| 04.06.2018 11:15 |
Automotive CoolSiC™ Schottky diodes: combining performance and robustness |
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Munich, Germany – 4 June 2018 – At this year’s PCIM Europe trade fair in Nuremberg (June 5 to June 7) Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) presents the first products of its automotive Silicon Carbide portfolio: the CoolSiC™ Schottky diode family is now ready for current and future ... |
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| 04.06.2018 10:15 |
Double DPAK: first top-side cooled SMD solution for high power applications |
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Munich, Germany – 4 June 2018 – Increasing complexity of end products is challenging the design parameters for high power supplies: these require higher power and more efficiency in an even smaller space. Semiconductor devices are essential to the operation and performance of modern switched mode power... |
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| 29.05.2018 10:15 |
Highest power density for 650V IGBT in surface mounting D2PAK |
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Munich, Germany – 29 May 2018 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) expands its product portfolio of the thin-wafer technology TRENCHSTOP™5 IGBT. The new product family is offering up to 40 A 650V IGBT, co-packed with a full rated 40 A diode in a surface mounting TO-263-3 also known... |
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| 25.05.2018 10:15 |
Powerful IT security for the car of the future – research alliance develops new approaches |
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Munich, Germany - 25 May 2018 - The more electronics steer, accelerate and brake cars, the more important it is to protect them against cyber attacks. That is why 15 partners from industry and academia will work together over the next three years on new approaches to IT security in self-driving cars. ... |
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| 24.05.2018 10:15 |
Infineon’s CIPOS™ Mini IPMs deliver higher efficiency in low power motor drives |
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Munich, Germany - 24 May 2018 - Global energy efficiency standards often prohibit manufacturers from importing or selling products that do not meet these standards. In order to comply with specific minimum requirements, energy losses have to be reduced by using the latest technology. ... |
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| 18.05.2018 12:45 |
Infineon prepares for long-term growth and invests €1.6 billion in new 300-millimeter chip factory in Austria |
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Munich, Germany, and Vienna, Austria, May 18, 2018 – Infineon Technologies AG is to build a new factory for power semiconductors. The market and technology leader in this segment will thereby create the foundation for long-term, profitable growth. A fully automated chip factory for manufacturing 300... |
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