| Press Releases 325 to 330 of 1710 |
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| 27.02.2023 10:30 |
Infineon’s SECORA™ Connect can make anything a wallet; new technologies will make contactless payment easier in the future |
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Munich, Germany – 27 February, 2023 – Making payments at the beach or while playing sports will become increasingly convenient in the future, as more and more everyday objects such as watches, rings, key fobs and even items of clothing gain the ability to conduct payment transactions. As the market leader for security semiconductors, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is now driving this development forward with its SECORA™ Connect portfolio. New, robust chips whose smallest versions are less than half the size of ladybugs open up unprecedented possibilities for manufacturers to turn even small everyday objects into contactless means of payment. |
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| 24.02.2023 10:15 |
New i-ToF imager enables smallest 3D camera systems with improved quantum efficiency at optimized cost |
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Munich, Germany – 24 February, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), in collaboration with 3D time-of-flight specialist and premium partner pmdtechnologies, introduces the IRS2976C Time of Flight (ToF) VGA sensor, a performance-enhancing evolution of the IRS2877C ToF VGA sensor and novel member of the REAL3™ product family. |
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| 23.02.2023 10:15 |
Infineon presents user-friendly LCC design tool, enabling highly efficient LED driver design |
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Munich, Germany – 23 February, 2023 – Lighting accounts for a significant portion of the world’s total electricity consumption, emphasizing the importance of energy-efficient solutions in this sector. Power factor correction (PFC) plus LCC resonant topology for constant current output has proven to offer outstanding efficiency combined with a large output voltage range in high-power LED lighting applications, such as outdoor and horticultural lighting. However, the high design effort and complexity have been limiting the widespread usage of this well-suited and efficient topology in LED drivers. |
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| 22.02.2023 14:15 |
Infineon’s 256 Mbit SEMPER™ Nano NOR Flash memory enables smaller, power-efficient industrial and consumer electronics |
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Munich, Germany – February 22, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today launched the SEMPER™ Nano NOR Flash memory optimized for battery-powered, small-form-factor electronic devices. Emerging wearable and industrial applications, including fitness trackers, hearables, health monitors, drones, and GPS trackers, enable more with precision tracking, critical information logging, enhanced security, noise cancellation, and more. These advanced capabilities and use cases drive the need for more memory in less space. According to Omdia, the market for Bluetooth-enabled headsets and headphones is expected to grow at a 25 percent CAGR and exceed one billion units by 2024. |
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| 21.02.2023 10:15 |
Improved security for the IoT: NIST selects Ascon as international standard for lightweight cryptography |
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Munich, Germany – 21 February, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced that the U.S. National Institute of Standards and Technology (NIST) has selected the Ascon algorithm developed by Christoph Dobraunig, Maria Eichlseder, Florian Mendel and Martin Schlaeffer as an international standard for lightweight cryptography (LWC). The cryptographic scheme was selected in a multi-stage and multi-year selection process, in which the algorithm turned out to be the strongest and most efficient, partially thanks to the continuous additions made by Infineon cryptologists Mendel and Schlaeffer. |
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| 20.02.2023 18:35 |
New ecosystem partners for AIROC™ CYW5459X portfolio to accelerate design cycle of robust, seamless connection for video and AI edge devices and IoT |
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Munich, Germany – February 20, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced it has added five new platform and module partners to support its proven high performance AIROC™ CYW5459x Wi-Fi and Bluetooth® combo portfolio. Additional partners include module partners AzureWave, Murata Electronics, Quectel Wireless and platform partners NVIDIA and Rockchip Electronics Co. With these new partners, end customers can accelerate development cycle and shorten time-to-market for their end products. |
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