| Press Releases 583 to 588 of 1714 |
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| 16.12.2020 10:15 |
EiceDRIVER™ X3 Compact: easy to use, small footprint gate driver for fast design-ins |
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Munich, Germany – 16 December 2020 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) adds a new generation to its most versatile and simple to use EiceDRIVER™ 1ED Compact isolated gate driver family: the X3 Compact (1ED31xx) family. This gate driver provides separate output options together with active shutdown and short circuit clamping in DSO-8 300 mil package. The active Miller clamp option is best suited for silicon carbide (SiC) MOSFET 0 V turn off. The X3 Compact offers a benchmark CMTI of 200 kV/μs, and typical 5, 10, and 14 A output current. It is aiming at industrial drives, solar systems, EV charging, uninterruptible power supplies, commercial air conditioning as well as other applications. |
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| 10.12.2020 10:15 |
New gate driver ICs for 5G and LTE macro base stations |
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Munich, Germany – 10 December 2020 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the new EiceDRIVER™ 2EDL8 gate driver IC product family to foster the growth in DC-DC telecom bricks for mobile network infrastructure. These dual-channel junction-isolated gate driver ICs allow for high power density, high efficiency and robustness in isolated DC-DC step-down converters/telecom bricks enabling macro base stations for 5G and LTE telecom infrastructures. |
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| 03.12.2020 17:45 |
EiceDRIVER™ X3 Enhanced family for greater design flexibility and reduced hardware complexity |
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Munich, Germany – 3 December 2020 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has launched the EiceDRIVER™ X3 Enhanced analog (1ED34xx) and digital (1ED38xx) gate driver ICs. These devices provide a typical output current of 3, 6 and 9 A, precise short-circuit detection, a Miller clamp and soft turn-off. In addition, 1ED34xx offers an adjustable desaturation filter time and soft turn-off current with external resistors. These features combine to accelerate design cycles due to a lower external component count. 1ED38xx provides I²C configurability for multiple parameters. This increases design flexibility, reduces hardware complexity and shortens evaluation time. These gate drivers are suitable for industrial drives, solar systems, uninterruptible power supplies, EV chargers and other industrial applications.
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| 02.12.2020 09:15 |
CoolSiC™ CIPOS™ Maxi: World's first 1200 V transfer molded IPM with SiC |
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Munich, Germany – 2 November 2020 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has launched a 1200 V transfer molded silicon carbide (SiC) integrated power module (IPM) and concludes the massive roll-out of SiC solutions for this year. The CIPOS™ Maxi IPM IM828 series is the industry’s first in this voltage class. The series provides a compact inverter solution with an excellent thermal conduction and a wide range of switching speed for three-phase AC motors and permanent magnet motors in variable speed drive applications. Amongst others, these can be found in industrial motor drives, pumps drives, and active filters for heating, ventilation, and air conditioning (HVAC). |
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| 26.11.2020 14:45 |
1200 V level-shift three-phase SOI EiceDRIVER™ offers superior robustness |
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Munich, Germany – 26 November 2020 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) broadens its level-shift EiceDRIVER™ portfolio with a 1200 V three-phase gate driver. It is based on the company’s unique silicon-on-insulator (SOI) technology. The device provides leading negative VS transient immunity, superior latch-up immunity, fast over-current protection, and the monolithic integration of real bootstrap diodes. These unique features reduce BOM and enable a more robust design with a compact form factor suitable for industrial drives and embedded inverter applications. |
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| 23.11.2020 14:15 |
Infineon’s SECORA™ Pay solutions enable contactless payments with environmentally friendly card body materials |
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Munich, Germany – 23. November 2020 – Contactless payment innovations from Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) contribute to a more sustainable use of resources. To support the payment industry’s move towards the use of more environmentally friendly materials for smart card manufacturing, Infineon is now offering a complete, single-source solution that is easily adaptable to different projects and market requirements. SECORA™ Pay with Coil-on-Module (CoM) package comes with a newly developed antenna, specifically designed for cards made from recycled ocean-bound plastic or wood. It is the industry-wide thinnest payment module with a copper wire antenna, which allows cost-efficient card manufacturing for mass deployment. |
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