| 16.04.2021 10:15 |
Infineon introduces industry’s first AEC-Q103 qualified high-performance XENSIV™ MEMS microphone for automotive applications |
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Munich, Germany – 16 April 2021 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the launch of the XENSIV™ IM67D130A. This new device combines the Company’s expertise in the automotive industry with its technical leadership in high-end MEMS microphones to address the need for high performance, low-noise MEMS microphones for automotive applications. The XENSIV™ IM67D130A is the first microphone in the market to be qualified for automotive applications, which will help simplify the design-in efforts for the industry and reduce the risk of qualification fails. |
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| 08.04.2021 11:00 |
Infineon successfully signed $1.3 billion US private placement to repay outstanding financing related to the acquisition of Cypress |
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Munich – 8 February 2021 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has successfully signed a $1.3 billion US private placement of notes. The proceeds of the transaction will be used to repay existing US Dollar bank term loans related to the acquisition of Cypress Semiconductor Corporation. |
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| 08.04.2021 09:15 |
Infineon expands 600 V CoolMOS™ S7 family with MOSFETs for static switching applications |
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Munich, Germany – 8 April 2021 – In applications where MOSFETs are switched at low frequency, high-power product designs must meet several key characteristics: They have to minimize conduction losses, provide optimal thermal behavior, and enable more compact and lighter systems – all while maintaining the highest quality at a low cost. To meet these requirements, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is enhancing the 600 V CoolMOS™ S7 family with two new optimized devices for static switching applications: the industrial-grade CoolMOS S7 10 mΩ and the automotive-grade CoolMOS S7A. |
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| 23.03.2021 10:15 |
Infineon launches second-generation of high-reliability non-volatile SRAM |
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Munich, Germany – 23 March 2021 – Infineon Technologies LLC, an Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) company, today announced the availability of its second-generation non-volatile Static RAMs (nvSRAM). The new generation of devices are qualified for QML-Q and high-reliability industrial specifications to support demanding non-volatile code storage and data-logging applications in harsh environments, including aerospace and industrial applications. |
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| 19.03.2021 18:30 |
Infineon re-ramps production in Austin, Texas, and provides update on customer impact; pre-shutdown output level expected in June 2021 |
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Munich – 19 March 2021 – Infineon Technologies (FSE: IFX / OTCQX: IFNNY) continues ramping up its manufacturing facility in Austin, Texas. Infrastructure had been recovered within one week after the forced shutdown on 15 February 2021. Tools are operational, production has been resumed and will ramp up over time to pre-outage levels. The shutdown was required after a severe winter storm and its resulting long-lasting regional power outage. |
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| 19.03.2021 10:15 |
World’s first TPM 2.0 with open-source software stack cuts down security integration efforts in industrial, automotive and IoT applications |
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Munich, Germany – 19 March 2021 – Trusted Platform Modules (TPM) enable secured remote software updates, disc encryption and user authentication. Hence, they are crucial for connected industrial, automotive and other embedded devices. To further facilitate seamless integration in Linux-based systems, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) now provides its leading OPTIGA™ TPM 2.0 solution with a comprehensive TSS* host software implementing the latest FAPI standard. Infineon has developed the open-source software jointly with Intel Corporation and Fraunhofer Institute for Secure Information Technology SIT. |
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