| Press Releases 241 to 246 of 1727 |
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| 31.10.2023 14:15 |
Infineon and Eatron partner to advance automotive battery management solutions |
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Munich, Germany, and Warwick, UK – 31. October, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Eatron Technologies have signed a partnership to bring advanced machine learning solutions and algorithms to the AURIX™ TC4x microcontroller (MCU). The partnership is aimed at advancing automotive battery management systems (BMS). Thanks to the state-of-the-art machine learning capabilities of the MCU family with integrated parallel processing unit (PPU), Eatron is able to maximize the performance and accuracy of its AI-powered battery management software. |
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| 30.10.2023 14:15 |
Infineon teams with DH-Robotics to launch next-generation electric grippers for an efficient, digital, and low-carbon footprint future |
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Munich, Germany – 30 October, 2023 – Robotic arms bring significant improvements in efficiency and safety to industrial production lines. However, the reliance on traditional pneumatic grippers hinders the realization of a more sustainable and intelligent manufacturing future, requiring innovative solutions. To address this challenge and pave the way for a smarter and greener manufacturing future, DH-Robotics, in collaboration with Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), introduces a groundbreaking series of next-generation electric grippers. |
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| 26.10.2023 10:15 |
Infineon AIROC™ CYW5551x combines Wi-Fi 6/6E performance surpassing standards and advanced Bluetooth connectivity for IoT applications |
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Munich, Germany, and San Jose, California – 26 October, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the company is extending its AIROC™ portfolio with the AIROC CYW5551x Wi-Fi 6/6E and Bluetooth® 5.4 solution. The versatile family delivers secured, reliable 1x1 Wi-Fi 6/6E (802.11ax) connectivity that goes beyond the standard, plus advanced ultra-low power Bluetooth (BT) connectivity. The optimized CYW55512, a dual-band Wi-Fi 6 solution, and CYW55513, a tri-band Wi-Fi 6/6E solution, feature power-efficient designs that are ideal for smart home, industrial, wearables and other small form-factor IoT applications. |
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| 25.10.2023 10:15 |
Infineon announces “XENSIV™ Sleep Quality Service”, a fully integrated hardware and software solution for OEMs to help improve people’s sleep |
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Munich, Germany – 25 October, 2023 – At today’s OktoberTech™ Silicon Valley, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a global semiconductor leader in power systems and IoT, announces the launch of a contactless, privacy-centric sleep quality solution that can be easily integrated into OEM end devices such as bedside lamps, televisions, smart speakers and air purifiers. Leveraging Infineon’s 60GHz Radar, PSoC™ and Wi-Fi technologies, the XENSIV™ Sleep Quality Service is designed to measure and help optimize the user’s sleep based on individual needs. OEMs can now bring their sleep quality enabled end devices to market in up to one third of the time and focus on functionality that leverages their ecosystem to improve users’ quality of life. |
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| 24.10.2023 17:50 |
Infineon completes acquisition of GaN Systems, becoming a leading GaN power house |
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Munich, Germany, and Ottawa, Canada – 24 October 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the closing of the acquisition of GaN Systems Inc. (“GaN Systems”). The Ottawa-based company brings with it a broad portfolio of gallium nitride (GaN)-based power conversion solutions and leading-edge application know-how. All required regulatory clearances have been obtained and GaN Systems has become part of Infineon effective as of the closing. |
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| 24.10.2023 11:00 |
Infineon to pilot new AI developer model by Archetype AI to enhance AI sensor solution innovation |
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Munich, Germany – 24 October 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a global semiconductor manufacturer and leader in power systems and IoT, and Archetype AI, Inc., a pioneer in AI for the physical world, today announced that they have signed a strategic partnership to accelerate the future development of sensor-based chips with AI functionalities that will make life easier, safer and greener. |
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