| 12.12.2024 14:00 |
ROHM’s PMICs for SoCs have been Adopted in Reference Designs for Telechips’ Next-Generation Cockpits |
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Willich-Münchheide, Germany, December 12, 2024 – ROHM has announced the adoption of its PMICs in power reference designs focused on the next-generation cockpit SoCs ‘Dolphin3’ (REF67003) and ‘Dolphin5’ (REF67005) by Telechips, a major fabless semiconductor manufacturer for automotive applications headquartered in Pangyo, South Korea. Intended for use inside the cockpits of European automakers, these designs are scheduled for mass production in 2025. |
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| 10.12.2024 14:00 |
ROHM and TSMC Launch Strategic Gallium Nitride Technology Collaboration for Automotive Industry |
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Willich-Münchheide, Germany, December 10, 2024 – ROHM Co., Ltd. (ROHM) announced today that ROHM and TSMC have entered a strategic partnership on development and volume production of gallium nitride (GaN) power devices for electric vehicle applications. |
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| 04.12.2024 14:00 |
ROHM’s EcoSiC™ Technology has been Adopted in COSEL’s HFA/HCA Series of 3.5kW Output AC-DC Power Supply Units |
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Willich-Münchheide, Germany, December 04, 2024 – ROHM has announced the adoption of its EcoSiC products, including SiC MOSFETs and SiC Schottky barrier diodes (SBDs) in the HFA/HCA series of 3.5kW output AC-DC power supply units for 3-phase applications from COSEL, a leading power supply manufacturer in Japan. Incorporating ROHM SiC MOSFETs and SiC SBDs into the forced air-cooled HFA series and conduction-cooled HCA series achieves up to 94% efficiency. The HCA series has been mass produced since 2023, while the HFA series began mass production in 2024. |
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| 26.11.2024 09:30 |
Valeo & ROHM Semiconductor co-develop the next generation of power electronics |
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Paris/Düsseldorf, November 26th, 2024 – Valeo, a leading automotive technology company, and ROHM Semiconductor, a major semiconductor and electronic component manufacturer, collaborate to propose and optimize the next generation of power modules for electric motor inverters using their combined expertise in power electronics management. As a first step, ROHM will provide its 2-in-1 Silicon Carbide (SiC) molded module TRCDRIVE pack to Valeo for future powertrain solutions. |
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| 12.11.2024 14:00 |
ROHM’s New SiC Schottky Barrier Diodes for High Voltage xEV Systems: Featuring a Unique Package Design for Improved Insulation Resistance |
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Willich-Münchheide, Germany, November 12, 2024 – ROHM has developed surface mount SiC Schottky barrier diodes (SBDs) that improve insulation resistance by increasing the creepage distance between terminals. The initial lineup includes eight models - SCS2xxxNHR - for automotive applications such as onboard chargers (OBCs), with plans to deploy eight models - SCS2xxxN - for industrial equipment such as FA devices and PV inverters in December 2024. |
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| 07.11.2024 14:00 |
ROHM’s New 1200V IGBTs Achieve Industry-Leading* Low Loss Characteristics with High Short-Circuit Tolerance |
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Willich-Münchheide, Germany, November 07, 2024 – ROHM has developed automotive-grade AEC-Q101 qualified 4th Generation 1200V IGBTs that combine class-leading* low loss characteristics with high short-circuit resistance. This makes the devices ideal for vehicle electric compressors and HV heaters as well as industrial inverters. The current lineup includes four models - RGA80TRX2HR / RGA80TRX2EHR / RGA80TSX2HR / RGA80TSX2EHR – in two discrete package types (TO-247-4L and TO-247N), along with 11 bare chip variants - SG84xxWN - with plans to further expand the lineup in the future. |
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