| Press Releases 97 to 102 of 1706 |
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| 17.09.2024 10:15 |
SECORA™ Pay Bio enhances convenience and trust of biometric contactless payment |
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Munich, Germany – 17 September 2024 – As the payment world moves towards digitalization, the need to protect digital identities and transactions has never been more important. In addition to standard contactless payment cards, biometric payment cards are a promising development in this area and are gaining in popularity. Against this backdrop, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced SECORA™ Pay Bio, an all-in-one biometric payment card solution that complies with Visa and Mastercard specifications. It integrates Infineon’s enhanced SLC39B system-on-chip (SoC) Secure Element and the FPC1323 sensor by Fingerprint Cards AB (Fingerprints™) into the Infineon Biometric Coil on Module (BCoM) package, leveraging the key advantages of inductive coupling technology. The solution uses the fingerprint credentials securely stored on the card as a second authentication factor, enabling a convenient and trusted contactless payment experience. |
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| 16.09.2024 10:15 |
Infineon introduces the XENSIV™ PAS CO2 5V sensor for higher energy efficiency and improved air quality in buildings |
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Munich, Germany – 16 September 2024 – In order to further drive decarbonization, improving the energy efficiency of buildings is crucial, as they contribute significantly to global energy consumption and carbon emissions. Innovative solutions are needed to optimize energy consumption while ensuring a healthy indoor environment. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is addressing this need with the introduction of the new XENSIV™ PAS CO2 5V sensor. It is based on the Photoacoustic Spectroscopy (PAS) technology and improves energy efficiency by adapting ventilation to actual occupancy, thereby reducing the carbon footprint of buildings. This makes the device suitable for applications such as heating, ventilation, and air conditioning (HVAC) systems as well as room controller and thermostat units in commercial and residential buildings. It can also be used for IoT and consumer devices such as smart lighting, air purifiers, conferencing systems, and smart speakers, as well as emerging applications such as smart horticulture and smart refrigerators. |
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| 12.09.2024 11:15 |
Infineon receives 2024 ASCM award of excellence |
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Munich, Germany – 12 September 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has received the “ASCM Award of Excellence – Corporate Transformation” from the Association for Supply Chain Management (ASCM), the global leader in supply chain learning, transformation, innovation and leadership. The award recognizes an organizational transformation that improves business by assessing the supply chain using ASCM's global standards, products, services and resources. Infineon was honored for a supply chain initiative that implemented the Supply Chain Operations Reference (SCOR) model of ASCM. By focusing on customer-centricity, Infineon significantly improved customer satisfaction, optimized capacity use and realized substantial cost savings. |
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| 12.09.2024 10:00 |
Automated driving: ZF and Infineon use AI algorithms to optimize software and control units for driving dynamics |
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Friedrichshafen and Munich, Germany – 12 September 2024 – Trucks automatically driving behind one another on the highway, 'platooning', or cars automatically changing lanes: Here vehicle movements have to be calculated and executed precisely and quickly without a human driver. Software and AI algorithms safely control the drive, brakes, front and rear wheel steering and damping systems. The more efficient the AI algorithms are, the better the available computing power can be used. |
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| 11.09.2024 12:30 |
Infineon nominated for “Deutscher Zukunftspreis” 2024 with innovative silicon carbide solution |
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Munich, Germany – 11 September 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has been nominated for the Deutscher Zukunftspreis 2024, the Federal President’s Award for Technology and Innovation, for its development of a new type of energy-saving chip based on the innovative semiconductor material silicon carbide (SiC). The Jury of Deutscher Zukunftspreis has announced the three nominated teams today in Munich. A team of developers from Infineon, together with Chemnitz University of Technology, has succeeded in developing the world's first silicon carbide MOSFET with a vertical channel (trench MOSFET) and innovative copper contacting in the 3300V voltage class. The new SiC modules and the power converters equipped with the modules represent a revolutionary innovation leap in semiconductor technology from conventional silicon to more energy-efficient silicon carbide, which reduces switching losses in high-current applications by 90 percent. |
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| 11.09.2024 10:00 |
Infineon pioneers world’s first 300 mm power gallium nitride (GaN) technology – an industry game-changer |
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Munich, Germany and Villach, Austria – 11 September 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced that the company has succeeded in developing the world’s first 300 mm power gallium nitride (GaN) wafer technology. Infineon is the first company in the world to master this groundbreaking technology in an existing and scalable high-volume manufacturing environment. The breakthrough will help substantially drive the market for GaN-based power semiconductors. Chip production on 300 mm wafers is technologically more advanced and significantly more efficient compared to 200 mm wafers, since the bigger wafer diameter offers 2.3 times more chips per wafer.
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