| Press Releases 61 to 66 of 1795 |
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| 19.08.2025 10:15 |
Infineon AIROC™ CYW20829 to support Engineered for Intel® Evo™ Laptop Accessories Program |
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Munich, Germany – 19 August, 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced that its AIROC™ CYW20829 Bluetooth® LE microcontroller (MCU) and Software Development Kit (SDK) are now verified as part of the Engineered for Intel® Evo™ laptop accessory program, the first of its kind in the Bluetooth® human interface device (HID) industry. Through this collaboration with Intel, vendors developing next generation HID devices can confidently “ditch the dongle” using CYW20829. With this new solution, designers can achieve a best-in-class direct-to-host connection which has been rigorously tested against Intel’s strict KPIs and experience requirements. |
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| 14.08.2025 15:15 |
Infineon successfully completes acquisition of Marvell's Automotive Ethernet business |
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– Acquisition boosts Infineon’s position in software-defined vehicles and expands global leadership in automotive semiconductors
– Additional growth opportunities anticipated with physical AI applications such as humanoid robots
– Acquisition adds design-win pipeline of around US$4 billion by 2030 with significant potential for future revenue growth
Munich, 14 August 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today completed the acquisition of Marvell Technology, Inc.'s (NASDAQ: MRVL) Automotive Ethernet business. The transaction agreement was announced in April 2025 and has received all necessary regulatory approvals. With the acquisition, Infineon strengthens its system expertise for software-defined vehicles and further expands its leading position in the field of microcontrollers for automotive applications. |
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| 05.08.2025 07:33 |
Q3 FY 2025 revenue as guided, Segment Result above forecast. Further growth expected in the current quarter despite ongoing tariff uncertainties and weaker US dollar |
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Neubiberg, 5 August 2025 – Today, Infineon Technologies AG is reporting results for the third quarter of the 2025 fiscal year (period ended 30 June 2025). |
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| 01.08.2025 12:30 |
Court rules in favor of Infineon in patent infringement case against Innoscience |
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Munich, Germany – 01.08.2025 – The District Court Munich, Germany (Landgericht München I) today ruled in favor of Infineon Technologies AG in a first instance patent infringement case concerning gallium nitride (GaN) technology between Infineon and Innoscience. The case centers on the unauthorized use of Infineon’s patented GaN technologies by Innoscience. GaN plays a pivotal role in enabling high-performance and energy-efficient power systems in a broad range of applications, including renewable energy systems, data centers, industrial automation, and electric vehicles (EVs). |
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| 29.07.2025 10:00 |
Infineon’s CoolSiC™ MOSFETs 1200 V G2 in a Q-DPAK package enable higher power density for industrial applications |
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Munich, Germany – 29 July 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has launched the CoolSiC™ MOSFETs 1200 V G2 in a top-side-cooled (TSC) Q-DPAK package. The new devices deliver optimized thermal performance, system efficiency, and power density. They were specifically designed for demanding industrial applications that require high performance and reliability, such as electric vehicle chargers, solar inverters, uninterruptible power supplies, motor drives, and solid-state circuit breakers. |
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| 10.07.2025 10:15 |
XENSIV™ magnetic 3D sensor enables high-precision position detection in automotive, industrial, and consumer applications |
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Munich, Germany – 10 July 2025 – Leveraging its expertise in magnetic position sensors, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has launched the third generation of the XENSIV™ 3D magnetic Hall-effect sensor family, comprising three product series: TLE493D-W3B6-Bx, TLE493D-P3B6, and TLE493D-P3I8. Developed in accordance with ISO26262, the sensor family provides integrated diagnostic functions to support functional safety applications up to ASIL-B. Due to their high flexibility, the devices are ideal for a wide range of industrial, consumer, and automotive applications, such as long-stroke linear position measurement, angular position measurement, automotive controls, and pedal or valve position sensing. In automotive applications, they enable control in the interior and under the hood, leveraging three-dimensional measurement functions and high-temperature resistance. |
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