Press Releases 331 to 336 of 1743
27.04.2023 13:15 New EiceDRIVER™ 1200 V half-bridge driver IC family with active Miller clamp for optimized ruggedness in high power systems
Munich, Germany – 27 April, 2023 – Following the introduction of the EiceDRIVER™ 6ED223xS12T 1200 V Silicon-on-Isolator (SOI) 3-phase gate driver family, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is now expanding its portfolio with the EiceDRIVER 2ED132xS12x family. The half-bridge configuration of the driver IC family complements the existing 1200 V SOI series, offering customers more options and design flexibility. The increased output current capability extends the applicability of the portfolio to higher system power levels. The devices offer industry-leading negative VS transient immunity, shoot-through protection, undervoltage lockout and fast overcurrent protection. These features reduce the bill of materials and enable a more rugged design with a compact form factor suitable for high power applications such as commercial HVAC systems, heat pumps, servo drives, industrial inverters, pumps and fans up to 10 kW.
27.04.2023 10:00 Infineon enables innovative solution for second life of electric passenger car batteries
Munich, 27 April 2023 — STABL Energy GmbH uses MOSFETs from Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) to make stationary energy storage systems from retired electric passenger car batteries. The first pilot systems have already been put into operation in Germany and Switzerland. The special advantage of the STABL solution: It can connect discarded batteries with different residual capacities to the public power grid, even in larger quantities, without a central inverter.
26.04.2023 10:15 Infineon and SCHWEIZER extend cooperation in chip embedding to develop more efficient silicon carbide automotive solutions
Munich and Schramberg, Germany – 26 April, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Schweizer Electronic AG (ETR: SCE) are collaborating on an innovative way to further increase the efficiency of chips based on silicon carbide (SiC). Both partners are developing a solution to embed Infineon’s 1200 V CoolSiC™ chips directly onto printed circuit boards (PCB). This will increase the range of electric vehicles and reduce the total system costs.
20.04.2023 10:15 Infineon enables next-generation automotive E/E architectures with industry’s first LPDDR Flash memory
Munich, Germany – 20 April, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today launched the industry’s first LPDDR Flash memory to enable next-generation automotive E/E architectures. The Infineon SEMPER™ X1 LPDDR Flash offers safe, reliable and real-time code execution critical for automotive domain and zone controllers. The device delivers 8 times the performance of current NOR Flash memories and achieves 20 times faster random read transactions for real-time applications. This enables software-defined vehicles to deliver advanced features with enhanced safety and architectural flexibility.
19.04.2023 11:45 Infineon drives decarbonization and digitalization for a greener future with innovative semiconductor solutions at PCIM Europe 2023
Munich, Germany – 19 April, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) offers power solutions such as CoolSiC™ and CoolGaN™ that enable higher energy efficiency. This makes them key to sustainable designs and an important building block for the energy transition. At PCIM Europe 2023, Infineon will showcase how its latest solutions in power semiconductors and wide bandgap technologies provide answers to the current challenges of green and digital transformation. Under the motto “Driving decarbonization and digitalization. Together.”, the company will offer numerous demonstrations, live TechTalks, and the opportunity to discuss design challenges with experts. Alternatively, industry professionals can register for the Infineon's virtual platform, which will be available around the clock from 27 April onwards.
18.04.2023 15:15 PROFET™ Load Guard 12V is powering up automotive ADAS and power distribution with adjustable overcurrent limitation and capacitive load switching mode
Munich, Germany – 18 April, 2023 – Today, almost every new car is equipped with advanced driver assistance systems (ADAS), and the automotive industry is striving for even higher automation. Such safety-critical systems require a dependable and intelligent board net architecture and, in combination with more comfort functionalities, lead to an increasing number of loads. The E/E-architecture therefore requires reliable and intelligent solutions that protect sensitive loads from overcurrent events and ensure fast fault isolation towards the power distribution system.
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