| Press Releases 469 to 474 of 1713 |
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| 07.01.2022 10:00 |
New OptiMOS™ power MOSFET package enables innovative Source-Down technology for PQFN 3.3 x 3.3 mm2 in 25 V to 100 V variants |
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Munich, Germany – 7 January, 2022 – High power density, optimized performance, and ease of use are key requirements when designing modern power systems. To offer practical solutions for design challenges in end applications, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) launches the new generation of OptiMOS™ Source-Down (SD) power MOSFETs. They come in a PQFN 3.3 x 3.3 mm2 package and a wide voltage class ranging from 25 V up to 100 V. This package sets a new standard in power MOSFET performance, offering higher efficiency, higher power density, superior thermal management and low bill-of-material (BOM). The PQFN addresses applications including motor drives, SMPS for server and telecom and OR-ing, as well as battery management systems. |
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| 05.01.2022 15:15 |
Infineon and Deeyook jointly enable precise location solution with low-power Wi-Fi chipset |
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Munich, Germany, and Tel Aviv, Israel – 5 January, 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Deeyook today announced their collaboration on location solutions. The location-as-a-service (LaaS) company has invented and patented an award-winning tracking solution to determine indoor and outdoor locations of items, assets, and employees. Both companies fuse Deeyook’s ultra-precise, innovative algorithms into Infineon’s best-in-class, low power AIROC™ Wi-Fi® portfolio to enable an accurate, passive, ubiquitous, and efficient location solution. |
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| 05.01.2022 10:45 |
First silicon available: Infineon further strengthens leading position as automotive semiconductor supplier with next-generation AURIX™ TC4x |
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Munich, Germany – 5 January, 2022 – As the global market leader in automotive semiconductors, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) continues its innovation path to shape future mobility. The company today announced the extension of its AURIX™ microcontroller family and availability of the first samples of the company’s new AURIX TC4x family of 28 nm microcontrollers (MCUs) for next-generation eMobility, ADAS, automotive E/E architectures and affordable artificial intelligence (AI) applications. |
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| 05.01.2022 10:15 |
Driving automotive innovation: Infineon’s new generation of AURIX™ microcontrollers accelerates electrification and digitalization of the car |
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Munich, Germany, and Las Vegas, Nevada, USA – 5 January 2021 – The future of mobility will be carbon-neutral, autonomous, fully connected and cyber secure. Microelectronics are at the core of this transformation. At CES 2022, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) launches a new generation of its AURIX™ microcontroller family (MCU). The TC4x series fosters the trends of eMobility, advanced driver assists systems (ADAS), automotive electric-electronic (E/E) architectures and affordable artificial intelligence (AI) applications. Furthermore, its scalable family concept allows for a common software architecture enabling significant platform software savings. |
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| 04.01.2022 14:15 |
Infineon announces start of production of new CO2 sensors, providing innovative solution for the growing demand for accurate indoor air quality |
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Munich, Germany, January 4, 2022 – The requirements for good air quality are on the rise especially due to the COVID-19 pandemic. This has resulted in rising demand for sensors that measure the CO2 concentration in the air. Regulations in Asia, Europe, and North America also play a critical role in this regard. In California, for example, every ventilation systems in private homes must be equipped with CO2 sensors. Beginning in mid-January 2022, Infineon Technologies AG will address this growing demand with an innovative CO2 sensor that can be used to monitor indoor air quality and reduce energy costs. Suitable applications include ventilation, air conditioning systems, portable room air monitoring devices and smart speakers. At the Consumer Electronics Show (CES) in Las Vegas, the XENSIV™ PAS CO2 sensor received the CES 2022 Innovation Award Honoree in the “Smart Cities” category. |
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| 04.01.2022 10:15 |
Perfect combination of low power and high performance: Infineon introduces the new AIROC™ CYW20829 Bluetooth® LE system on chip |
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Munich, Germany – 4 January, 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is launching the AIROC™ CYW20829 Bluetooth® LE system on chip (SoC). The AIROC CYW20829 Bluetooth LE SoC is a Bluetooth 5.3 core spec-compliant device for IoT, smart home and industrial applications. With the right combination of low power and high performance, AIROC CYW20829 is designed to support the entire spectrum of Bluetooth Low Energy (LE) use cases for home automation, sensors, lighting, Bluetooth Mesh, remote controls and any other Bluetooth LE-connected IoT application. |
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