| Press Releases 283 to 288 of 1743 |
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| 07.08.2023 14:15 |
Automotive motor control: New MOTIX™ MCU embedded power IC-families with CAN FD interface provide faster communication and higher performance |
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Munich, Germany – 07 August, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the TLE988x and TLE989x families extending the company’s comprehensive and proven portfolio of MOTIX™ MCU embedded power ICs. By integrating a gate driver, microcontroller, communication interface and power supply on a single chip, Infineon’s system-on-chip solutions achieve a minimal footprint. The new TLE988x and TLE989x families offer higher performance and now feature CAN (FD) as the communication interface. The ICs are AEC Q-100 qualified, making them ideal for automotive brushed DC and brushless DC motor control applications in body, comfort, and thermal management applications. |
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| 04.08.2023 10:10 |
Leading Semiconductor Industry Players Join Forces to Accelerate RISC-V |
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Germany – August 4, 2023 – Semiconductor industry players Robert Bosch GmbH, Infineon Technologies AG, Nordic Semiconductor, NXP® Semiconductors, and Qualcomm Technologies, Inc., have come together to jointly invest in a company aimed at advancing the adoption of RISC-V globally
by enabling next-generation hardware development. |
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| 03.08.2023 07:33 |
Strong performance by Infineon in the June quarter. Outlook for the 2023 fiscal year confirmed |
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Neubiberg, 3 August 2023 – Today, Infineon Technologies AG is reporting results for the third quarter of its 2023 fiscal year (period ended 30 June 2023). |
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| 03.08.2023 07:25 |
Infineon to build the world’s largest 200-millimeter SiC Power Fab in Kulim, Malaysia, leading to total revenue potential of about seven billion euros by the end of the decade |
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Munich, Germany – 3 August 2023 – The decarbonization trend will result in strong market growth for power semiconductors, in particular those based on wide bandgap materials. As a leader in Power Systems, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is now taking a further, decisive step to shape this market: By significantly expanding its Kulim fab – over and above the original investment announced in February 2022 – Infineon will build the world’s largest 200-millimeter SiC (silicon carbide) Power Fab. The planned expansion is backed by customer commitments covering about five billion euros of new design-wins in automotive and industrial applications as well as about one billion euros in pre-payments. |
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| 01.08.2023 09:15 |
Bernd Hops, Head of Communications & Public Policy, to leave Infineon |
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Neubiberg, 1 August, 2023 – Bernd Hops, Chief Communications Officer and Head of Communications & Public Policy at Infineon Technologies AG, will leave the company at the end of September at his own request and by best mutual agreement. The succession process has been initiated. |
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| 28.07.2023 11:45 |
Infineon uses recyclable PCBs from Jiva Materials to minimize electronic waste and carbon footprint of demo and evaluation boards |
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Munich, Germany – 28 July, 2023 – With the growing amount of electronic waste generated by consumers, industry and other sectors, it is critical to address this specific environmental issue. Reducing the carbon footprint and promoting sustainability are therefore key to achieving climate goals and improving environmental protection. This is why Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is taking another important step towards a greener future with the introduction of Soluboard®, a recyclable and biodegradable printed circuit board (PCB) substrate based on natural fibers and a halogen-free polymer. The product was developed by UK start-up Jiva Materials and helps to reduce the carbon footprint of the electronics industry. |
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