| 19.03.2021 10:15 |
World’s first TPM 2.0 with open-source software stack cuts down security integration efforts in industrial, automotive and IoT applications |
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Munich, Germany – 19 March 2021 – Trusted Platform Modules (TPM) enable secured remote software updates, disc encryption and user authentication. Hence, they are crucial for connected industrial, automotive and other embedded devices. To further facilitate seamless integration in Linux-based systems, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) now provides its leading OPTIGA™ TPM 2.0 solution with a comprehensive TSS* host software implementing the latest FAPI standard. Infineon has developed the open-source software jointly with Intel Corporation and Fraunhofer Institute for Secure Information Technology SIT. |
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| 18.03.2021 10:15 |
Sustainable operation of trains: Power-efficient on-board electrical system uses technology developed by Siemens Mobility and Infineon |
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Munich, Germany – 18 March 2021 – As the global population experiences rapid growth, more people around the world are moving from the countryside to the city. In addition to the inner-city challenges posed by the urbanization megatrend, there is also an increase in the average traveling distance. As a result, the challenges for train systems are also increasing. To meet these demands, Siemens Mobility and Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) have jointly developed new auxiliary converters to improve the efficiency of on-board power systems using power semiconductors based on silicon carbide (SiC). |
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| 17.03.2021 14:45 |
New generation of welding diodes: higher current with lower on-state losses |
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Munich, Germany – 17 March 2021 – Infineon Technologies Bipolar GmbH & Co. KG, an Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) company, launches a new generation of power diodes. The new housingless diode family is designed for medium frequency resistance welding and high current rectifier applications. The devices meet the market requirements for higher forward current, low conduction losses and higher power cycling capability. With this new design, the diodes focus on the best-in-class performance to lifetime ratio supporting a decrease of maintenance cycles. The main applications for the new diode generation are spot-welding in the automotive industry, low voltage electrolysis and surge protection. |
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| 17.03.2021 12:15 |
650 V fast level-shift SOI EiceDRIVER™ with integrated bootstrap diodes offer superior robustness and fast frequency switching |
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Munich, Germany – 17 March 2021 – Infineon Technologies AG (FSE: IFX / QTCQX: IFNNY) broadens its EiceDRIVER™ portfolio with new 650 V half-bridge and high and low side gate drivers. The new devices are based on the company’s unique silicon-on-insulator (SOI) technology. They provide leading negative VS transient voltage immunity and monolithic integration of real bootstrap diodes. All these features reduce BOM and enable more robust designs with MOSFETs and IGBTs in a compact form factor. The fast level-shift (FLS) family is tailored for high-frequency applications like SMPS and UPS as well as industrial drives and embedded inverters, home appliances, power tools, motor control for fans and pumps. |
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| 09.03.2021 10:15 |
StrongIRFET™ 2 power MOSFETs 80 V and 100 V: right-fit products for a broad range of applications |
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Munich, Germany – 9 March 2021 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has launched StrongIRFET™ 2 – the new generation of power MOSFET technology in 80 V and 100 V. Featuring broad availability at distribution partners and excellent price/performance ratio make these right-fit products an easy choice for designers interested in convenient selection and purchasing. Optimized for both low- and high-switching frequencies, the family supports a broad range of applications enabling high design flexibility. Amongst the applications profiting from the StrongIRFET are SMPS, motor drives, battery-powered tools, battery management, UPS and light electric vehicles. |
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| 08.03.2021 10:15 |
Infineon’s CoolGaN™ delivers ultimate efficiency and reliability to telecom power applications |
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Munich, Germany – 8 March 2021 – The pace of digitalization is speeding up, not only because of the recent push to online collaboration due to the coronavirus pandemic. Thus, powerful and sufficient state-of-the-art telecom infrastructure is crucial. To meet the requirements associated with this, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has provided CoolGaN™ to deliver ultimate efficiency and reliability to telecom power supply systems. |
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