| Press Releases 73 to 78 of 1572 |
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| 27.11.2023 16:45 |
DIGISEQ and Infineon support market growth of wearables by launching world-first pre-certified ring inlay |
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Munich, Germany, and London, UK – 27 November, 2023 – DIGISEQ Ltd, the wearable payment tech pioneer, has received Mastercard certification for a world-first pre-certified concentric ring inlay, opening up the market for small independents and large brands to quickly and effectively launch payment rings within their collections. The inclusion of the ring inlay with integrated secured NFC chip can deliver multiple services, opening new use cases in addition to payments, such as loyalty, access, events and hospitality for consumers’ everyday life. |
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| 27.11.2023 12:45 |
“Coil on Module” enables ultra-thin electronic data page for Turkish passports with exceptional document durability and protection against forgery |
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Munich, Germany – 27 November, 2023 – Türkiye has issued nearly five million next-generation electronic passports with contactless Coil on Module (CoM CL) solution from Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY). The passport includes a polycarbonate (PC) data page with an integrated security chip, which is embedded in a contactless module based on the reliable CoM technology. The data page contains sensitive personal data of the holder. Due to the security-critical nature of this information, official travel documents must be designed to highest security standards in order to provide reliable protection against tampering and fraud. Infineon’s contactless CoM solution not only increases the robustness of the ePassport, but also enables enhanced security. |
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| 24.11.2023 14:15 |
ETAS and Infineon receive NIST CAVP certification for ESCRYPT CycurHSM implemented on AURIX microcontrollers |
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Munich and Stuttgart, Germany – 24 November, 2023 – ETAS GmbH, a leading solution provider for Software Defined Vehicles (SDV), and Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) have successfully certified their cryptographic algorithm suite. The certificate was validated under the Cryptographic Algorithm Verification Program (CAVP) of the National Institute of Standards and Technology (NIST) and granted for ESCRYPT CycurHSM. This automotive embedded security software stack is implemented on Infineon’s second-generation AURIX™ TC3xx hardware security module (HSM). |
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| 24.11.2023 10:15 |
Infineon @ TRUSTECH 2023: Mini airport booth displays TEGRION™ and SECORA™ Pay demos for high performance government IDs and payment |
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Munich, Germany, and Paris, France – 24 November, 2023 – At TRUSTECH, the tradeshow for innovative payment and identification solutions, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) will present the latest member of the TEGRION™ family, which accelerates future-proof ID applications. Infineon’s mini airport booth will also feature the world’s first PQC-enabled ePassport demonstrator. In addition, visitors can experience the convenience of seamless payment with SECORA™ Pay X, which will be demonstrated in a pop-up manicure salon for fingernails suitable for contactless payment. |
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| 23.11.2023 10:00 |
European research project PROGRESSUS paves the way for decarbonization with improved power grid resilience |
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Munich, Germany – 23 November, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) – Intelligent management of power loads and power sources can make existing power networks more robust in order to handle the growing share of green energy. At the conclusion of the PROGRESSUS research project 22 project partners presented the project's results in Bari, Italy. Among other things, a solution was introduced which would make it possible to operate ten to fifteen times more electric car charging stations on a single network connection. In addition, a strategy for tracking electricity from generation all the way to consumption was presented. PROGRESSUS focused on three central topics: Efficient energy conversion, intelligent electricity management and secure network monitoring. |
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| 22.11.2023 11:15 |
Infineon introduces the 650 V CoolMOS™ CFD7A for energy-efficient fast electric vehicle charging |
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Munich, Germany – 22 November 2023 – The accelerated transition to electric vehicles has led to significant innovations in charging systems that demand more cost-efficient and high performing power electronics. Addressing this, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) expands its 650 V CoolMOS™ CFD7A portfolio by introducing the QDPAK package. This package family is designed to provide equivalent thermal capabilities with improved electrical performance over the well-known TO247 THD devices, thus enabling efficient energy utilization in onboard chargers and DC-DC converters. |
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