| Press Releases 673 to 678 of 1806 |
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| 07.01.2021 10:00 |
Infineon takes lead in MEMS microphone market, launches new technologies for further improved acoustical performance and power consumption |
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Munich, Germany – 7 January 2021 – According to research consultancy Omdia*1, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has successfully positioned itself as the market leader for MEMS microphones. Based on MEMS chip unit sales, the market share was reported to have been catapulted to a staggering 43.5 percent. This positions Infineon at #1 with a lead of almost 4 percent over second place and more than 37 percent over third place. This positive development is due also to Infineon’s long-term experience in MEMS microphone design and high volume manufacturing for delivering an unmatched consumer experience. |
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| 17.12.2020 09:45 |
Infineon’s smart entrance counter solution named as CES 2021 Innovation Awards Honoree |
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Munich, Germany and Las Vegas, USA – 17 December 2020 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) smart entrance counter solution has been named a CES® 2021 Innovation Awards Honoree in the "Smart Cities" category. The solution enables accurate, anonymous and contactless people counting using a single XENSIV™ 60 GHz radar and integrated software. A traffic light system informs whether entry to the location is allowed. At a time when social distancing is imperative to help slow down the spread of COVID-19, the radar-based entrance counter provides an effective way to manage room occupancy and traffic in commercial, office and public spaces. |
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| 16.12.2020 10:15 |
EiceDRIVER™ X3 Compact: easy to use, small footprint gate driver for fast design-ins |
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Munich, Germany – 16 December 2020 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) adds a new generation to its most versatile and simple to use EiceDRIVER™ 1ED Compact isolated gate driver family: the X3 Compact (1ED31xx) family. This gate driver provides separate output options together with active shutdown and short circuit clamping in DSO-8 300 mil package. The active Miller clamp option is best suited for silicon carbide (SiC) MOSFET 0 V turn off. The X3 Compact offers a benchmark CMTI of 200 kV/μs, and typical 5, 10, and 14 A output current. It is aiming at industrial drives, solar systems, EV charging, uninterruptible power supplies, commercial air conditioning as well as other applications. |
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| 10.12.2020 10:15 |
New gate driver ICs for 5G and LTE macro base stations |
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Munich, Germany – 10 December 2020 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the new EiceDRIVER™ 2EDL8 gate driver IC product family to foster the growth in DC-DC telecom bricks for mobile network infrastructure. These dual-channel junction-isolated gate driver ICs allow for high power density, high efficiency and robustness in isolated DC-DC step-down converters/telecom bricks enabling macro base stations for 5G and LTE telecom infrastructures. |
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| 03.12.2020 17:45 |
EiceDRIVER™ X3 Enhanced family for greater design flexibility and reduced hardware complexity |
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Munich, Germany – 3 December 2020 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has launched the EiceDRIVER™ X3 Enhanced analog (1ED34xx) and digital (1ED38xx) gate driver ICs. These devices provide a typical output current of 3, 6 and 9 A, precise short-circuit detection, a Miller clamp and soft turn-off. In addition, 1ED34xx offers an adjustable desaturation filter time and soft turn-off current with external resistors. These features combine to accelerate design cycles due to a lower external component count. 1ED38xx provides I²C configurability for multiple parameters. This increases design flexibility, reduces hardware complexity and shortens evaluation time. These gate drivers are suitable for industrial drives, solar systems, uninterruptible power supplies, EV chargers and other industrial applications.
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| 02.12.2020 09:15 |
CoolSiC™ CIPOS™ Maxi: World's first 1200 V transfer molded IPM with SiC |
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Munich, Germany – 2 November 2020 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has launched a 1200 V transfer molded silicon carbide (SiC) integrated power module (IPM) and concludes the massive roll-out of SiC solutions for this year. The CIPOS™ Maxi IPM IM828 series is the industry’s first in this voltage class. The series provides a compact inverter solution with an excellent thermal conduction and a wide range of switching speed for three-phase AC motors and permanent magnet motors in variable speed drive applications. Amongst others, these can be found in industrial motor drives, pumps drives, and active filters for heating, ventilation, and air conditioning (HVAC). |
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