| 13.01.2020 15:15 |
Infineon Supervisory Board with new line-up after the Annual General Meeting 2020 |
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Munich, Germany - 13 January 2020 - The terms of office of all employee representatives on the Supervisory Board and of six of the eight members on the side of the shareholders will expire at the close of the Annual General Meeting of Infineon Technology AG (FSE: IFX / OTCQX: IFNNY) ... |
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| 09.01.2020 09:00 |
Infineon partnering with Rompower: Expansion of the competence for system solutions of universal chargers |
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Munich, Germany - 09. January 2020 - Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) expands with Rompower its expertise for the development of universal chargers with high efficiency and compact design. These USB-PD chargers (Power Delivery) with the universal USB-C connector enable the power ... |
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| 08.01.2020 11:15 |
650 V half-bridge SOI driver families with integrated bootstrap diodes offers superior robustness |
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Munich, Germany – 8 January 2020 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) broadens its EiceDRIVER™ portfolio with the 650 V half-bridge gate drivers based on Infineon’s unique silicon on insulator (SOI) technology. The products provide leading negative transient voltage immunity, ... |
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| 06.01.2020 11:35 |
CES 2020: Infineon presents the world’s smallest 3D image sensor for face authentication and photo effects on smartphones and the like |
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Munich/Las Vegas, Germany/USA, 6 January 2020 – Reliable face authentication, improved photo functions and authentic augmented reality experiences: 3D depth sensors assume a key role in smartphones and for applications that rely on accurate 3D image data. Infineon Technologies AG has collaborated... |
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| 18.12.2019 10:15 |
EconoDUAL™ 3 with TRENCHSTOP™ IGBT7 for an unmatched 900 A power rating |
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Munich, Germany – 18 December 2019 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduced the new IGBT7 chip for its well-known Easy housing platform in March. Now it is taking the state-of-the-art TRENCHSTOP™ IGBT7 to the arena of medium power: in the standard industry package EconoDUAL™ 3... |
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| 10.12.2019 11:15 |
Innovations by Infineon at CES® 2020 link the real with the digital world |
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Munich, Germany and Las Vegas, USA – December 10, 2019 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) will demonstrate innovations in semiconductor-based products that help connect the real and the digital world. Safe and secure connections are built around advanced sensor technologies, ... |
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