Press Releases 493 to 498 of 1768
22.04.2022 14:15 Infineon introduces the new IPM series CIPOS™ Tiny IM323-L6G for maximum efficiency and design flexibility
Munich, Germany – 22 April, 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) adds a new member to the CIPOS™ Tiny Intelligent Power Module (IPM) family: the CIPOS Tiny IM323-L6G 600 V 15 A. The new IPM is based on TRENCHSTOP™ IGBT RC-D2 switches and state-of-the-art SOI gate driver technology to realize maximum efficiency and improved reliability, along with minimized system size and cost. The integration of discrete power semiconductors and drivers in one package allows designers to reduce the time and effort spent on design, significantly shortening the time-to-market. The module is suitable for major home appliances, in particular drives for room air conditioners.
14.04.2022 10:15 Infineon’s industry first space-qualified serial interface F-RAM provides 2 Mb density non-volatile storage for extreme environments
Munich, Germany – 14 April 2022 – Infineon Technologies LLC, part of Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), today announced the availability of the space industry’s first radiation-hardened (rad hard), serial interface Ferroelectric RAM (F-RAM) for extreme environments. The new devices deliver unsurpassed reliability and data retention and are more energy efficient than non-volatile EEPROM and serial NOR Flash devices for space applications.
13.04.2022 12:45 Infineon extends CoolSiC™ M1H technology portfolio with 1200 V SiC MOSFETs, using enhanced features for highest system efficiency
Munich, Germany – 13 April 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces a new CoolSiC™ technology: the CoolSiC™ MOSFET 1200 V M1H. The advanced silicon carbide (SiC) chip will be implemented in a widely extended portfolio using the popular Easy module family, along with discrete packages using .XT interconnect technology. The M1H chip offers high flexibility and is suitable for solar energy systems, such as inverters, that have to meet peak demand. The chip is also ideal for applications such as fast EV charging, energy storage systems and other industrial applications.
12.04.2022 10:45 Infineon to expand existing backend operations in Indonesia
Munich, Germany, and Batam, Indonesia – 12 April 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) expands its existing backend operations in Indonesia: PT Infineon Technologies Batam to purchase real estate from PT Unisem, a member of Unisem Group. The premises close to Infineon’s existing backend manufacturing site include manufacturing buildings that will double Infineon’s production area in Batam when fully operational. In the course of this expansion, Infineon’s Batam site will increase its focus on the assembly and test of automotive products.
04.04.2022 09:15 Hyundai Motor Group honors Infineon for supply competence and strategic cooperation for electric cars
Munich, Germany, and Seoul, South Korea - 4 April 2022 - Hyundai Motor Group (HMG) has honored Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) as “Partner of the Year 2021” with the “Special Award for Supply Competence.” The top global automaker recognized Infineon’s efforts to stabilize uncertain supply chains despite the challenges posed by COVID-19 and the global semiconductor shortage.
31.03.2022 11:15 Complete power management solutions for next-generation Intel Xeon processors drive superior performance and energy efficiency in data centers
Munich, Germany – 31 March, 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the launch of a complete power management offering for compute servers based on Intel’s Sapphire Rapids compute processing units (CPU). This new “pick-and-place” solution utilizes several Infineon power management devices and technologies that deliver optimum power efficiency and performance, including XDP™ digital multiphase controllers, OptiMOS™ integrated power stages and OptiMOS IPOL voltage regulator. This offering will help leverage the green potential of data centers.
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