| Press Releases 565 to 570 of 1806 |
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| 05.01.2022 10:15 |
Driving automotive innovation: Infineon’s new generation of AURIX™ microcontrollers accelerates electrification and digitalization of the car |
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Munich, Germany, and Las Vegas, Nevada, USA – 5 January 2021 – The future of mobility will be carbon-neutral, autonomous, fully connected and cyber secure. Microelectronics are at the core of this transformation. At CES 2022, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) launches a new generation of its AURIX™ microcontroller family (MCU). The TC4x series fosters the trends of eMobility, advanced driver assists systems (ADAS), automotive electric-electronic (E/E) architectures and affordable artificial intelligence (AI) applications. Furthermore, its scalable family concept allows for a common software architecture enabling significant platform software savings. |
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| 04.01.2022 14:15 |
Infineon announces start of production of new CO2 sensors, providing innovative solution for the growing demand for accurate indoor air quality |
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Munich, Germany, January 4, 2022 – The requirements for good air quality are on the rise especially due to the COVID-19 pandemic. This has resulted in rising demand for sensors that measure the CO2 concentration in the air. Regulations in Asia, Europe, and North America also play a critical role in this regard. In California, for example, every ventilation systems in private homes must be equipped with CO2 sensors. Beginning in mid-January 2022, Infineon Technologies AG will address this growing demand with an innovative CO2 sensor that can be used to monitor indoor air quality and reduce energy costs. Suitable applications include ventilation, air conditioning systems, portable room air monitoring devices and smart speakers. At the Consumer Electronics Show (CES) in Las Vegas, the XENSIV™ PAS CO2 sensor received the CES 2022 Innovation Award Honoree in the “Smart Cities” category. |
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| 04.01.2022 10:15 |
Perfect combination of low power and high performance: Infineon introduces the new AIROC™ CYW20829 Bluetooth® LE system on chip |
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Munich, Germany – 4 January, 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is launching the AIROC™ CYW20829 Bluetooth® LE system on chip (SoC). The AIROC CYW20829 Bluetooth LE SoC is a Bluetooth 5.3 core spec-compliant device for IoT, smart home and industrial applications. With the right combination of low power and high performance, AIROC CYW20829 is designed to support the entire spectrum of Bluetooth Low Energy (LE) use cases for home automation, sensors, lighting, Bluetooth Mesh, remote controls and any other Bluetooth LE-connected IoT application. |
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| 23.12.2021 09:15 |
IR HiRel Returns to Deep Space with James Webb Space Telescope |
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Munich, Germany, and El Segundo, California – 23 December 2021 – Next Saturday, 25 December, NASA plans to launch James Webb Space Telescope (JWST) at 12:20 Coordinated Universal Time (UTC), which is 7:20 am local time at the launch site, 1:20 pm Central European Time, and 4:20 am Pacific Standard Time. European Space Agency (ESA) will provide launch services on an Arianespace Ariane 5 rocket from Europe’s Spaceport in Kourou, French Guiana. IR HiRel, an Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) company, supplied mission-critical radiation-hardened (rad hard) components for JWST. The company previously provided rad hard power electronics for NASA’s first flagship space observatory, the Hubble Space Telescope, launched in 1990. |
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| 22.12.2021 11:15 |
Infineon showcases intelligent, secured IoT solutions and dependable electronics for automotive at CES 2022 |
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Munich, Germany, and Las Vegas, USA – December 22, 2021 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced that at CES 2022 it will “Reimagine Innovation”, showcasing the company’s wide portfolio of IoT, power, security and automotive solutions. Infineon’s exhibits of new, innovative electronics solutions will be shown in the Ballroom San Polo 3405 and 3406, located at The Venetian Hotel, Level 3, Foyer East. Infineon is also participating in digital CES 2022. |
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| 16.12.2021 10:15 |
Improved power density: alpitronic selects Infineon's EasyPACK™ CoolSiC™ modules and EiceDRIVER™ X3 drivers for its 50 kW hypercharger |
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Munich, Germany – 16 December, 2021 – Following the successful launch of the HYC150 and HYC300 of their hypercharger product line, alpitronic recently introduced the state-of-the-art and industry-leading 50 kW DC electric vehicle charger HYC50. It is the first wall-mounted DC charger in this power range featuring two charging ports that allow fast charging of one vehicle at 50 kW or of two vehicles simultaneously at 25 kW each. This is made possible by using EasyPACK™ CoolSiCTM MOSFET 1B and 2B modules from Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) in combination with the EiceDRIVER™ X3.
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