| 30.05.2017 10:00 |
Ready for tomorrow: Infineon demonstrates first post-quantum cryptography on a contactless security chip |
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Munich, Germany – 30 May 2017 – Due to their computing power, quantum computers have the disruptive potential to break various currently used encryption algorithms. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), the leading provider of security solutions, is ready to provide a smooth transition... |
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| 29.05.2017 11:45 |
"eRamp" strengthens Germany and Europe in power electronics |
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Munich and Dresden, Germany – 29 May 2017 – One of the most important European research projects for energy efficiency, “eRamp”, is coming to a close. Over the past three years, 26 partners from business and science have explored innovative electronics components for using energy even more efficient... |
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| 19.05.2017 13:15 |
Microelectronics for connected production: Infineon launches “Productive4.0” research project in Dresden |
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Munich and Dresden, Germany – 19 May 2017 – “Productive4.0”, the largest European research initiative to date in the field of Industry 4.0, was launched today at Infineon Technologies in Dresden. Coordinated by Infineon Technologies AG, more than 100 partners from 19 European countries will work on digitizing and networking industry. ... |
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| 16.05.2017 11:00 |
Infineon starts volume production of first full-SiC-module, announces additional devices for its CoolSiC™ family at PCIM |
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Munich and Nuremberg, Germany – 16 May 2017 – Higher efficiency, increased power density, smaller footprints and reduced system costs: these are the main advantages of transistors based on silicon carbide (SiC). Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is starting volume production for the... |
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| 12.05.2017 12:00 |
From payment to ticketing: contactless technologies are on the rise in smart cities |
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Munich, Germany, and Montreal, Canada – 12 May 2017 – Contactless card and touch-and-go mobile technology payments are on the rise: especially consumers and commuters in highly populated urban areas require higher transaction speeds and more convenience. Infineon Technologies AG (FSE: IFX / OTCQX... |
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| 10.05.2017 13:15 |
TRENCHSTOP™ Advanced Isolation package for discrete IGBTs |
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Munich, Germany – 10 May 2017 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the new package technology TRENCHSTOP™ Advanced Isolation. It is available for TRENCHSTOP and TRENCHSTOP Highspeed 3 IGBTs for best-in-class thermal performance and simpler manufacturing. The two versions ... |
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