| Press Releases 535 to 540 of 1713 |
 |
| 26.05.2021 10:45 |
APEC 2021: Infineon showcases industry’s broadest range of power solutions from silicon to wide bandgap |
|
San Jose, California – 26 May, 2021 – Building on decades of experience as a power leader, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) will highlight the industry’s broadest range of power management solutions during the 2021 APEC Virtual Conference and Exposition from 14-17 June. With a device portfolio that spans silicon and wide bandgap (WBG) devices, engineers look to Infineon for solutions that balance performance, efficiency, reliability and cost. Infineon’s power solutions set the pace for innovations that make life easier, safer and greener. |
|
|
| 25.05.2021 10:15 |
Samsung chose Infineon for its first MOSFET-based refrigerator inverter design: 600 V CoolMOS™ PFD7 in Samsung’s newly launched refrigerator |
|
Munich, Germany, and Seoul, Korea – 25 May 2021 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) supplied Samsung Electronics Co., Ltd. (FSE: SSUN / OTCQX: SSNLF) with power devices to couple the highest energy efficiency with lowest audible noise. They have been integrated in Samsung’s brand new one-door fridge (RR23A2J3XWX, RR23A2G3WDX) and FDR (French Door Fridge: RF18A5101SR) inverterized refrigerator. Inverterization is an emerging DC to AC conversion trend in contemporary inverter designs. It helps the application run more quietly and smoothly while the average power consumption is reduced compared to a traditional on/off control. |
|
|
| 19.05.2021 10:15 |
Infineon’s new ModusToolbox™ Machine Learning enables TinyML for secure AIoT |
|
Munich, Germany – 19 May 2021 – The combination of AI and IoT, known as the Artificial Intelligence of Things (AIoT), provides machine learning capabilities in connected devices, enabling them to perform intelligent tasks. According to Markets and Markets, the AIoT market is expected to increase from US$5.1 billion in 2019 to US$16.2 billion by 2024, growing at a CAGR of 26 percent. In the company’s latest push to accelerate the development of differentiated AIoT products, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the release of ModusToolbox™ Machine Learning (ML). It enables deep learning-based workloads on Infineon’s PSoC™ microcontrollers (MCUs). |
|
|
| 18.05.2021 13:15 |
Improved road safety: Infineon and Reality AI teach cars how to hear |
|
Munich, Germany – 18 May 2021 – Today's advanced driver assistance systems (ADAS) are based on cameras, radar or lidar. As a result, their target objects need to be within the line of sight to be recognized by the system. This, however, turns into a weakness when it comes to emergency vehicles – they can be heard much earlier than they can be seen and thus are invisible to ADAS for a longer time. To address this challenge, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) together with Reality AI created an advanced sensing solution giving vehicles the sense of hearing. This solution adds XENSIV™ MEMS microphones to existing sensor systems. It enables cars to “see” around the corner and to warn about moving objects hidden in the blind spot or approaching emergency vehicles that are still too distant to see. |
|
|
| 10.05.2021 10:15 |
Infineon launches industry’s highest density QML-V-certified QDR-II+ SRAM to simplify on-system satellite image processing |
|
Munich, Germany – 10 May 2021 – Infineon Technologies LLC, an Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) company, today announced its next-generation 144-Mb Quad Data Rate II+ (QDR®-II+) SRAM that is certified to the DLA Qualified Manufacturers List Class V (QML-V). QML-V is the highest quality and reliability standard certification for aerospace-grade ICs. This radiation-hardened (rad hard) 144-Mb QDR-II+ SRAM is a unique high-speed external cache memory ideal for radar, on-board data processing and networking applications in space. |
|
|
| 06.05.2021 09:00 |
Infineon increases supply security for silicon carbide by expanding the supplier base |
|
Munich, Germany – 6 May 2021 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has concluded a supply contract with the Japanese wafer manufacturer Showa Denko K.K. for an extensive range of silicon carbide material (SiC) including epitaxy. The German semiconductor manufacturer has thus secured more base material for the growing demand for SiC-based products. SiC enables highly efficient and robust power semiconductors that are used in particular in the fields of photovoltaic, industrial power supply, and charging infrastructure for electric vehicles. |
|
|
| |
««
«
88
89
90
91
92
»
»»
|
|
|
|
|
|
