| 08.12.2017 14:45 |
Infineon at CES® 2018: Microelectronics - at the Heart of Innovation |
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At CES 2018 (Consumer Electronics Show, January 9-12, 2018 in Las Vegas), Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) will demonstrate how its innovations are making life easier, safer and greener in Booth MP 26065, South Hall 2 of the Las Vegas Convention Center. ... |
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| 07.12.2017 11:15 |
Better data security for vehicle communication with AURIX™ by Infineon and CycurHSM by ESCRYPT |
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Bochum and Munich, Germany – 7 December 2017 – The more connectivity and automated driving functions are built into cars, the more important embedded IT security becomes for vehicle communication. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and ESCRYPT GmbH work closely together in the field ... |
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| 30.11.2017 11:15 |
Audi relies on Infineon: World’s first series production car with autonomous driving features |
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Munich, Germany – 30 November 2017 – Infineon supplies key components for the Audi A8, the world’s first series production car featuring level 3 automated driving. The ability of cars to self-drive is split into a number of different levels: With level 3 (see explanation below), drivers can ... |
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| 29.11.2017 15:00 |
Two "SESAMES Awards" for post-quantum cryptography on contactless security chip |
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Munich, Germany, and Cannes, France - 29 November 2017 - Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has been recognized with two SESAMES Awards for the world's first post-quantum cryptography implementation on a contactless security chip. The prestigious industry awards were presented today at the TRUSTECH 2017 in Cannes. Infineon was awarded in two of six categories: Cybersecurity and eGovernment. ... |
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| 29.11.2017 14:00 |
New SECORA™ Pay brand: one-stop-offering for fast and easy production of payment cards and smart wearables |
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Munich, Germany and Cannes, France – 29 November 2017 – EMV®-compliant payment solutions face growing demand worldwide – with a clear path towards contactless and multifunctional use to increase user convenience. Under the brand SECORA™ Pay, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) bundles... |
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| 27.11.2017 13:15 |
Coil on Module for contactless ID documents: complete solution with chip and antenna from a single source |
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Munich, Germany - 27 November 2017 - The core of electronic ID cards (eID) and passports are powerful and robust security solutions. Security chips in "Coil-on-Module" (CoM) packages offer significant advantages here. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is now expanding its internationally proven CoM portfolio with a complete solution for contactless ID documents. ... |
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