| Press Releases 67 to 72 of 1725 |
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| 30.01.2025 14:15 |
Infineon's 512 Mbit QSPI NOR Flash for satellite applications is now qualified according to DLAM QML-V and QML-P |
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Munich, Germany – 30 January 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) announced that its radiation-hardened 512 Mbit QSPI NOR Flash memory for space and extreme environment applications has now received the QML-V and QML-P qualification of the Defense Logistics Agency Land and Maritime (DLAM). The QML certification is the highest reliability standard for microcircuits awarded by the U.S. government and indicates that the device will perform reliably under the most challenging conditions. This makes the memory device the first and only QML-qualified radiation-hardened NOR flash memory for the space industry. The flash memory features a fast 133 MHz quad serial peripheral interface (QSPI) and the highest density, radiation and single-event effects (SEE) performance available in a fully QML-qualified non-volatile memory for use with space-qualified FPGAs and multi-core processors. |
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| 30.01.2025 10:15 |
Infineon 2025 predictions – Gallium Nitride (GaN) semiconductors: GaN to reach adoption tipping points in multiple industries, further driving energy efficiency |
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Munich, Germany – 30 January 2025 – As the world continues to face the challenges of climate change and environmental sustainability, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is at the forefront of innovation, harnessing the power of all relevant semiconductor materials including silicon (Si), silicon carbide (SiC), and gallium nitride (GaN) to drive meaningful progress towards decarbonization and digitalization. |
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| 29.01.2025 10:15 |
FORVIA HELLA setzt bei der nächsten Generation an Ladelösungen auf den neuen CoolSiC™ Automotive MOSFET von Infineon |
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München, 29. Januar 2025 – FORVIA HELLA, ein internationaler Automotive-Zulieferer, hat den neuen CoolSiC™ Automotive MOSFET 1200 V der Infineon Technologies AG für seine 800-V-DCDC-Ladelösung der nächsten Generation ausgewählt. Der CoolSiC-MOSFET von Infineon ist für On-Board-Ladegeräte und DCDC-Anwendungen in 800-V-Fahrzeugarchitekturen konzipiert und wird in einem Q-DPAK-Gehäuse geliefert. Das Bauteil basiert auf der TSC-Technologie (Top-Side-Cooling), die eine hervorragende Wärmeleistung, eine einfache Montage und niedrige Systemkosten ermöglicht. |
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| 28.01.2025 10:15 |
Infineon introduces new EiceDRIVER™ isolated gate driver ICs for traction inverters in electric vehicles |
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Munich, Germany – 28 January 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces new isolated gate driver ICs for electric vehicles to enhance its EiceDRIVER™ family. The devices are designed for the latest IGBT and SiC technologies. Furthermore, they support Infineon's new HybridPACK™ Drive G2 Fusion module, the first plug'n'play power module that implements a combination of Infineon’s silicon and silicon carbide (SiC) technologies. The pre-configured third-generation EiceDRIVER products, 1EDI302xAS (IGBT) and 1EDI303xAS (SiC/ Fusion), are AEC-qualified and ISO 26262-compliant, ideal for traction inverters in cost-effective and high-performant xEV platforms. |
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| 27.01.2025 10:15 |
The world's smallest eSIM solution for mobile consumer devices: Infineon launches OPTIGA™ Connect Consumer OC1230 |
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Munich, Germany – 27 January 2025 – Wearables, smartphones, tablets: In the consumer sector in particular, the demand for ever greater functionality, simplicity, and battery lifetime is increasing. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) contributes to these requirements with the introduction of the OPTIGA™ Connect Consumer OC1230. It is the world’s smallest GSMA-compliant and first 28 nm eSIM solution. OPTIGA Connect Consumer allows up to 50 percent less energy consumption compared to eSIMs on the market, extending the lifetime of the device’s battery without compromising on performance. It also contributes largely to more convenience since eSIMs can be managed remotely, making haptic SIM changes abundant thus saving time and resources and allowing for greater flexibility. Smartphone users can switch between different providers more easily, manufacturers can be more flexible in their design since physical access is not required. This can be a large advantage in IoT devices. Above all, OPTIGA Connect Consumer OC1230 is ideal for consumer devices such as smartphones, tablets, and notebooks, and even for small devices such as smartwatches and other wearables as well as 5G routers and POS payment terminals. |
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| 23.01.2025 14:00 |
Infineon and the BSI pave the way for a quantum-resilient future: World's first Common Criteria Certification for post-quantum cryptography algorithm on a security controller |
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Munich, Germany – 23 January 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has achieved a milestone on the way to a quantum-resilient world in collaboration with the German Federal Office for Information Security (BSI) . Infineon is the first company ever to receive the Common Criteria EAL6, an industry-leading certification level, for the implementation of a post-quantum cryptography algorithm in a security controller. Such cryptography enhances security for eSIM, 5G SIM and smart card applications, including personal IDs, payment cards and eHealth cards, against threats resulting from highly capable quantum computers. The world's first certification is a milestone on the way to a quantum-safe future in our daily lives. |
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