| Press Releases 61 to 66 of 1806 |
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| 22.09.2025 14:15 |
For more secure AI and ML models: Infineon’s OPTIGA™ Trust M backs Thistle Technologies’ Secure Edge AI solution |
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Munich, Germany, and Amsterdam, The Netherlands – 22 September 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) provides its OPTIGA™ Trust M security solution to Thistle Technologies for its new cryptographic protection for on-device AI models to its security software platform for embedded computing products based on the Linux® operating system (OS) or on a microcontroller. The new capabilities in the Thistle Security Platform for Devices, along with Infineon OPTIGA Trust M security solution as tamper-resistant hardware-based root-of-trust, protect the valuable intellectual property (IP) in the AI models deployed in edge AI applications, and in the training data sets on which they are based. |
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| 18.09.2025 10:15 |
Infineon power modules enhance energy efficiency in Goldwind’s grid-forming wind turbines |
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Munich, Germany – 18 September – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Goldwind Science & Technology Co., Ltd. expand their collaboration, enabling a stable and reliable flow of electricity in wind power generation. Infineon will supply Goldwind with its XHP™ 2 1700 V IGBT5 power modules with .XT technology that will enhance energy efficiency in Goldwind’s grid-forming GW 155 - 4.5 MW wind turbines. Infineon’s power modules deliver high power density, reliability, and robustness, ensuring a long operational lifetime for wind energy systems. By optimizing energy efficiency, they help to reduce energy costs and enhance the profitability of Goldwind’s wind turbines. |
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| 16.09.2025 10:15 |
Infineon expands XENSIV™ MEMS microphone lineup delivering best-in-class audio and power performance |
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Munich, Germany – 16 September 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has expanded its XENSIV™ MEMS microphone lineup with the introduction of the IM72D128V and IM69D129F, two innovative digital PDM microphones designed for exceptional audio performance, energy efficiency, and robustness. Leveraging Infineon’s proprietary Sealed Dual Membrane (SDM) technology, both microphones achieve a high level of robustness against water and dust (IP57), making them suitable for use in demanding environments. |
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| 10.09.2025 11:15 |
Infineon releases 12 kW high-density power supply unit (PSU) reference design for AI data centers and servers |
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Munich, Germany – 10 September 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is introducing a 12 kW reference design for high-performance power supply units (PSUs), specifically designed for AI data centers and server applications. The reference design offers high efficiency and high-power density, and leverages all relevant semiconductor materials silicon (Si), silicon carbide (SiC) and gallium nitride (GaN). It is aimed at research and development engineers, hardware designers, and developers of power electronics systems. |
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| 09.09.2025 09:45 |
Infineon signs MoU with Lingji to develop high-performance gallium nitride (GaN)-based inverters for light electric vehicles |
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Munich, Germany – 09 September 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Lingji Innovation Technology Co., Ltd., a subsidiary of Ninebot, signed a Memorandum of Understanding (MoU) to further drive gallium nitride (GaN) technology in the area of light electric vehicles (LEV). Infineon provides premium quality GaN products supporting Lingji to develop high-performance electric two-wheeler inverter systems based on Infineon’s new-generation CoolGaN™ G5 power transistors to drive advancements in energy efficiency and performance. |
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| 04.09.2025 12:15 |
Infineon introduces AURIX™ TC4x software to enable quality, safety, and security in automotive applications |
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Munich, Germany – 4 September 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has launched a comprehensive software portfolio designed specifically for the latest AURIX™ TC4x microcontroller (MCU) family. It enables automotive safety applications with production ready ASIL D drivers for the AUTOSAR MCAL and safety software. By reducing efforts for software partitioning, system level safety argumentation, and simplifying virtual control units it speeds up time to market. |
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