| Press Releases 289 to 294 of 1806 |
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| 23.01.2024 11:00 |
Infineon and Wolfspeed expand and extend multi-year silicon carbide (SiC) 150mm wafer supply agreement |
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Munich, Germany and Durham, N.C. – January 23, 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a global semiconductor leader in power systems and IoT, and Wolfspeed, Inc. (NYSE: WOLF), a global leader in silicon carbide technology, today announced the expansion and extension of their existing long-term 150mm silicon carbide wafer supply agreement, originally signed in February 2018. The extended partnership includes a multi-year capacity reservation agreement. It contributes to Infineon’s general supply chain stability, also with regard to the growing demand for silicon carbide semiconductor products for automotive, solar and EV applications and energy storage systems. |
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| 22.01.2024 15:00 |
Infineon and GlobalFoundries extend long-term agreement with focus on automotive microcontrollers |
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Munich, Germany and Malta, NY, USA – 22 January 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and GlobalFoundries (Nasdaq: GFS) (GF) today announced a new multi-year agreement on the supply of Infineon’s AURIX™ TC3x 40 nanometer automotive microcontrollers as well as power management and connectivity solutions. The additional capacity will contribute to secure Infineon’s business growth from 2024 through 2030. |
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| 17.01.2024 14:15 |
Infineon launches next-generation ZVS flyback converter chipset for advanced USB-C PD adapters and chargers |
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Munich, Germany – 17 January 2024 – The growing popularity of USB-C power delivery (PD) charging increases the demand for compatible chargers. Users now seek powerful yet compact adapters. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) addresses this need with the EZ-PD™ PAG2, a secondary-side controlled ZVS flyback converter chipset. This chipset, comprising EZ-PD PAG2P and EZ-PD PAG2S, integrates USB PD, a synchronous rectifier, and a PWM controller. It ensures efficient communication and isolation between primary and secondary sides using pulse-edge transformer (PET) CYPET121. The chipset supports innovative noncomplementary active-clamp flyback (NCP-ACF) and quasi-resonant flyback with zero voltage switching (QR-ZVS) topologies for enhanced efficiency. This makes it ideal for high-efficiency USB-C adapters, chargers, and travel adapters. |
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| 16.01.2024 10:00 |
One of Japan’s smallest and lightest: Infineon GaN solutions enable new vehicle-to-everything (V2X) charging systems by OMRON Social Solutions |
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Munich, Germany and Tokyo, Japan – 16 January 2024 – The global semiconductor manufacturer and leader in power systems and IoT Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) announced its partnership with OMRON Social Solutions Co. Ltd., a pioneering company in social systems technology. Combining Infineon’s first-class gallium nitride (GaN) based power solutions with the innovative circuit topology and control technology of OMRON now enables one of Japan’s smallest and lightest vehicle-to-everything (V2X) charging systems by OMRON Social Solutions. This partnership will further drive innovation towards wide bandgap materials in power supplies, help to accelerate the transition to renewable energies, a smarter grid, and the adoption of electric vehicles, while fostering decarbonization and digitalization. |
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| 16.01.2024 08:15 |
Imagimob’s visual Graph UX revolutionizes Machine Learning modeling on the Edge |
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Munich, Germany – 16 January 2024 – Imagimob, an Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) company, updates its Imagimob Studio. Users can now visualize their machine learning (ML) modeling workflows and leverage advanced capabilities to develop edge device models better and faster. The latest release of Imagimob’s development platform for AI/ML on edge devices includes the roll-out of a major user experience upgrade. The all-new Graph UX interface is designed to bring greater ease and clarity to the ML modeling process while offering advanced new capabilities such as built-in data collection and real-time model evaluation for Infineon hardware. |
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| 15.01.2024 10:15 |
XENSIV™ stray field robust linear TMR sensor enables high-precision length measurements in industrial and consumer applications |
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Munich, Germany – 15 January 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) combines its proven expertise in magnetic position sensors with its established linearized tunnel magnetoresistance (TMR) technology to launch the XENSIV™ TLI5590-A6W magnetic position sensor. The sensor comes in a wafer-level package and is well suited for linear and angular incremental position detection. The device is qualified for industrial and consumer applications according to the JEDEC standard JESD47K and can be used as a replacement for optical encoders and resolvers. It is well suited for positioning lenses for zoom and focus adjustment in cameras. |
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