| Press Releases 655 to 660 of 1768 |
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| 29.10.2020 11:45 |
Infineon adds 40 V device in PQFN to its OptiMOS™ Source-Down power MOSFET family |
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Munich, Germany – 29 October 2020 – Contemporary power system designs demand high power density levels and small form factors to maximize system-level performance. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) tackles this challenge by focusing on system innovation with enhancements on the component level. Adding to the 25 V device introduced in February, Infineon now brings the OptiMOS™ 40 V low-voltage power MOSFET to the market. It is packaged in the Source-Down (SD) PQFN with a 3.3 x 3.3 mm² footprint. The 40 V SD MOSFET primarily addresses SMPS for server, telecom, and OR-ing, as well as battery protection, power tool, and charger applications. |
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| 29.10.2020 10:00 |
Klaus Walther is ending his career at Infineon |
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Munich, Germany – 29 October 2020 – The long-standing head of communications at Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) Klaus Walther (65) is retiring on 1 November 2020. He already arranged his succession at the start of the year, when Bernd Hops took over Infineon’s Communications department. Klaus Walther most recently served as Senior Advisor to the CEO. Following a traineeship at the Münchner Merkur newspaper, he worked as a journalist for around 20 years, among others as a foreign correspondent in Washington, D.C. for the German national broadcasting system ZDF. This was followed by 24 years as a communications manager in the industry sector at Deutsche Lufthansa AG (1999 to 2013) and Ruhrgas AG (1996 to 1999). |
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| 20.10.2020 11:00 |
EA Elektro-Automatik introduces bidirectional laboratory power supply for testing electric drive-trains, integrates CoolSiC™ MOSFETs |
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Viersen and Munich, Germany – 20 October 2020 – Hybrid and fully electric vehicle sales are picking up speed worldwide. While this is great news for the goal of reducing CO2 emissions, this is challenging for testing capacities of electronic components, namely motor, control, and battery. Testing, however, is a critical part of bringing any electric drivetrain into production. Traditional test setups require a dedicated DC source and electronic load in parallel to deal with bidirectional energy flow. |
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| 06.10.2020 14:00 |
Industry’s first security microcontrollers with Trusted Firmware-M, Arm Mbed OS and Pelion IoT platform for a complete IoT lifecycle management solution |
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Munich, Germany and San Jose, California – October 6, 2020 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) helps IoT device makers reduce firmware development risks and accelerate time-to-market with a highly integrated IoT lifecycle management solution. This industry’s first solution combines the well-known PSoC® 64 Secure Microcontrollers with Trusted Firmware-M embedded security, the Arm® Mbed™ IoT OS, and the Arm Pelion™ IoT platform to securely design, manage, and update IoT products without the need for custom security firmware. The Pelion-Ready and Mbed OS-Enabled solution demonstrates industry best practices for security, by reaching PSA Certified* Level 1. |
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| 05.10.2020 14:15 |
Infineon launches Traveo™ II Body microcontroller family for next generation vehicle electronic systems |
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Munich, Germany – 5 October 2020 – As drivetrain electrification and advanced driver assistance systems change the way we drive, the number and complexity of comfort features and other body functions in cars increases constantly. To tackle this challenge, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is launching the Traveo™ II Body microcontroller family to the open market. This product family addresses a broad variety of automotive applications, including body control modules, door, window, sunroof and seat control units as well as in-cabin smartphone terminals and wireless charging units. The market launch follows Infineon’s acquisition of Cypress Semiconductor Corporation, which developed the product family. |
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| 01.10.2020 10:15 |
Tailored to perform in resonant topologies: the new 650 V CoolMOS™ CFD7 |
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Munich, Germany – 1 October 2020 – For SMPS designs in industrial applications recent technology trends include the need for high efficiency and power density as well as increased bus voltages. This triggers the need for power devices with 650 V breakdown voltage. With its 650 V CoolMOS™ CFD7 product family Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) meets these demands. The devices are best suited for resonant topologies in soft-switching applications like telecom, server, solar and off-board EV-charging.
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