide the best fitting solution in their respective use case, the new OptiMOS 7 family offers products specifically for high performance switching, motor-drives, or RDS(ON)-focused applications.
23.09.2025 11:15 Infineon CoolGaN™ technology boosts power performance in network PoE applications of Universal Microelectronics
Munich, Germany – 23 September 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) provides CoolGaN™ power transistors to Universal Microelectronics Co., Ltd. (UMEC) for the company’s new 250 W adapter for networking Power over Ethernet (PoE) applications. Infineon´s CoolGaN transistors enable reliable, high-performance solutions and help UMEC develop safer and energy-efficient technology to address modern power system challenges. These solutions are ideal for power electronics across various industries, including telecommunications, industrial electronics, medical technology, and consumer electronics.
22.09.2025 14:15 For more secure AI and ML models: Infineon’s OPTIGA™ Trust M backs Thistle Technologies’ Secure Edge AI solution
Munich, Germany, and Amsterdam, The Netherlands – 22 September 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) provides its OPTIGA™ Trust M security solution to Thistle Technologies for its new cryptographic protection for on-device AI models to its security software platform for embedded computing products based on the Linux® operating system (OS) or on a microcontroller. The new capabilities in the Thistle Security Platform for Devices, along with Infineon OPTIGA Trust M security solution as tamper-resistant hardware-based root-of-trust, protect the valuable intellectual property (IP) in the AI models deployed in edge AI applications, and in the training data sets on which they are based.
18.09.2025 10:15 Infineon power modules enhance energy efficiency in Goldwind’s grid-forming wind turbines
Munich, Germany – 18 September – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Goldwind Science & Technology Co., Ltd. expand their collaboration, enabling a stable and reliable flow of electricity in wind power generation. Infineon will supply Goldwind with its XHP™ 2 1700 V IGBT5 power modules with .XT technology that will enhance energy efficiency in Goldwind’s grid-forming GW 155 - 4.5 MW wind turbines. Infineon’s power modules deliver high power density, reliability, and robustness, ensuring a long operational lifetime for wind energy systems. By optimizing energy efficiency, they help to reduce energy costs and enhance the profitability of Goldwind’s wind turbines.
16.09.2025 10:15 Infineon expands XENSIV™ MEMS microphone lineup delivering best-in-class audio and power performance
Munich, Germany – 16 September 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has expanded its XENSIV™ MEMS microphone lineup with the introduction of the IM72D128V and IM69D129F, two innovative digital PDM microphones designed for exceptional audio performance, energy efficiency, and robustness. Leveraging Infineon’s proprietary Sealed Dual Membrane (SDM) technology, both microphones achieve a high level of robustness against water and dust (IP57), making them suitable for use in demanding environments.
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