| 10.05.2021 10:15 |
Infineon launches industry’s highest density QML-V-certified QDR-II+ SRAM to simplify on-system satellite image processing |
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Munich, Germany – 10 May 2021 – Infineon Technologies LLC, an Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) company, today announced its next-generation 144-Mb Quad Data Rate II+ (QDR®-II+) SRAM that is certified to the DLA Qualified Manufacturers List Class V (QML-V). QML-V is the highest quality and reliability standard certification for aerospace-grade ICs. This radiation-hardened (rad hard) 144-Mb QDR-II+ SRAM is a unique high-speed external cache memory ideal for radar, on-board data processing and networking applications in space. |
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| 06.05.2021 09:00 |
Infineon increases supply security for silicon carbide by expanding the supplier base |
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Munich, Germany – 6 May 2021 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has concluded a supply contract with the Japanese wafer manufacturer Showa Denko K.K. for an extensive range of silicon carbide material (SiC) including epitaxy. The German semiconductor manufacturer has thus secured more base material for the growing demand for SiC-based products. SiC enables highly efficient and robust power semiconductors that are used in particular in the fields of photovoltaic, industrial power supply, and charging infrastructure for electric vehicles. |
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| 04.05.2021 14:30 |
Infineon introduces CoolGaN™ IPS family for applications in the 30 to 500 W power range |
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Munich, Germany – 4 May 2021 – Power switches based on the wide bandgap (WBG) material gallium nitride (GaN) enable excellent efficiency and high switching frequency, starting a new era in power electronics. To support this development, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) adds the new CoolGaN™ IPS family of integrated power stage (IPS) products to its broad portfolio of WBG power devices. The initial IPS portfolio consists of half-bridge and single-channel products, targeting low-to medium power applications, including chargers and adapters and switched-mode power supplies (SMPS). |
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| 04.05.2021 07:33 |
Positive revenue and earnings trajectory continuing; strong free cash flow; annual forecast raised slightly again |
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Neubiberg, Germany – 4 May 2021 – Today, Infineon Technologies AG is reporting results for the second quarter of the 2021 fiscal year (period ended 31 March 2021). |
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| 03.05.2021 12:15 |
Infineon’s XDPS2201 hybrid flyback controller delivers ultra-high-power density and outstanding efficiency for USB PD charger and adapter applications |
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Munich, Germany – 3 May 2021 – Rapid technology and market developments in the fast charger and adapter market continuously challenge designers of power supply systems. To meet the increasing demand for higher power density and energy efficiency, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) expands its XDP™ family by adding the first application-specific standard product based on an asymmetric half-bridge flyback topology. Available in a DSO-14 SMD package, the XDPS2201 is a highly integrated, multi-mode, digital and configurable hybrid flyback controller targeting high-density AC-DC power supplies, including USB PD fast charger and adapter applications. |
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| 03.05.2021 09:00 |
Industry’s first automotive qualified SiC six-pack power module for EV traction inverters – Easy power upscaling with HybridPACK™ Drive CoolSiC™ |
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Munich, Germany – 3 May 2021 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today introduced a new automotive power module with CoolSiC™ MOSFET technology. At this year’s virtual PCIM trade show, Infineon will present the new HybridPACK™ Drive CoolSiC™, a full-bridge module with 1200 V blocking voltage optimized for traction inverters in electric vehicles (EV). The power module is based on the automotive CoolSiC trench MOSFET technology for high-power density and high-performance applications. This offers higher efficiency in inverters with longer ranges and lower battery costs, particularly for vehicles with 800 V battery systems and larger battery capacity. |
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