| 03.05.2021 09:00 |
Industry’s first automotive qualified SiC six-pack power module for EV traction inverters – Easy power upscaling with HybridPACK™ Drive CoolSiC™ |
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Munich, Germany – 3 May 2021 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today introduced a new automotive power module with CoolSiC™ MOSFET technology. At this year’s virtual PCIM trade show, Infineon will present the new HybridPACK™ Drive CoolSiC™, a full-bridge module with 1200 V blocking voltage optimized for traction inverters in electric vehicles (EV). The power module is based on the automotive CoolSiC trench MOSFET technology for high-power density and high-performance applications. This offers higher efficiency in inverters with longer ranges and lower battery costs, particularly for vehicles with 800 V battery systems and larger battery capacity. |
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| 30.04.2021 11:45 |
2300 V isolated EiceDRIVER™ 2L-SRC Compact: Optimizing system efficiency and EMI in the most compact form factor |
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Munich, Germany – 30 April 2021 – Highest efficiency is a key requirement for today’s power electronics. Therefore, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces its latest isolated EiceDRIVER™ 2L-SRC Compact (1ED32xx) gate driver family in a compact form factor. The gate driver family comes in an 8 mm wide-body package to ensure easy design-in and integrates a two-level slew rate control, which significantly improves system efficiency. With high voltage and high safety capabilities, the product family is suitable for applications with demanding isolation requirements, such as 1700 V industrial drives. Furthermore, it is a perfect match for applications including solar systems, uninterruptible power supplies and EV charging. |
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| 29.04.2021 10:15 |
New EasyDUAL™ CoolSiC™ MOSFET power modules with high-performance ceramic enable increased power density and more compact designs |
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Munich, Germany – 29 April 2021 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has upgraded the EasyDUAL™ CoolSiC™ MOSFET modules with a new aluminum nitride (AIN) ceramic. The devices come in half-bridge configuration with an on-state resistance (RDS(on)) of 11 mΩ in an EasyDUAL 1B package and 6 mΩ in an EasyDUAL 2B package. With high-performance ceramic, the 1200 V devices are suitable for high-power density applications including solar systems, uninterruptible power supplies, auxiliary inverters, energy storage systems and electric vehicle chargers. |
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| 28.04.2021 10:15 |
EasyPACK™ CoolSiC™ MOSFET module supports fast-switching DC-link voltage of 1500 V for solar systems and ESS applications |
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Munich, Germany – 28 April 2021 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has launched a new EasyPACK™ 2B module in the company’s 1200 V family. The module comes in 3-level Active NPC (ANPC) topology and integrates CoolSiC™ MOSFETs, TRENCHSTOP™ IGBT7 devices, and an NTC temperature sensor along with PressFIT contact technology pins. The power module is suitable for fast-switching applications like energy storage systems (ESS). The module also increases the power rating and efficiency of solar systems and supports the growing demand for 1500 V DC-link solar applications. |
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| 22.04.2021 13:15 |
EiceDRIVER™ X3 Enhanced and X3 Compact: Highly flexible and easy-to-design-in gate driver families now with reinforced isolation |
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Munich, Germany – 22 April 2021 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has expanded its easy-to-design EiceDRIVER™ X3 Compact (1ED31xx) and the highly flexible EiceDRIVER X3 Enhanced Analog (1ED34xx) and Digital (1ED38xx) gate driver families. Both families now offer variants with superior reinforced isolation for higher application safety and long operating life. The new family members are VDE 0884-11 certified. With 8 mm wide-body packages, both families are suitable for applications with demanding isolation requirements including industrial drives, solar systems, uninterruptible power supplies, EV charging and other industrial applications. |
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| 21.04.2021 12:15 |
Infineon’s new reference boards enable efficient control of rotary fridge compressor drives |
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Munich, Germany – 21 April 2021 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces two new reference boards designed for rotary refrigerator compressors supporting Infineon’s motto “From product thinking to system understanding.” Both boards are turnkey solutions for low power compressors that can be easily copied by customers to build final mass-production application boards. Since the design of the reference boards is system tested developers can drastically reduce their own system development time. |
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