| 01.12.2022 10:15 |
i-ToF imager based on Infineon’s novel pixel technology boosts 3D camera system performance at optimized cost |
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Munich, Germany – 1 December, 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) in cooperation with 3D Time-of-Flight specialist and premium partner pmdtechnologies is introducing the IRS2975C imager sensor, a performance-push evolution of the IRS2875C. The imager works according to the Time-of-Flight (ToF) principle known as indirect ToF (i-ToF) and is the first in the industry based on Infineon’s latest advancements in pixel technology. Both form factor and the performance of the IRS2975C are tailored to the growing spot iToF applications, delivering highest possible operating range at optimal power budget. The new i-ToF imager is ideal for consumer use cases in smartphones, service robots, drones as well as various IoT devices. |
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| 29.11.2022 10:30 |
Infineon launches SLC26P security controller based on 28 nm technology for payment applications; expands its supply option to enable long-term, dependable sourcing for smart card and embedded security ICs |
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Munich, Germany – 29 November, 2022 – Commercial production of integrated circuits using 28 nm technology node began several years ago. As the process technology has matured, market demand for 28 nm products has also increased. Although offering numerous advantages, security applications have not been among the main applications of this technology, thus far. Today, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is introducing SLC26P, the first security IC targeting high volume payment applications based on the future-proof 28 nm technology node. |
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| 28.11.2022 10:00 |
German Federal Printing Office, Fraunhofer and Infineon demonstrate for the first time electronic passport security for the quantum computer era |
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Munich – 28 November 2022 – Quantum computers could become a serious threat to the security of documents such as electronic passports before the present decade is over. New, quantum-secure encryption methods help protect stored biometric data. At Trustech, the event for innovative payment and identification solutions, Infineon Technologies AG, the German Federal Printing Office (Bundesdruckerei GmbH) and the Fraunhofer Institute for Applied and Integrated Security (AISEC) are presenting the world's first demonstrator for an electronic passport that meets the security requirements of the quantum computing era (Post Quantum Cryptography or PQC). |
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| 25.11.2022 13:15 |
Infineon and TSMC to introduce RRAM technology for automotive AURIX™ TC4x product family |
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Munich, Germany – 25 November, 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and TSMC today announced the companies are preparing to introduce TSMC’s Resistive RAM (RRAM) Non-Volatile Memory (NVM) technology into Infineon’s next generation AURIX™ microcontrollers (MCU). |
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| 24.11.2022 10:15 |
Infineon and Fingerprints step into cooperation on the all-in-one solution SECORA™ Pay Bio that will bring biometric payment card to a new level |
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Infineon and Fingerprints step into cooperation on the all-in-one solution SECORA™ Pay Bio that will bring biometric payment cards to a new level
Munich, Germany and Gothenburg, Sweden – 24 November, 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Fingerprint Cards AB
(STO: FING B, Fingerprints™) today announced the signing of a joint development and commercialization agreement of a plug-and-play turnkey solution for biometric payment smart cards. The goal of the cooperation is to make biometric smart card production as simple and easy as producing a standard dual interface payment card. |
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| 23.11.2022 11:15 |
EasyPACK™4B enables single module solution for the world’s largest 352 kW photovoltaic string inverter |
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Munich, Germany – 23 November, 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) recently added EasyPACK™ 4B to its industry-leading Easy power module family. The lead-type of the new family targets applications in photovoltaic string inverters. In this application it can achieve up to 352 kW and allows a significant increase in output power of about 40 percent compared to last generation PV inverter of 250 kW using EasyPACK 3B. The module aims to enable a simpler but more powerful inverter design with higher power density and reduced system costs. The device is ideal for 1500 VDC solar string inverters. |
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