| 08.01.2020 11:15 |
650 V half-bridge SOI driver families with integrated bootstrap diodes offers superior robustness |
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Munich, Germany – 8 January 2020 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) broadens its EiceDRIVER™ portfolio with the 650 V half-bridge gate drivers based on Infineon’s unique silicon on insulator (SOI) technology. The products provide leading negative transient voltage immunity, ... |
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| 06.01.2020 11:35 |
CES 2020: Infineon presents the world’s smallest 3D image sensor for face authentication and photo effects on smartphones and the like |
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Munich/Las Vegas, Germany/USA, 6 January 2020 – Reliable face authentication, improved photo functions and authentic augmented reality experiences: 3D depth sensors assume a key role in smartphones and for applications that rely on accurate 3D image data. Infineon Technologies AG has collaborated... |
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| 18.12.2019 10:15 |
EconoDUAL™ 3 with TRENCHSTOP™ IGBT7 for an unmatched 900 A power rating |
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Munich, Germany – 18 December 2019 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduced the new IGBT7 chip for its well-known Easy housing platform in March. Now it is taking the state-of-the-art TRENCHSTOP™ IGBT7 to the arena of medium power: in the standard industry package EconoDUAL™ 3... |
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| 10.12.2019 11:15 |
Innovations by Infineon at CES® 2020 link the real with the digital world |
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Munich, Germany and Las Vegas, USA – December 10, 2019 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) will demonstrate innovations in semiconductor-based products that help connect the real and the digital world. Safe and secure connections are built around advanced sensor technologies, ... |
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| 28.11.2019 09:15 |
Updatable security for long-life Industry 4.0 and ICT systems |
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Munich, Germany – 28 November 2019 – Connected machines and ICT systems require security mechanisms that are particularly robust and remain so for the long life common with industrial hardware. Withstanding attacks over the long term means keeping the protections at the state-of-the-art through ... |
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| 27.11.2019 10:15 |
New 50 and 60 mm modules for Drives and UPS applications, Prime Block designed for highest performance |
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Munich, Germany – 27 November 2019 – Infineon Technologies Bipolar GmbH & Co. KG has expanded its product portfolio of thyristor/diode modules. The new Prime Block 50 mm modules feature solder bond technology and the 60 mm modules pressure contact technology. They are designed for highest ... |
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