| 07.03.2019 11:15 |
Latest TRENCHSTOP™ IGBT7 and EC7 diode tailored for industrial drives applications |
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Munich, Germany – 7 March 2019 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is introducing its new 1200 V TRENCHSTOP™ IGBT7 and emitter-controlled EC7 diode. The IGBTs provide for higher power density, lower system cost, and reduced system size. Packaged in the well-known Easy housing, the ... |
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| 26.02.2019 15:00 |
Xilinx and Infineon are collaborating to offer power solutions for Zynq® UltraScale™+ MPSoC and RFSoC families |
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Munich, Germany – 26 February 2019 – Xilinx Inc. and Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) have collaborated to provide scalable power for the Xilinx® Zynq® UltraScale™+ MPSoC and RFSoC families. Infineon is contributing its leading power management integrated circuit (PMIC) IRPS5401 to... |
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| 26.02.2019 10:15 |
Mobile World Congress: A new level of convenience and security for smart device transactions |
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Munich, Germany, and Barcelona, Spain – 26 February 2019 – For today’s consumers, it’s all about convenience – everything has to be intuitive and fast - while security is a must. An increasingly mobile lifestyle in particular requires new forms of authentication and device convergence for all kinds ... |
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| 25.02.2019 12:00 |
Mobile World Congress: Infineon announces eSIM solution for mobile consumer devices |
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Munich, Germany – 25 February 2019 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) presents its new embedded SIM (eSIM) solution designed specifically for mobile consumer devices at Mobile World Congress (Barcelona, Spain, 25-28 February, Hall 6, stand 6C41). Infineon offers manufacturers of ... |
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| 25.02.2019 09:30 |
Infineon launches partner network to advance Voice User Interface in connected devices |
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Munich, Germany, and Barcelona, Spain – 25 February 2019 – From smart speakers and smart TVs to conferencing systems and smart home appliances: electronic devices can be operated much more easily and intuitively with speech recognition. Consequently, demand for voice user interfaces (VUI) in ... |
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| 25.02.2019 09:15 |
REAL3™ Time-of-Flight image sensor: fourth generation with HVGA resolution for high quality photo effects and more |
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Munich, Germany – 25 February 2019 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is presenting the fourth generation of its REAL3™ image sensor IRS2771C at Mobile World Congress 2019 in Barcelona, Spain. The 3D Time-of-Flight (ToF) single chip is especially designed to meet the requirements ... |
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