Press Releases 1183 to 1188 of 1725
19.02.2013 10:00 300-millimeter thin-wafer production by Infineon completes qualification; First CoolMOS™ family chips now being shipped worldwide
Neubiberg, Germany - February 19, 2013 - Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has achieved a major breakthrough in the manufacturing of power semiconductors on 300-millimeter thin wafers. In February, the company received the first customer go-aheads for products of the CoolMOS family produced by the 300-millimeter line at the Villach (Austria) site. ...
14.02.2013 15:00 New Type of Paste with Enhanced Thermal Conductivity for Modules – TIM Allows Higher Power Density for Same Ageing Resistance
Neubiberg/Germany and Irvine/USA - February 14, 2013 - Power electronics are experiencing a continuous rise in their power densities. As a consequence, thermal management for today’s power semiconductors must be integrated as early as their design phase. Only then can reliable cooling be safeguarded ...
12.02.2013 16:10 New 60V LED Drivers from Infineon Improve Efficiency, Light Quality and Operating Lifetime of Solid State Lighting Systems
Munich and Santa Clara, Calif. - February 12, 2013 - Today at Strategies in Light, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduced two new 60V DC/DC LED drivers that offer excellent power conversion efficiency, benchmark current accuracy that helps assure constant light output, and first-in-the-industry adjustable over-temperature protection that protects light elements from damage through overheating. ...
31.01.2013 07:32 Infineon Q1/2013: Segment Result in line with expectations; cost savings taking effect
Neubiberg, Germany - January 31, 2013. Infineon Technologies AG today reported results for the first quarter of the 2013 fiscal year, ended December 31, 2012. ...
29.01.2013 11:00 New Infineon 'Coil on Module' Chip Package Simplifies Manufacturing of Robust Dual Interface Bank and Credit Cards; Supports Global Introduction of Contactless Payment Applications
Neubiberg, Germany - January 29, 2013 - Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a worldwide leading manufacturer of semiconductor solutions for payment applications, today introduced its innovative 'Coil on Module' chip package for Dual Interface bank and credit cards. ...
17.01.2013 12:00 Infineon’s New XMC1000 Industrial Microcontroller Family Delivers 32-Bit Performance at 8-Bit Prices; Breakthrough Price/Performance Enabled By 65nm e-Flash Technology on 300mm Wafers; Samples Available from March 2013
Neubiberg, Germany - January 17, 2013 - Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today presented its new 32-bit microcontroller family XMC1000, which uses the ARM Cortex-M0 processor. With the XMC1000, Infineon is the first semiconductor provider to offer 32-bit microcontrollers at 8-bit prices that are supported with an advanced, 32-bit peripheral set.  
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