| Press Releases 493 to 498 of 1713 |
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| 12.11.2021 10:15 |
Toposens introduces new ultrasonic 3D sensor featuring Infineon’s XENSIV™ MEMS microphone |
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Munich, Germany – 12 November, 2021 – Toposens has partnered up with Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) to realize 3D obstacle detection and collision avoidance in autonomous systems using Toposens' proprietary 3D ultrasound technology. The Munich-based sensor manufacturer offers 3D ultrasonic sensors ECHO ONE DK that leverage sound, machine vision, and advanced algorithms to enable robust, cost-effective and accurate 3D vision for applications such as robotics, autonomous driving and consumer electronics. |
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| 10.11.2021 07:33 |
Infineon closes 2021 fiscal year with record quarter; outlook for 2022 confirmed: Revenue growth in mid-teen percentage range and continued improvement in profitability |
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Neubiberg, Germany, 10 November 2021 – Today, Infineon Technologies AG is reporting results for the fourth quarter and for the full 2021 fiscal year, both of which ended on 30 September 2021. |
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| 05.11.2021 10:15 |
Infineon has joined the FiRA™ Consortium as contributor member |
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Munich, Germany – 5 November, 2021 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has joined the FiRa™ Consortium as a Contributor member to support the expansion of the UWB ecosystem. FiRa is dedicated to developing and widely disseminating ultra-wideband (UWB) technology for secured fine ranging and positioning capabilities in a wide range of applications. This allows UWB devices to accurately and securely determine the position of other devices and easily connect infrastructures in the internet of things (IoT), industrial, consumer and smartphone sectors. On top, UWB based products are also already deployed in car access systems. Infineon will make use of the expertise in security, connectivity as well as in microcontrollers to support these goals. |
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| 27.10.2021 10:15 |
Infineon introduces high precision coreless current sensor XENSIV™ TLE4972 for automotive applications |
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Munich, Germany – 27 October, 2021 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) launches its first automotive current sensor: the new XENSIV™ TLE4972. The coreless current sensor uses Infineon’s well-proven Hall technology for precise and stable current measurements. With its compact design and diagnosis modes, the TLE4972 is ideal for xEV applications like traction inverters used in hybrid and battery-driven vehicles, as well as for battery main switches. |
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| 27.10.2021 06:00 |
Shaping the startup ecosystem: Infineon and Hyundai Motor Group to nurture startups focusing on future mobility and digitalization |
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Munich, Germany, Seoul, South Korea and Singapore – October 27, 2021 – Semiconductors are at the core of emerging technologies that enable digital transformation. To amplify startup engagement Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today has signed a memorandum of understanding with Hyundai Motor Group (Hyundai). Under this agreement, Infineon will support startups with product level technical expertise to enhance their success-rate and offer them the opportunity for closer collaboration within Infineon’s Co-Innovation Space in Singapore. The focus is mainly on innovations that are addressing future mobility, smart cities and smart factory applications. |
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| 26.10.2021 10:15 |
Infineon introduces next-generation automotive security controller SLI37 |
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Munich, Germany – 26 October, 2021 – With increasing electrification and connectivity, vehicles are at greater risk of cyberattacks, which can have serious consequences. For this reason, it is crucial that automotive manufacturers provide adequate protection of telematics data. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) therefore introduces the SLI37 automotive security controller: an easy to design in and reliable trust anchor to secure safety-critical automotive applications like 5G-ready eUICC (eCall), V2X communication, car access or SOTA updates. |
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