| 12.01.2023 07:30 |
Infineon and Resonac announce the expansion of their cooperation and a new multi-year agreement for delivery of silicon carbide (SiC) materials |
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Munich, Germany – 12 January 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is extending its cooperation with silicon carbide (SiC) suppliers. The German-based semiconductor manufacturer has signed a new multi-year-supply and cooperation agreement with Resonac Corporation (formerly Showa Denko K.K.), complementing and expanding the announcement of 2021. The new set of contracts will deepen the long-term partnership on SiC material. According to the agreement, Resonac will supply Infineon with SiC materials for the production of SiC semiconductors, covering a double-digit share of the forecasted demand for the next decade. |
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| 11.01.2023 11:40 |
How technology influences personal health: Infineon highlights smart semiconductor solutions for a health-conscious lifestyle |
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Munich, Germany – 11 January, 2023 – Smart devices not only make life easier and more convenient, they also help us lead a health-oriented lifestyle. Semiconductor solutions from Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) are making the Internet of Things (IoT) an increasingly key component of healthy lifestyles in a variety of ways. |
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| 05.01.2023 13:15 |
Infineon and Green Hills Software collaborate to deliver comprehensive automotive safety and security solutions for the TRAVEO™ T2G MCU families |
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Munich, Germany and Las Vegas, Nevada – 5 January, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Green Hills Software, the worldwide leader in embedded safety and security, will provide a complete ecosystem for the development and deployment of advanced safety applications for the automotive industry. This collaboration combines Infineon’s cutting-edge TRAVEO™ T2G Body and TRAVEO™ T2G Cluster microcontrollers (MCUs) with Green Hills’ comprehensive production-proven software solutions. |
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| 05.01.2023 10:00 |
Infineon TRAVEO™ T2G Cluster and Altia CloudWare™ software platform for display applications to be showcased at CES 2023 |
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Munich, Germany and Las Vegas, Nevada – 5 January, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Altia, an international leader in graphical user interface (GUI) design and development tools, today announced their cooperation. Infineon’s TRAVEO™ T2G Cluster microcontroller (MCU) family will be enabled by the Altia CloudWare™ software platform for display applications in early 2023. A demonstration of the TRAVEO T2G Cluster will be available at Infineon’s booth in the Las Vegas Convention Center West Hall #3829, and a demonstration of Altia’s CloudWare will be showcased in their private suite at CES 2023. |
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| 03.01.2023 15:15 |
16,384 LEDs to revolutionize automotive lighting: Nichia and Infineon launch industry’s first high-definition micro-LED matrix solution |
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Munich, Germany, and Tokushima, Japan – 3 January, 2023 – Automotive LED lighting technology has developed rapidly in recent years as a means for vehicle manufacturers to enhance driving comfort and road safety. In this regard, matrix LED technology for adaptive driving beam has become an important headlight feature for selective road illumination. |
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| 02.01.2023 10:00 |
NuCurrent and Infineon partner for deploying market-leading smart lock and energy harvesting technology |
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Munich, Germany, and Chicago, Illinois – 2 January, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is bringing on NuCurrent, the global authority in wireless power systems, as an Infineon Preferred Partner. This partnership will advance the capabilities and scalability of Near-Field Communication (NFC) technology for energy harvesting and charging applications. Infineon’s NFC tag-side controllers with integrated H-bridge and energy harvesting modules offer a single-chip solution for developing cost-effective, miniaturized actuation or sensing applications operating in passive or active mode. The partnership will incorporate NuCurrent’s overall wireless power systems technology and design capabilities to expand the market via OEMs. |
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