| 29.06.2020 15:00 |
CoolSiC™ 62 mm module opens up new applications for silicon carbide |
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Munich, Germany – 29 June 2020 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) adds another industry standard package to its CoolSiC™ MOSFET 1200 V module family. The proven 62 mm device has been designed in half-bridge topology and is based on the trench chip technology. It opens up silicon carbide for applications in the medium power range starting at 250 kW – where silicon reaches the limits of power density with IGBT technology. Compared to a 62 mm IGBT module, the list of applications now additionally includes solar, server, energy storage, EV charger, traction, commercial induction cooking and power conversion systems. |
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| 29.06.2020 12:55 |
A class of its own: Advanced H2S protection of IGBT modules enhances lifetime |
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Munich, Germany - 29 June 2020 - Ruggedness determines the longevity and thus the reliability of modules for applications used in harsh environments. In particular the exposure to hydrogen sulfide (H2S) has a critical impact on the lifetime of electronic components. To respond to this threat, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has developed a unique protection feature. EconoPACK™ + modules with a TRENCHSTOP™ IGBT4 chipset are the first of the Econo portfolio featuring this new level of protection for inverters. ... |
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| 25.06.2020 14:00 |
New sensing and balancing IC for battery management systems in electric cars |
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Munich, Germany - 25 June, 2020 - Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is expanding its product offering for battery management systems with a new sensing and balancing IC, the TLE9012AQU. The device is especially designed for batteries in hybrid and electric cars, but it is also suitable for other applications. |
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| 25.06.2020 10:35 |
Infineon and Blumio expand collaboration to develop radar-based blood pressure sensor |
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Milpitas, CA - June 25, 2020 - Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) announced today that its Silicon Valley Innovation Center (SVIC) has entered a new agreement with Blumio to co-develop a wearable, non-invasive blood pressure sensor based on Infineon’s XENSIV™ radar chipset by 2021. The new sensor has the potential to disrupt the USD 45 billion market for wearable cardiovascular monitoring devices by enabling continuous and precise measurement without a cuff. ... |
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| 23.06.2020 10:00 |
Infineon shows responsibility in the face of Covid-19 |
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Since the beginning of the outbreak, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and its regional entities have initiated or joined 22 initiatives totaling around €570,000 to mitigate consequences of the coronavirus pandemic and support people locally. ... |
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| 17.06.2020 19:30 |
Infineon places €2.9 billion in bonds with maturities up to twelve years and thereby takes a significant further step to refinance the Cypress acquisition |
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Munich, Germany - 17 June 2020 - Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today successfully placed corporate bonds with a volume of €2.9 billion under its recently established EMTN (European Medium Term Notes) programme. The placement was more than 5-times oversubscribed and consists of four tranches with different maturities. ... |
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