| Press Releases 331 to 336 of 1710 |
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| 17.02.2023 13:00 |
Infineon’s latest SLC38 security device and TrustSEC’s operating system BIO-SLCOS provide secured, open platform for advanced smart card applications |
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Munich, Germany – 17 February, 2023 – In cooperation with Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), TrustSEC, a leader in information security and smart cards, has launched its new advanced smart cards operating system (OS) BIO-SLCOS. The OS uses Infineon's latest high-performance SLC38 Secure Element to provide a secured and open platform that combines the best in security, flexibility, and hardware independence to meet the comfort, performance and security requirements of the global smart card market. The solution is ideally suited for government identification, payment, ticketing and access applications, as well as for application providers looking to enhance their biometric solution in terms of security, performance and functionality. |
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| 17.02.2023 11:10 |
“Driving decarbonization and digitalization. Together.”: At MWC 2023 Infineon is showcasing its latest semiconductor technologies for a comfier and greener IoT |
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Munich, Germany – 17 February, 2023 – IoT technologies have the potential to overcome many of the challenges society faces today. Even more, they improve the quality of life, convenience and increase industrial productivity. At the heart of every IoT solution are microelectronics such as sensors, actuators, microcontrollers, connectivity modules and security components. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) offers all of them and will present these building blocks, complemented by various services, software, and tools, to visitors at Mobile World Congress 2023 in Barcelona, from February 27 to March 2. As a leading semiconductor manufacturer for power systems and IoT solutions, Infineon is working with customers and partners to jointly drive decarbonization and digitalization. |
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| 16.02.2023 18:30 |
Infineon Virtual Annual General Meeting approves dividend of €0.32 per share – Changes to the Supervisory board: Dr. Herbert Diess and Klaus Helmrich succeed Dr. Wolfgang Eder and Hans-Ulrich Holdenried, Dr. Herbert Diess becomes Chairman of the Supervisory Board |
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Munich, Germany – 16 February 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has finished its 23rd Annual General Meeting. The entire event was held in a virtual format and broadcast publicly on the company web site. Shareholders had the opportunity to speak live during the event and ask questions. |
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| 16.02.2023 11:00 |
German President Steinmeier visits Infineon site in Kulim, Malaysia; New exhaust air purification system will significantly improve Infineon's positive climate footprint |
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Munich, Kulim, 16 February 2023 - German President Frank-Walter Steinmeier visited Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) in Kulim, Malaysia, as part of his trip to Asia. The visit focused on Infineon's contribution to enabling the global energy transition with energy-saving semiconductor solutions, as well as by investing in solutions that further reduce the CO2 footprint in its chip manufacturing. |
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| 16.02.2023 09:00 |
Infineon kicks off new Fab in Dresden; Completion planned for 2026; Smart Power Fab will generate 1,000 new jobs |
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Munich, Germany – 16 February, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is starting construction of its new plant for analog/mixed-signal technologies and power semiconductors. After extensive analysis, the Infineon Management Board and supervisory bodies gave the green light for the Dresden site. The German Federal Ministry for Economic Affairs and Climate Action (BMWK) has approved an early project launch, meaning that construction can already begin before completion of the inspection of legal subsidy aspects by the European Commission. Subject to the European Commission's state aid decision and the national grant procedure, the project is to be funded in accordance with the objectives of the European Chips Act. Infineon is seeking public funding of around one billion euros. The company plans to invest a total of approximately five billion euros in the plant, which is set to begin production in 2026. This constitutes the largest single investment in the company's history. |
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| 09.02.2023 11:15 |
Infineon QDPAK and DDPAK top-side cooling packages registered as JEDEC standard for high-power applications |
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Munich, Germany – 9 February, 2023 – The trends toward higher power density and cost optimization dominate the development goals of efficient high-power applications that create substantial value for segments such as electromobility. To push these boundaries, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced it has successfully registered its QDPAK and DDPAK top-side cooling (TSC) packages, which are ideal for high-voltage MOSFETs as a JEDEC standard. This registration further solidifies Infineon’s goal to help establish a broad adoption of TSC in new designs with one standard package design and footprint. Additionally, this provides flexibility and comfort to OEM manufacturers to differentiate their products in the market and take power density to the next level to support various applications. |
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