| 26.01.2016 11:15 |
Digital SupIRBuck™ from Infineon reduces time-to-market; voltage regulators offer a digital interface for easy and fast configuration |
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Munich, Germany – January 26, 2016 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today introduced the PMBus SupIRBuck voltage regulator family. The devices are easy-to-use, fully integrated and highly efficient DC-DC regulators with I2C/PMBus interface. The integrated PWM controller, MOSFETs ... |
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| 25.01.2016 15:45 |
Infineon strengthens footprint in expanding Chinese payment market |
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Munich, Germany – January 25, 2016 – Chip-based payment solutions are easy to use and offer higher data security than magnetic stripe cards. In 2015, China took the pole position worldwide in terms of growth for both issuing volume and the transaction value with chip-based payment cards. As one of... |
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| 14.01.2016 14:00 |
Infineon OPTIGA™ TPM chips protect latest Microsoft Surface devices |
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Munich, Germany – January 13, 2016 – Microsoft puts emphasis on hardware based security to protect sensitive user data stored on connected devices. The company integrates OPTIGA TPMs (Trusted Platform Modules) from Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) into its latest personal computin... |
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| 21.12.2015 12:00 |
Power supply to become more efficient, more stable and more secure: European research project headed by Infineon successfully completed |
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Munich, Germany – December 21, 2015 – Highly developed societies require a stable power supply that also protects the environment. The goal then is to generate electricity in as targeted and sustainable a way as possible, and to transmit it and use it as efficiently as possible. The research project... |
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| 21.12.2015 10:15 |
Infineon @CES 2016 – Explore Innovations Improving Every Day Life |
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Munich, Germany – December 21, 2015 – Microelectronics is the key to a better future and has become an indispensable part of our lives – today and even more tomorrow. At the upcoming CES 2016, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) will highlight chip technologies and system solutions ... |
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| 17.12.2015 13:45 |
CES 2016: 3D Image Sensor Chips REAL3™ of Infineon Bring Virtual Reality to the Smartphone |
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Munich and Siegen, Germany – December 17, 2015 – In the future, mobile devices will be able to quickly and realistically detect their surroundings in three dimensions (3D). When they do, it will be thanks to the 3D image sensor chips from Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and pmdtechnologies... |
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