Press Releases 1201 to 1206 of 1214
20.09.2005 16:00 Infineon Achieves a 300 Percent Growth Rate in the VoIP Market in 2004 and Underlines Technology Leadership with New Products at the Fall 2005 VON Tradeshow
Munich, Germany and Boston, USA – September 20, 2005 – Infineon Technologies AG (FSE/NYSE: IFX), a leading supplier of communication ICs (Integrated Circuit), today announced that its revenues in VoIP (Voice over Internet Protocol) CPE (Customer Premises Equipment) products grew at the rate of 300...
14.09.2005 14:30 X-FAB will not acquire Infineon plant in Perlach
Munich, Germany, September 14, 2005 - During discussions in the past weeks initiated by Infineon, Infineon Technologies AG (FSE/NYSE: IFX), Munich, and X-FAB Semiconductor Foundries AG, Erfurt, concluded that X-FAB will not take over the Infineon plant in Perlach. Both X-FAB and Infineon were...
31.08.2005 11:20 Infineon Offers New Silicon-Germanium Carbon Technology Based RF Transistors with Extremely Low Noise Figures for Various Wireless Applications
Munich, Germany - August 31, 2005 - Infineon Technologies AG (FSE/NYSE: IFX) today unveiled its new SiGe:C (Silicon-Germanium Carbon) process technology for cost-effective, high-performance radio frequency (RF) semiconductor devices. The innovative SiGe:C technology is the foundation for Infineon’s...
31.08.2005 10:00 Infineon Strengthens Communications Team
Munich, Germany - August 31, 2005 - On September 1, Markus Berner (41) will assume responsibility for the new Communications Region Europe and Issues Management at Infineon Technologies, the largest European semiconductor company. Markus Berner’s previous post was as Press Relations Officer at...
30.08.2005 10:45 Infineon Provides Key Components In Microsoft Xbox 360 Game Console
Munich, Germany - August 30, 2005 - Infineon Technologies AG (FSE/NYSE: IFX) today announced that it will supply three key components for the Microsoft Xbox 360™ video game and entertainment system. Infineon will provide a removable solid-state memory unit product, a single-chip application...
23.08.2005 15:00 Infineon Boosts DDR2 FB-DIMM Deployment: Designs and Manufactures All Key Components for Industry’s Next-Generation Server Memory Modules; Delivers AMB-Chip to FB-DIMM Manufacturers
Munich, Germany and San Francisco, USA - August 23, 2005 - At the Intel Developer Forum (IDF) in San Francisco today, Infineon Technologies AG (FSE/NYSE: IFX), a leading supplier of memory products, announced that it is sampling the industry’s only Double Data Rate 2 (DDR2) Fully Buffered...
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