| Press Releases 523 to 528 of 1880 |
 |
| 16.12.2022 08:30 |
New elections for Infineon Supervisory Board – Dr. Wolfgang Eder and Hans-Ulrich Holdenried to leave Board at upcoming Annual General Meeting, Dr. Diess and Klaus Helmrich nominated as successors |
|
Munich, Germany – 16 December, 2022 – In preparation for the Annual General Meeting on 16 February 2023, the Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) Supervisory Board has proposed changes in its own composition to accompany the recent strategic decisions. In this context, Dr. Wolfgang Eder (70), Chairman of the Supervisory Board since 2019, and Hans-Ulrich Holdenried (71) have decided to support the renewal of the Supervisory Board and will resign from the Board at the next Annual General Meeting. Dr. Herbert Diess (64) and Klaus Helmrich (64) are the current candidates to succeed them. Subject to a confirming vote by the Annual General Meeting, Dr. Diess is expected to assume the role of Chairman of the Supervisory Board. |
|
|
| 15.12.2022 16:10 |
Infineon adds PQFN Dual-Side Cooling 25-150 V portfolio to its OptiMOS™ Source-Down power MOSFET family |
|
Munich, Germany – 15 December, 2022 – The design of future power electronic systems is continuously pushed to improve state-of-the-art performance and power density. Supporting this trend, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) launches a new Source-Down 3.3 x 3.3 mm² PQFN product family in the 25-150 V classes with Bottom-Side (BSC) and Dual-Side Cooling (DSC) variants. The new product family provides significant enhancements on the component level to offer attractive solutions in DC-DC power conversion, opening up new possibilities for system innovation in server, telecom, OR-ing, battery protection, power tools, and charger applications. |
|
|
| 12.12.2022 13:45 |
MathWorks Simulink products now support Infineon’s latest AURIX™ TC4x family of automotive microcontrollers |
|
Munich, Germany and Natick, MA – 12 December 2022 – MathWorks and Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced a hardware support package for the MathWorks Simulink® products for Infineon’s latest AURIX™ TC4x family of automotive microcontrollers. Automotive engineers designing advanced electric vehicles, sensor fusion, and radar signal processing functions can use the hardware support package, even before silicon is available. With the package, they can validate use cases, rapidly and automatically generate the embedded software, and test algorithms. |
|
|
| 12.12.2022 11:00 |
Infineon again listed in Dow Jones Sustainability Index |
|
Munich, 12 December 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is one of the most sustainable publicly listed companies worldwide for the 13th consecutive year. As announced by S&P Global, Infineon has once again been included in the Dow Jones Sustainability™ World Index and in the Dow Jones Sustainability™ Europe Index. |
|
|
| 07.12.2022 11:15 |
Infineon named CES 2023 “Innovation Awards Honoree” for three different products: EXCELON™ F-RAM, XENSIV™ CSK and Smart Alarm System |
|
Munich, Germany – 7 December, 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has been named a CES® 2023 “Innovation Awards Honoree” for three products including its EXCELON™ F-RAM, XENSIV™ Connected Sensor Kit (CSK) and Smart Alarm System (SAS) for smart homes. This year’s program received a record high number of over 2,100 submissions. The announcement was made ahead of CES 2023, the world’s most influential technology event, happening 5-8 January in Las Vegas, Nevada. |
|
|
| 01.12.2022 10:15 |
i-ToF imager based on Infineon’s novel pixel technology boosts 3D camera system performance at optimized cost |
|
Munich, Germany – 1 December, 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) in cooperation with 3D Time-of-Flight specialist and premium partner pmdtechnologies is introducing the IRS2975C imager sensor, a performance-push evolution of the IRS2875C. The imager works according to the Time-of-Flight (ToF) principle known as indirect ToF (i-ToF) and is the first in the industry based on Infineon’s latest advancements in pixel technology. Both form factor and the performance of the IRS2975C are tailored to the growing spot iToF applications, delivering highest possible operating range at optimal power budget. The new i-ToF imager is ideal for consumer use cases in smartphones, service robots, drones as well as various IoT devices. |
|
|
| |
««
«
86
87
88
89
90
»
»»
|
|
|
|
|
|
